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Nonmetal heat conductor and manufacturing method thereof

A manufacturing method and technology of heat conductors, applied in the manufacture of non-metallic heat conductors, in the field of non-metallic heat conductors, can solve the problems of reducing material processing fluidity, low product qualification rate, and low thermal conductivity, so as to shorten the processing cycle, The effect of high degree of freedom in structural design and high thermal conductivity

Active Publication Date: 2020-08-11
广州视焓科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, heat dissipation devices made of non-metallic composite materials are generally made of polymer materials, and various types of high thermal conductivity fillers are added to the non-metallic composite materials. However, due to the extremely low intrinsic thermal conductivity of the polymer substrate , so it is necessary to add enough thermally conductive fillers to form a thermally conductive network structure, but adding a large amount of thermally conductive fillers will greatly reduce the processing fluidity of the material, resulting in difficulty in molding and low pass rate of products

Method used

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  • Nonmetal heat conductor and manufacturing method thereof
  • Nonmetal heat conductor and manufacturing method thereof
  • Nonmetal heat conductor and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0078] Step S1, drying 400 parts of thermally conductive filler powder and 60 parts of polymer binder powder in an environment of 65° C. for 4 hours, wherein the polymer binder includes ultra-high molecular weight polyethylene and low density polyethylene, and the mixing ratio of ultra-high molecular weight polyethylene and low-density polyethylene is 1:1. The thermally conductive filler may be spherical graphite, or the thermally conductive filler may be at least one of spherical graphite, flake graphite, expanded graphite or carbon black. In addition, the particle diameter of the spherical graphite is 200 mesh, and the particle diameter of the polymer binder is 500 mesh.

[0079] Step S2, put the powder of dried spherical graphite and the powder of polymer binder into a high-speed mixer, and mix the above-mentioned powder with the high-speed mixer at a speed of 2500r / min for 20 seconds, and repeat the mixing 4 times.

[0080]Step S3, vibrating and filling the uniformly mix...

Embodiment 2

[0083] Step S1, drying 350 parts of thermally conductive filler powder and 70 parts of polymer binder powder in an environment of 70°C for 3 hours, wherein the polymer binder includes ultra-high molecular weight polyethylene and low-density Polyethylene, and the mixing ratio of ultra-high molecular weight polyethylene and low-density polyethylene is 1:2. The thermally conductive filler may be flake graphite, or the thermally conductive filler may be at least one of spherical graphite, flake graphite, expanded graphite or carbon black. In addition, the particle diameter of flake graphite was 150 mesh, and the particle diameter of the polymer binder was 600 mesh.

[0084] Step S2, put the powder of the dried flake graphite and the powder of the polymer binder into the high-speed mixer, and mix the above-mentioned powder with the high-speed mixer at a speed of 2000r / min for 25 seconds, and repeat the mixing 5 times.

[0085] Step S3, vibrating and filling the uniformly mixed po...

Embodiment 3

[0088] Step S1, drying 480 parts of thermally conductive filler expanded graphite powder and 75 parts of polymer binder powder in an environment of 60° C. for 5 hours, wherein the polymer binder includes ultra-high molecular weight polyethylene and Low-density polyethylene, and the mixing ratio of ultra-high molecular weight polyethylene and low-density polyethylene is 1:3. The thermally conductive filler can be expanded graphite, or the thermally conductive filler is at least one of spherical graphite, flake graphite, expanded graphite or carbon black. In addition, the particle size of the expanded graphite is 120 mesh, and the particle size of the polymer binder is 750 mesh. .

[0089] Step S2, put the powder of the dried expanded graphite and the powder of the polymer binder into the high-speed mixer, and mix the above-mentioned powder with the high-speed mixer at a speed of 3000r / min for 15 seconds, and repeat the mixing 3 times.

[0090] Step S3, vibrating and filling t...

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Abstract

The invention provides a nonmetal heat conductor and a manufacturing method thereof. The nonmetal heat conductor is prepared from, by weight, 200-500 parts of heat conduction filler and 50-80 parts ofa polymer binder. The heat conduction filler comprises at least one of spherical graphite, crystalline flake graphite, expanded graphite or carbon black. The nonmetal heat conduction material comprises the following components in percentage by weight: 60%-90% of the heat conduction filler and 40%-10% of the polymer binder. According to the nonmetal heat conductor provided by the invention, materials for manufacturing the nonmetal heat conductor only comprise two components, namely the heat conduction filler and the polymer binder, and auxiliaries such as a flame retardant, a dispersing agentand a plasticizer do not need to be added, so that on one hand, the process difficulty is reduced, the processing period is shortened, the production efficiency of a product is improved, on the otherhand, the types of the materials are reduced, and the production and manufacturing cost of the product is reduced.

Description

technical field [0001] The present application relates to the technical field of non-metal heat dissipation materials, and in particular, relates to a non-metal heat conductor made of non-metal material and a manufacturing method of the non-metal heat conductor. Background technique [0002] The description of the background technology in this application belongs to the relevant technology related to this application, which is only used for illustration and to facilitate the understanding of the application content of this application, and should not be understood as that the applicant clearly believes or presumes that the applicant believes that this application was filed for the first time prior art on the filing date. [0003] In order to ensure the normal operation of electronic components with high reliability for a long time, it is necessary to prevent the continuous rise of the junction temperature of the devices. Therefore, it is necessary to add heat dissipation dev...

Claims

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Application Information

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IPC IPC(8): C04B26/04H05K7/20C04B14/02
CPCC04B26/045H05K7/2039C04B2111/00465C04B14/024C04B14/022
Inventor 万虎冯先强
Owner 广州视焓科技有限公司