Polishing method and device of fine structure

A microstructure and polishing device technology, which is applied to polishing compositions containing abrasives, grinding/polishing equipment, surface polishing machine tools, etc., can solve problems such as the inability to balance surface quality and surface shape accuracy, and achieve easy operation and Effects of maintenance, high reliability, and improved applicability

Active Publication Date: 2020-09-29
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The present invention can realize high-efficiency polishing of fine-structured workpiece 7, overcome the problem that surface quality and surface shape accuracy cannot be taken into account during the polishing process of fine-structured workpieces, and effectively eliminate surface defects

Method used

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  • Polishing method and device of fine structure
  • Polishing method and device of fine structure
  • Polishing method and device of fine structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] refer to figure 1 , Figure 2(a), Figure 2(b) and Figure 4(a), Figure 4(b), Figure 4(c), and use figure 1 The shown apparatus performs shear thickening and chemical synergistic polishing on a rectangular grating waveguide slow wave microstructure workpiece 16 . The rectangular grating waveguide slow-wave microstructure workpiece 16 is the core part of the electric vacuum device of the terahertz radiation source. Its structural length period is 50 μm and has a high aspect ratio. The width and depth of the rectangular grooves are 25 μm and 60 μm, respectively.

[0041] The device for vibrating and polishing the rectangular grid waveguide slow wave microstructure workpiece 16 based on shear thickening and chemical composite effect includes a polishing system, a polishing liquid circulation device, a vibration device and an angle adjustment device.

[0042] The polishing system includes a polishing liquid 8 , a rotating device and a stirring device 15 . The rotary table 9 ...

Embodiment 2

[0053] refer to figure 1 , Figure 3(a), Figure 3(b) and Figure 4(a), Figure 4(b), Figure 4(c), and use the attached figure 1 The illustrated apparatus achieves shear thickening polishing of a V-groove microstructured workpiece 17 . The V-groove microstructure workpiece 17 is used in optical fiber connectors for precise alignment of the core pitch between optical fibers, and its length period is 250 μm, and the V-groove valley depth is 100 μm. Its structure is similar to the device in Example 1, including a polishing system, a polishing liquid circulation device, a vibration device and an angle adjustment device. The difference is that the device for vibrating and polishing the V-groove microstructure workpiece 17 based on shear thickening and chemical compounding effects adjusts the workpiece to a vertical direction during polishing. The method for vibrating polishing a V-groove microstructure workpiece 17 based on shear thickening and chemical composite effects, comprising ...

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Abstract

The invention discloses a polishing method and device of a fine structure. The polishing method and device are realized based on a shear thickening effect and a chemical compounding effect. The devicecomprises a polishing system, a polishing solution circulation device, a vibration device and an angle adjustment device, wherein the polishing solution circulation device is located below the polishing system, the vibration device is located above the polishing system, and the angle adjustment device can adjust a vibration dip angle. According to the method, a chemical corrosion effect and the shear thickening effect of a non-Newtonian fluid polishing solution are utilized to realize corrosion polishing on a workpiece provided with the fine structure; and the surface of the workpiece provided with the fine structure is corroded firstly, the shear thickening effect of the polishing solution under vertical / oblique vibration is utilized to realize polishing of the workpiece provided with the fine structure, and polishing with the highest efficiency is realized by regulating and controlling the vibration dip angle of the workpiece. Through the polishing method and device, efficient polishing of the workpiece provided with the fine structure can be realized, the problem that surface quality and surface shape precision cannot be both considered in the polishing process of the workpieceprovided with the fine structure is overcome, and surface defects can be effectively eliminated. The polished workpiece provided with the fine structure has nanoscale surface roughness and submicronsurface shape precision.

Description

technical field [0001] The invention belongs to the field of ultra-precision machining, and relates to a microstructure polishing method and device, in particular to an efficient processing method and device for microstructure forms such as optical structures, diffuse wave structures, and microfluidic structures. Background technique [0002] Due to its many advantages and functions different from traditional surfaces, the microstructure has a wide range of applications in the fields of optics, national defense, microfluidics and surface engineering. For example: terahertz technology has great application prospects in the fields of communication and security inspection. The slow wave structure of the electric vacuum device as a terahertz radiation source is a typical fine structure; the Fresnel lens with a fine structure can be used in concentrated solar energy systems. Converting light from a relatively large area to a relatively small area effectively reduces the amount of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B31/00B24B31/12B24B31/14B24B41/06B24B1/04C09G1/02
CPCB24B31/003B24B31/12B24B31/14B24B41/06B24B1/04C09G1/02
Inventor 郭江张鹏飞朱志成
Owner DALIAN UNIV OF TECH
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