A plastic package daisy chain circuit structure and testing method based on flip-chip welding

Abstract

A flip-chip-based plastic package daisy chain circuit structure and testing method. Circuit structure: including plastic packaging substrate, chip, flip-chip solder joints, substrate wiring, chip wiring, test pads on the substrate, heat sinks, substrate through holes, and test pads under the substrate; plastic packaging substrates are realized through flip-chip solder joints and chips Link, a number of on-chip wirings are set on the chip; a number of substrate wirings and test pads on the substrate are set on the front of the plastic package substrate, and the substrate wiring is connected to the test pads and flip-chip solder joints on the substrate; There are test pads under the substrate with the same number of pads, and the test pads on the substrate and the test pads under the substrate are interconnected through through holes in the substrate; the heat sink is covered and fixed above the chip and the plastic package substrate. The invention solves the problem that the electric on-off test cannot be performed after the heat sink of the plastic-encapsulated flip-chip welding circuit is mounted, improves the quality of the plastic-encapsulated flip-chip welding process, and ensures the reliability of the plastic-enclosed flip-chip welding circuit.

Description

technical field [0001] The invention relates to a plastic-encapsulated daisy chain circuit structure and a testing method, belonging to the technical field of semiconductor packaging. Background technique [0002] At present, flip-chip bonding technology is the most widely used interconnection technology in the field of high-performance, high-reliability, and high-density packaging. The mechanical and electrical connections between the chip and the substrate are realized by preparing surface arrays and arranging bumps on the active surface of the chip. It has a series of advantages such as high packaging density, fast signal processing speed and high reliability. According to different types of substrates, flip-chip bonding can be divided into ceramic-encapsulated flip-chip bonding and plastic-encapsulated flip-chip bonding. , quality, cost and many other aspects have great advantages, so the development of plastic flip chip technology is the fastest. [0003] With the con...

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is: the present invention provides a plastic package daisy chain circuit structure and testing method based on flip-chip soldering, which is used for plastic package flip-chip soldering process quality verification and long-term reliability evaluation, and is suitable for different sizes and different structures The plastic flip-chip substrate has the characteristics of simple design, wide application, and accurate results. It can effectively characterize the quality of the plastic flip-chip process and solve the problem that the electrical continuity test cannot be performed after the plastic flip-chip circuit heat sink is mounted. Improve the quality of plastic package flip chip welding process and ensure the reliability of plastic package flip chip welding circuit

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