Manufacturing method of preset gold and tin solder for heat sink
A technology of gold-tin solder and manufacturing method, applied in welding/cutting medium/material, welding medium, manufacturing tool, etc., can solve problems such as affecting light extraction efficiency, unable to meet welding requirements and automated mass production requirements, etc., to solve assembly efficiency and assembly accuracy problems, welding efficiency and the effect of improving reliability
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Embodiment 1
[0021] The present invention provides a method for preparing gold-tin solder used for heat sinks, which comprises the following steps in sequence:
[0022] Step (1): sputtering a metal layer on the heat sink, the sputtering conditions are: vacuum degree 0.8Pa, sputtering rate: 15A / s, substrate temperature: 100°C, the metal layer includes a titanium layer and a platinum layer in sequence 1. Gold layer, the sputtering thickness of the metal layer is respectively: 1500A of titanium layer, 2000A of platinum layer, and 500A of gold layer;
[0023] Step (2): On the sputtered metal layer, the first gold layer, the tin layer and the second gold layer are sequentially electroplated to obtain a solder layer. The conditions for electroplating the first gold layer are: bath temperature 50°C, electroplating rate 1500A / min, electroplating thickness: 2.8um, the conditions of electroplating tin layer are: bath temperature room temperature, electroplating rate 3000A / min, electroplating thickn...
Embodiment 2
[0026] The present invention provides a method for preparing gold-tin solder used for heat sinks, which comprises the following steps in sequence:
[0027] Step (1): sputtering a metal layer on the heat sink, the sputtering conditions are: vacuum degree 1.5Pa, sputtering rate: 18A / s, substrate temperature: 125°C, the metal layer includes a titanium layer and a platinum layer in sequence 1. Gold layer, the sputtering thickness of the metal layer is respectively: 1500A of titanium layer, 2000A of platinum layer, and 500A of gold layer;
[0028] Step (2): Electroplate a copper layer on the sputtered metal layer first, the thickness of the copper layer is 65um+ / -10um, then electroplate the first gold layer, tin layer and the second gold layer in sequence to obtain a solder layer, electroplate the second The conditions for a gold layer are: bath temperature 55°C, plating rate 1500A / min, plating thickness: 2.8um, conditions for the electroplating tin layer are: bath temperature room...
Embodiment 3
[0031] The present invention provides a method for preparing gold-tin solder used for heat sinks, which comprises the following steps in sequence:
[0032] Step (1): sputtering a metal layer on the heat sink, the sputtering conditions are: vacuum degree 2.8Pa, sputtering rate: 20A / s, substrate temperature: 150°C, the metal layer includes a titanium layer and a platinum layer in sequence 1. Gold layer, the sputtering thickness of the metal layer is respectively: 1500A of titanium layer, 2000A of platinum layer, and 500A of gold layer;
[0033] Step (2): On the sputtered metal layer, the first gold layer, the tin layer and the second gold layer are sequentially electroplated to obtain a solder layer. The conditions for electroplating the first gold layer are: bath temperature 60°C, electroplating rate 1500A / min, electroplating thickness: 2.8um, the conditions of electroplating tin layer are: bath temperature room temperature, electroplating rate 3000A / min, electroplating thickn...
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