Manufacturing method of preset gold and tin solder for heat sink

A technology of gold-tin solder and manufacturing method, applied in welding/cutting medium/material, welding medium, manufacturing tool, etc., can solve problems such as affecting light extraction efficiency, unable to meet welding requirements and automated mass production requirements, etc., to solve assembly efficiency and assembly accuracy problems, welding efficiency and the effect of improving reliability

Active Publication Date: 2020-10-09
SHIJIAZHUANG HAIKE ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Gold-tin solder is a commonly used package soldering material. With the popularization of automated assembly and the strict requirements on solder thickness for laser flip-chip packaging, the minimum gold-tin solder sheet thickness of 15um mode discrete packaging is used for laser flip-chip welding. , there will be balls formed by solder overflow at the end, which will block the laser light output end and affect the light output efficiency. It can no longer meet the welding requirements and automatic mass production requirements. The mode of presetting the solder gold tin solder to the heat sink came into being. , preset gold tin thickness can be required, preset different thicknesses such as 2-15um

Method used

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  • Manufacturing method of preset gold and tin solder for heat sink

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Effect test

Embodiment 1

[0021] The present invention provides a method for preparing gold-tin solder used for heat sinks, which comprises the following steps in sequence:

[0022] Step (1): sputtering a metal layer on the heat sink, the sputtering conditions are: vacuum degree 0.8Pa, sputtering rate: 15A / s, substrate temperature: 100°C, the metal layer includes a titanium layer and a platinum layer in sequence 1. Gold layer, the sputtering thickness of the metal layer is respectively: 1500A of titanium layer, 2000A of platinum layer, and 500A of gold layer;

[0023] Step (2): On the sputtered metal layer, the first gold layer, the tin layer and the second gold layer are sequentially electroplated to obtain a solder layer. The conditions for electroplating the first gold layer are: bath temperature 50°C, electroplating rate 1500A / min, electroplating thickness: 2.8um, the conditions of electroplating tin layer are: bath temperature room temperature, electroplating rate 3000A / min, electroplating thickn...

Embodiment 2

[0026] The present invention provides a method for preparing gold-tin solder used for heat sinks, which comprises the following steps in sequence:

[0027] Step (1): sputtering a metal layer on the heat sink, the sputtering conditions are: vacuum degree 1.5Pa, sputtering rate: 18A / s, substrate temperature: 125°C, the metal layer includes a titanium layer and a platinum layer in sequence 1. Gold layer, the sputtering thickness of the metal layer is respectively: 1500A of titanium layer, 2000A of platinum layer, and 500A of gold layer;

[0028] Step (2): Electroplate a copper layer on the sputtered metal layer first, the thickness of the copper layer is 65um+ / -10um, then electroplate the first gold layer, tin layer and the second gold layer in sequence to obtain a solder layer, electroplate the second The conditions for a gold layer are: bath temperature 55°C, plating rate 1500A / min, plating thickness: 2.8um, conditions for the electroplating tin layer are: bath temperature room...

Embodiment 3

[0031] The present invention provides a method for preparing gold-tin solder used for heat sinks, which comprises the following steps in sequence:

[0032] Step (1): sputtering a metal layer on the heat sink, the sputtering conditions are: vacuum degree 2.8Pa, sputtering rate: 20A / s, substrate temperature: 150°C, the metal layer includes a titanium layer and a platinum layer in sequence 1. Gold layer, the sputtering thickness of the metal layer is respectively: 1500A of titanium layer, 2000A of platinum layer, and 500A of gold layer;

[0033] Step (2): On the sputtered metal layer, the first gold layer, the tin layer and the second gold layer are sequentially electroplated to obtain a solder layer. The conditions for electroplating the first gold layer are: bath temperature 60°C, electroplating rate 1500A / min, electroplating thickness: 2.8um, the conditions of electroplating tin layer are: bath temperature room temperature, electroplating rate 3000A / min, electroplating thickn...

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Abstract

The invention relates to a manufacturing method of preset gold and tin solder for a heat sink. The manufacturing method comprises the following steps of (1) sputtering a metal layer on the heat sink,wherein the sputtering conditions are as follows: 0.8-5 P of vacuum degree, 15-25 A/s of sputtering rate and 100-200 DEG C of substrate temperature; and the metal layer comprises a titanium layer, a platinum layer and a gold layer successively; (2) electroplating a copper layer to the sputtered metal layer first, and then electroplating a first gold layer, a thin layer and a second gold layer successively to obtain a solder layer; and (3) annealing the electroplated solder layer, wherein the annealing condition is s follows: 250 DEG C, 245 S.

Description

technical field [0001] The invention belongs to the technical field of soldering material processing in the field of packaging, and in particular relates to a method for preparing pre-set gold-tin solder for heat sinks. Background technique [0002] Gold-tin solder is a commonly used package soldering material. With the popularization of automated assembly and the strict requirements on solder thickness for laser flip-chip packaging, the minimum gold-tin solder sheet thickness of 15um mode discrete packaging is used for laser flip-chip welding. , there will be balls formed by solder overflow at the end, which will block the laser light output end and affect the light output efficiency. It can no longer meet the welding requirements and automatic mass production requirements. The mode of presetting the solder gold tin solder to the heat sink came into being. , the thickness of the preset gold tin can be adjusted according to the needs, and different thicknesses such as 2-15um...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/40H01L21/50H01S5/024
CPCB23K35/40H01L21/50H01S5/02469
Inventor 韩建栋王炜智云涛表军
Owner SHIJIAZHUANG HAIKE ELECTRONICS TECH CO LTD
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