A kind of preparation method of silver powder with low heat shrinkage

A shrinkage, silver powder technology, applied in metal processing equipment, transportation and packaging, etc., can solve problems such as the inability to use miniaturized high-reliability circuits, and achieve improved batch stability, intensified ion collision, and improved vibration. solid density and effect
CN111790918BActive Publication Date: 2020-12-22西安宏星电子浆料科技股份有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
西安宏星电子浆料科技股份有限公司
Publication Date
2020-12-22

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Abstract

The invention provides a method for preparing silver powder with low thermal shrinkage rate. Silver powder particles are obtained by adding silver nitrate aqueous solution and reducing agent solution to dispersant aqueous solution at the same time. Mutual impact, collision, friction and shearing are used to smooth and disperse the surface of the silver powder. Finally, the high-energy pulse current is used to provide high energy in a very short time, which promotes the recrystallization of the silver powder at a lower temperature and in a faster way, improving the silver powder. Crystal defects and no agglomeration of silver powder particles. The thermal shrinkage rate of the silver powder prepared by the present invention is not more than 5% at 700°C, and has good sphericity and dispersibility, the particle size D100 is not greater than 5 μm, and the tap density is not less than 4g / cm 3 , has broad application prospects in the field of miniaturized and high-reliability circuits.
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Description

technical field

[0001] The invention belongs to the technical field of metal powder manufacture, and in particular relates to a method for preparing silver powder with low heat shrinkage rate for electronic paste. Background technique

[0002] Electronic paste is a mixed system of solid particles composed of powdered conductive metal, inorganic or polymer binder suspended in an organic carrier and an organic liquid. This fluid material is applied to electronic components by printing and other methods to form modules with specific electrical functions, and is the basic material of various electronic components.

[0003] According to different sintering temperatures, electronic paste can be divided into low-temperature curing type and high-temperature sintering type. The low-temperature curing type paste shrinks and crimps the conductive filler through the curing of the resin, thereby ensuring the conduction of the circuit; the high-temperature sintering type paste volatilize...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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