Polycrystalline silicon wafer surface texturing device based on ferromagnetic abrasion technology

Abstract

The invention discloses a polycrystalline silicon wafer surface texturing device based on a ferromagnetic abrasion technology, and belongs to the technical field of semiconductor processing. Accordingto the scheme, the two sides of the movable grinding iron block are filled with the passivation solvent through the conveying guide pipes in sequence. Therefore, the movable grinding iron block is promoted to continuously move left and right in the texturing storage box, the polycrystalline silicon wafer is polished by means of the abrasion iron block contained in the movable polishing iron block. Meanwhile, the bottom end of the abrasion iron block is gradually passivated by means of a passivation solvent. Therefore, a layer of compact ferroferric oxide film is formed at the bottom of the abrasion iron block. Along with continuous polishing, the ferroferric oxide film can be gradually ground into powder, on one hand, the texturing efficiency of the polycrystalline silicon wafer can be improved, and on the other hand, the falling of the ferroferric oxide film at the bottom of the abrasion iron block in the polycrystalline silicon wafer can be accelerated to form magnetic powder, so that the abrasion iron block can be continuously passivated, and the texturing efficiency of the upper surface of the polycrystalline silicon wafer is further improved along with the increase of the magnetic powder.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to a polycrystalline silicon chip surface texturing device based on ferromagnetic abrasion technology. Background technique [0002] Chips made of silicon wafers are known as "magic operators" with amazing computing power. No matter how complicated the mathematical, physical and engineering problems are, and no matter how heavy the calculation workload is, the staff only need to solve the problem through the computer keyboard. Tell it, and issue the ideas and instructions to solve the problem, and the computer can tell you the answer in a very short time. In this way, the computer may only need a few minutes to solve the problems that take years or decades to calculate manually. It can be solved, and even some problems that cannot be calculated by manpower, the computer can quickly tell you the answer. [0003] The chip is also a modern miniature "knowledge base". ...

AI Technical Summary

Problems solved by technology

[0004] At present, in the process of processing semiconductor silicon wafers, it is necessary to texture the surface of silicon wafers. In traditional texturing, the surface of semiconductor silicon wafers is usually oxidized to form a layer of silicon dioxide film. Pickling, so as to realize the texturing of semiconductor silicon wafers, but the silicon contained in the consumed silicon dioxide is not easy to be reused, which reduces the utilization rate of silicon

Images