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High-temperature-resistant high-resilience electromagnetic shielding conductive foam and preparation process thereof

A technology of electromagnetic shielding and conductive foam, which is applied in the field of conductive foam, can solve the problems of easy oxidation of conductive coatings, labor-intensive, high density, etc., achieve good electromagnetic shielding effect, reduce labor costs, and improve production efficiency.

Inactive Publication Date: 2020-11-03
苏州华捷电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, the preparation of metal foil is difficult, easy to wrinkle, and has a high density; fabric shielding materials cannot be rubbed, stretched, washed, etc.; conductive coatings are easily oxidized, and are easy to settle during transportation and storage
After the above materials are made into electromagnetic shielding devices, they need to be manually pasted into electronic products for application, and automatic placement cannot be achieved, which not only consumes manpower, but also has low efficiency

Method used

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  • High-temperature-resistant high-resilience electromagnetic shielding conductive foam and preparation process thereof
  • High-temperature-resistant high-resilience electromagnetic shielding conductive foam and preparation process thereof
  • High-temperature-resistant high-resilience electromagnetic shielding conductive foam and preparation process thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] A high temperature resistant high resilience electromagnetic shielding conductive foam, comprising a base material layer 100 and a metallized polyimide film layer 200 coated on the surface of the base material layer 100, the metallized polyimide film layer 200 includes The inner surface is attached to the polyimide film layer 201 on the surface of the base material layer 100, and the outer surface of the polyimide film layer 201 is compounded with a first metal coating 202, and the first metal coating 202 is away from the polyimide film layer 201 The outer surface of the copper plating layer 203 is compounded with the second metal plating layer 204 on the outer surface of the copper plating layer 203 away from the first metal plating layer 202 .

[0036] Wherein, a protective film 205 is attached to the inner surface of the second metal plating layer 204 , and the adhesive surface of the protective film 205 is attached to the outer surface of the copper plating layer 203...

Embodiment 2

[0038] A high-temperature-resistant high-resilience electromagnetic shielding conductive foam differs from Example 1 in that the second metal coating 204 is a tin coating, and the first metal coating 202 is a nickel coating, a nickel-cobalt alloy coating or a nickel-iron alloy coating.

Embodiment 3

[0040] A high-temperature-resistant high-resilience electromagnetic shielding conductive foam is different from Embodiment 1 in that the second metal coating 204 is a gold coating, and the first metal coating 202 is a nickel coating, a nickel-cobalt alloy coating or a nickel-iron alloy coating.

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PUM

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Abstract

The invention discloses high-temperature-resistant high-resilience electromagnetic shielding conductive foam and a preparation process thereof. The electromagnetic shielding conductive foam comprisesa base material layer and a metal-plated polyimide film layer wrapping the surface of the base material layer, the metal-plated polyimide film layer comprises a polyimide film layer with the inner surface attached to the surface of the base material layer, and the inner surface of the polyimide film layer is attached to the surface of the base material layer; a first metal coating is compounded onthe outer surface of the polyimide film layer, a copper coating is compounded on the outer surface, away from the polyimide film layer, of the first metal coating, and a second metal coating is arranged on the outer surface, away from the first metal coating, of the copper coating. Compared with a traditional electromagnetic shielding device, the conductive foam is better in high temperature resistance, better in elasticity, lower in resistivity and better in electromagnetic shielding effect, and particularly, the conductive foam can be welded to a circuit board or a circuit board through theSMT technology, so that the problem that manpower is consumed by manual attachment is solved, the labor cost is reduced, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of conductive foam, in particular to a high-temperature resistant high-resilience electromagnetic shielding conductive foam and a preparation process thereof. Background technique [0002] In modern life, a series of electronic products such as mobile phones and computers have become an indispensable part of people, and the harm of electromagnetic radiation to the human body has also become the focus of attention, so the demand for high-energy electromagnetic shielding devices is also increasing. [0003] At present, the relevant electromagnetic shielding parts on the market are mainly processed by metal foil, fabric shielding material, conductive material, etc., and wrapped in foam to play the role of conductive shielding and shock resistance. Among them, the preparation of metal foil is difficult, easy to wrinkle, and has a high density; fabric shielding materials cannot be rubbed, stretched, washed, etc.;...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B5/18B32B27/06B32B25/20B32B25/08B32B27/28B32B33/00B32B3/26B32B7/12B32B37/00B32B38/00H05K9/00
CPCB32B5/18B32B27/065B32B25/20B32B25/08B32B27/281B32B33/00B32B3/26B32B7/12B32B37/00B32B38/0036H05K9/0088B32B2038/0076B32B2266/0207B32B2457/00B32B2307/51B32B2307/306B32B2307/212
Inventor 向涛
Owner 苏州华捷电子有限公司