High-temperature-resistant high-resilience electromagnetic shielding conductive foam and preparation process thereof
A technology of electromagnetic shielding and conductive foam, which is applied in the field of conductive foam, can solve the problems of easy oxidation of conductive coatings, labor-intensive, high density, etc., achieve good electromagnetic shielding effect, reduce labor costs, and improve production efficiency.
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Embodiment 1
[0035] A high temperature resistant high resilience electromagnetic shielding conductive foam, comprising a base material layer 100 and a metallized polyimide film layer 200 coated on the surface of the base material layer 100, the metallized polyimide film layer 200 includes The inner surface is attached to the polyimide film layer 201 on the surface of the base material layer 100, and the outer surface of the polyimide film layer 201 is compounded with a first metal coating 202, and the first metal coating 202 is away from the polyimide film layer 201 The outer surface of the copper plating layer 203 is compounded with the second metal plating layer 204 on the outer surface of the copper plating layer 203 away from the first metal plating layer 202 .
[0036] Wherein, a protective film 205 is attached to the inner surface of the second metal plating layer 204 , and the adhesive surface of the protective film 205 is attached to the outer surface of the copper plating layer 203...
Embodiment 2
[0038] A high-temperature-resistant high-resilience electromagnetic shielding conductive foam differs from Example 1 in that the second metal coating 204 is a tin coating, and the first metal coating 202 is a nickel coating, a nickel-cobalt alloy coating or a nickel-iron alloy coating.
Embodiment 3
[0040] A high-temperature-resistant high-resilience electromagnetic shielding conductive foam is different from Embodiment 1 in that the second metal coating 204 is a gold coating, and the first metal coating 202 is a nickel coating, a nickel-cobalt alloy coating or a nickel-iron alloy coating.
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