Low-density high-thermal-conductivity pouring sealant

A low-density, potting glue technology, applied in the field of potting glue, can solve the problems of high density of potting glue, increased weight of electronic components, and restrictions on the wide application of electronic components, so as to improve flame retardancy, reduce density, The effect of improving compatibility and binding ability

Inactive Publication Date: 2020-11-03
深圳市宝力新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above technical defects, the applicant believes that the potting glue obtained by the invention has a high density, which

Method used

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  • Low-density high-thermal-conductivity pouring sealant
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  • Low-density high-thermal-conductivity pouring sealant

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] Low density, high thermal conductivity potting compound made from ingredients consisting of the following weights:

[0051] Vinyl silicone oil: 156kg;

[0052] Hydrogen silicone oil: 3 parts;

[0053] Dodecyltrimethoxysilane: 10kg;

[0054] Low density powder: 48kg;

[0055] Thermal powder: 20kg;

[0056] Flame retardant powder: 18kg;

[0057] Platinum catalyst: 0.1kg;

[0058] Simethicone oil: 18kg;

[0059] Among them, the heat-conducting powder is made of aluminum nitride, aluminum hydroxide and aluminum oxide in a mass ratio of 2:1:3, the flame-retardant powder is magnesium hydroxide, and the low-density powder is plastic microspheres.

[0060] The preparation method of the above-mentioned low-density high-thermal-conduction potting glue comprises the following steps:

[0061] S1. Put aluminum nitride, aluminum hydroxide, aluminum oxide and magnesium hydroxide into a ball mill and mix them, then mix them with vinyl silicone oil, hydrogen-containing silicone oil...

Embodiment 2

[0064] Low density, high thermal conductivity potting compound made from ingredients consisting of the following weights:

[0065] Vinyl silicone oil: 185kg;

[0066] Hydrogen silicone oil: 14 parts;

[0067] Vinyltrimethoxysilane: 5kg;

[0068] Low density powder: 34kg;

[0069] Thermally conductive powder: 25kg;

[0070] Flame retardant powder: 21kg;

[0071] Platinum catalyst: 0.2kg;

[0072] Simethicone oil: 29kg;

[0073] Among them, the heat-conducting powder is made of aluminum nitride and aluminum hydroxide mixed at a mass ratio of 2:3, the flame-retardant powder is magnesium hydroxide, and the low-density powder is hollow silica microspheres.

[0074] The preparation method of the above-mentioned low-density high-thermal-conduction potting glue comprises the following steps:

[0075] S1. Put aluminum nitride, aluminum hydroxide and magnesium hydroxide into a ball mill and mix them, and then mix them with vinyl silicone oil, hydrogen-containing silicone oil, vin...

Embodiment 3

[0078] Low density, high thermal conductivity potting compound made from ingredients consisting of the following weights:

[0079] Vinyl silicone oil: 162kg;

[0080] Hydrogen silicone oil: 8 parts;

[0081] Octyltrimethoxysilane: 2kg;

[0082] Low density powder: 43kg;

[0083] Thermal powder: 31kg;

[0084] Flame retardant powder: 25kg;

[0085] Platinum catalyst: 0.3kg;

[0086] Simethicone oil: 24kg;

[0087] Among them, the heat-conducting powder is made of aluminum nitride, aluminum hydroxide and aluminum oxide mixed in a mass ratio of 1:1:3, the flame-retardant powder is magnesium hydroxide, and the low-density powder is hollow glass microspheres.

[0088] The preparation method of the above-mentioned low-density high-thermal-conduction potting glue comprises the following steps:

[0089] S1. Put aluminum nitride, aluminum hydroxide, aluminum oxide and magnesium hydroxide into a ball mill and mix them, then mix them with vinyl silicone oil, hydrogen-containing si...

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Abstract

The invention relates to the technical field of pouring sealants, and discloses a low-density high-thermal-conductivity pouring sealant, which is prepared from the following raw materials in parts byweight: 156-185 parts of vinyl silicone oil; 3-14 parts of hydrogen-containing silicone oil; 2-10 parts of a surface modifier; 34-48 parts of low density powder; 20-31 parts of heat conduction powder;18-25 parts of flame retardant powder; 0.1-0.3 part of a platinum catalyst; and 18-29 parts of an auxiliary agent. The low-density powder is adopted as a reinforcing filler, so that the density of the pouring sealant can be reduced, when the pouring sealant is applied to electronic components, the proportion of the pouring sealant in the electronic components can be reduced, and wide applicationof the electronic components is guaranteed.

Description

technical field [0001] The present invention relates to the technical field of potting glue, more specifically, it relates to low density and high thermal conductivity potting glue. Background technique [0002] As electronic equipment, logic circuits, etc. tend to be miniaturized and dense, potting adhesives used for bonding, sealing and coating protection of electronic components are also constantly improving their performance, and have become an important part of the electronic device manufacturing industry. An important insulating material that is indispensable in the field. [0003] Related technologies, such as Chinese Invention Patent Application Publication No. CN109266301A discloses a silicone potting compound and its preparation method. The organosilicon potting compound includes in parts by mass: double-ended vinyl silicone oil, 100 parts; hydrogen-containing silicone oil, 25 to 60 parts; vinyl MQ silicone resin, 10 to 30 parts; cage octaphenylsilsesquioxane, 5 t...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J183/05C09J11/08C09J11/04C09J11/06
CPCC08K2003/2224C08K2003/2227C08K2003/282C08K2003/387C08K2201/014C08L2201/02C08L2203/206C08L2205/025C08L2205/035C09J11/04C09J11/06C09J11/08C09J183/04C08L83/04C08K13/06C08K9/04C08K9/08C08K7/28C08K3/22C08K3/28C08K5/5419C08K5/5425C08K3/38
Inventor 张伟林左斌文贺风兰
Owner 深圳市宝力新材料有限公司
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