Production method of high-hardness silica sol used for grinding and polishing

Abstract

The invention relates to a production method of high-hardness silica sol used for grinding and polishing. The production method comprises the following steps: preparing a silica sol hydrate, reforminggrinding crystals, carrying out superfine grinding on the grinding crystals, and harvesting the high-hardness silica sol used for grinding and polishing. According to the method, a gas separant and agas lubricant are introduced into high-purity silica sol to generate a silica sol hydrate, then abrasive seed crystals with particle sizes of 0.5-5 microns are added, a part of silicon dioxide colloidal particles in the silica sol hydrate are crystallized and recrystallized at a certain pressure and a certain temperature, and the abrasive seed crystals are partially dissolved, so reforming of thethe grinding crystals is realized; and then, superfine grinding and cooling degassing are conducted, and finally, the high-hardness silica sol for grinding and polishing is obtained. The method is unique and stable in process and high in operability; the produced high-hardness silica sol can meet various requirements; no pollution is caused to the environment in the production process, and energyconservation and environmental protection are achieved; and good economic benefits can be obtained for enterprises while positive social benefits are provided.

Description

technical field [0001] The invention relates to a production method of high-hardness silica sol for grinding and polishing, and belongs to the technical field of production and preparation of grinding and polishing materials. Background technique [0002] Silica sol has high-strength adhesion and high temperature resistance, and is an excellent adhesive and color-enhancing filler for architectural decorative coatings. At the same time, silica sol also has good wear resistance, polishing and filling properties, so it is also widely used in various materials. Surface flattening and polishing, such as ultra-fine grinding and polishing of various chips in the electronics industry. [0003] In the prior art, examples of fine polishing of silica sol applied to various materials can retrieve a number of patent application documents, such as: [0004] Invention patent application "a sapphire polishing liquid and its preparation method" (application number: 201810235033.2) for polis...

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Problems solved by technology

[0007] Examining the above-mentioned patent documents, it can be found that although the prior art has carried out research and practical applications on the application of silica sol to ultrafine grinding and polishing, and also provides various methods for the preparation of silica sol used in ultrafine grinding and polishing, However, in the process of using silica sol as grinding and polishing, there is little in-depth research on how to improve the efficiency of grinding and polishing, and there is no specific method for how to improve the hardness of silica sol. However, as an abrasive , the hardness and shape of the abrasive particles and the internal structure of the abrasive particles are directly related to the applicability of the abrasive polishing agent and the efficiency of grinding and polishing.

[0008] Although, in some patent documents, such as the invention patent "polydisperse large particle size silica sol and its preparation method" (application number: 201610382474.6), the invention patent "a method for preparing silicon controlled silicon sol with particle size" (application number: 201610157738.8 ), it is proposed that the hardness or size of silica sol particles can be increased by adding seeds to silica sol. However, in these methods, the added seeds are usually monodisperse spherical dioxide particles with a particle size of 20-30 nm. Silica sol seeds, because the seed particles themselves are small, inevitably have the characteristics of sol, low hardness, low grinding and polishing efficiency, that is, the hydration film layer on the surface of the particles is thick, the grinding and polishing effect is poor, and the grinding and polishing cannot be effectively improved. Therefore, the grinding and polishing silica sol provided by the prior art cannot meet the needs of ultrafine grinding and polishing, and has become one of the bottlenecks affecting silica sol as an ultrafine grinding and polishing material

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