Silicon wafer acid cutting method adopting double-state circulation enrichment technology

Abstract

The invention discloses a silicon wafer acid cutting method adopting a double-state circulation enrichment technology, and belongs to the technical field of silicon wafer processing. According to thescheme, by means of double-state change of water in a modified cutting steel rope, the hydrophilicity of the modified cutting rope can be changed from hydrophobicity; by refrigerating the modified steel rope, after water in a double-state circulation enrichment ball is frozen, by means of volume expansion of the water, a metal outer convex piece on the outer side of an outer ball wrapping frame can be supported, and the roughness degree of the surface of the double-state circulation enrichment ball is improved; on one hand, by means of the low-temperature characteristic of the frozen water, high-temperature volatile acid gas and water vapor can be promoted to be gradually liquefied on the surface of a steel rope body easily; and on the other hand, by means of supporting of the metal outerconvex piece, the hydrophilicity of the surface of the double-state circulation enrichment ball can be improved, therefore, the enrichment amount of volatile acid on the surface of the double-state circulation enrichment ball can be increased, the dripping possibility of the volatile acid is reduced, and then the cutting effect of the modified steel rope on a large silicon wafer can be improved.

Description

Technical field [0001] The invention relates to the technical field of silicon wafer processing, and more specifically, to an acidic cutting method for silicon wafers using a two-state cycle enrichment technology. Background technique [0002] The chip made of silicon is a famous "divine operator" with amazing computing power. No matter how complicated mathematical problems, physical problems and engineering problems are, or how heavy the workload of calculation is, the staff only need to use the computer keyboard to solve the problem. Tell it, and give out ideas and instructions to solve the problem, and the computer can tell you the answer in a very short time. In this way, the computer may only take a few minutes to calculate the problems that take years and decades. It can be solved, and even for some problems that humans cannot calculate the result, the computer can quickly tell you the answer. [0003] The chip is also a modern miniature "knowledge base". It has a fabulous s...

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Problems solved by technology

[0004] At present, when a large silicon wafer is initially cut, it needs to be divided into multiple small silicon wafers, so as to facilitate its fine cutting. The method usually used in the prior art is multi-line acid etching cutting, but in During the actual application process, the acid etchant may drip from the cutting wire, which is easy to corrode the large silicon wafer

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