Ridge-shaped substrate integrated waveguide band-pass filter based on TSV

A substrate-integrated waveguide and bandpass filter technology, which is applied to waveguide devices, electrical components, circuits, etc., can solve the problems of large volume and small bandwidth of integrated waveguide bandpass filters, so as to improve chip performance and shorten the interconnection time. The effect of long connection length and low cost

Active Publication Date: 2020-11-13
河北鹏博通信设备有限公司
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Problems solved by technology

[0005] The purpose of the present invention is to provide a ridge substrate integrated waveguide bandpass filter based on TSV, which solves the problem that the existing i

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  • Ridge-shaped substrate integrated waveguide band-pass filter based on TSV
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  • Ridge-shaped substrate integrated waveguide band-pass filter based on TSV

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Embodiment Construction

[0022] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0023] A kind of ridge substrate integrated waveguide bandpass filter based on TSV of the present invention, refer to figure 1 and figure 2 , including a high-resistance silicon substrate 1, two rectangular metal grooves A are embedded inside the high-resistance silicon substrate 1, and eight pairs of rectangular diaphragms 10 are arranged on both sides of the metal groove A, and the diaphragm and the metal groove A The sidewalls are composed of through-silicon holes, and a resonator is formed between adjacent diaphragms. During the propagation of electromagnetic waves in the cavity, a larger cut-off frequency is obtained through multiple reflections; for high-frequency electromagnetic waves, the loss is reduced, while low-frequency The electromagnetic wave attenuates quickly to realize the high-frequency filtering of the filter. The more ...

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Abstract

The invention discloses a ridge-shaped substrate integrated waveguide band-pass filter based on a TSV. The filter comprises a high-resistance silicon substrate, two rectangular metal grooves A are formed in the high-resistance silicon substrate; a plurality of pairs of diaphragms are arranged on the two sides in the metal groove A; the side walls of the diaphragm and the metal groove A are formedby arranging silicon through holes; the top surface insulating layer is arranged at the top of the high-resistance silicon substrate, the rectangular metal groove B is embedded into the top surface insulating layer, the ridge surface metal layer is arranged in the middle of the bottom of the top surface insulating layer, the adjacent side walls of the two rectangular metal grooves A are connectedthrough the ridge surface metal layer, and the other two side walls of the two rectangular metal grooves A are connected through the rectangular metal groove B. The manufacturing process of the ridge-shaped substrate integrated waveguide band-pass filter based on the TSV is compatible with the CMOS process, and the manufacturing cost is low; the size is small, the filter can be conveniently integrated in a miniaturized chip, stacked chip interconnection is realized, the length of an interconnection line is shortened, and the chip performance is greatly improved; and the filter is large in bandwidth and can be applied to the microwave/radio frequency field.

Description

technical field [0001] The invention belongs to the technical field of electronic devices, and relates to a ridge substrate integrated waveguide bandpass filter based on TSV. Background technique [0002] In the 5G era, in microwave and millimeter wave systems, filters are required to have high Q values ​​and low loss coefficients, so waveguide filters are widely used. Rectangular waveguide filters are a widely used traditional form of transmission line for microwave signal guidance and processing. With the rapid development of science and technology, the circuit system is bound to develop in the direction of miniaturization and high function integration. The huge size of the rectangular waveguide filter makes it impossible to integrate in the planar circuit, and the problems of electromagnetic compatibility and electromagnetic interference cannot be ignored. Compared with the traditional rectangular waveguide filter, the structure of the substrate integrated waveguide filt...

Claims

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Application Information

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IPC IPC(8): H01P1/208
CPCH01P1/2088
Inventor 王凤娟李玥任睿楠余宁梅杨媛朱樟明尹湘坤
Owner 河北鹏博通信设备有限公司
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