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Brazing method for high-purity aluminum target assembly and high-purity aluminum target assembly

A brazing method and aluminum target technology, which is applied in the field of target welding and sputtering targets, can solve the problems of easy deformation of target components and target deformation, and achieve the advantages of small deformation, not easy to fall off, and high product quality Effect

Active Publication Date: 2022-07-15
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] CN111421258A discloses a welding method for a high-purity aluminum target. The welding method includes the following steps: (1) assembling the high-purity aluminum target and a back plate into a sheath and sealing the sheath; (2) Vacuumize and degas the sealed package in turn, and then perform the first welding; (3) After the first welding is completed, remove the package, and perform the second welding on the high-purity aluminum target and the back plate, but the The method is prone to the problem of target deformation during the welding process
In the present invention, the welding surface of the target blank is machined, and plane threads are formed on the welding surface, and the tooth profile of the plane threads is triangular; on the one hand, the roughness, uniformity and adhesion of the welding surface can be increased through the plane threads, and on the other hand On the one hand, the tooth shape of the plane thread is triangular. When the target blank and the back plate are welded, the plane thread can be embedded into the back plate, which improves the welding bonding force, but this method still does not solve the target deformation during the welding process. The problem
[0007] Therefore, it is necessary to develop a welding method for high-purity aluminum targets to solve the problem that the target components are prone to deformation during the welding process of the prior art

Method used

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  • Brazing method for high-purity aluminum target assembly and high-purity aluminum target assembly
  • Brazing method for high-purity aluminum target assembly and high-purity aluminum target assembly
  • Brazing method for high-purity aluminum target assembly and high-purity aluminum target assembly

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Effect test

Embodiment 1

[0062] This embodiment provides a brazing method for a high-purity aluminum target assembly, and the brazing method includes the following steps:

[0063] (1') Polishing the welding surface of the high-purity aluminum target (99.999wt%) and the welding surface of the backing plate until the roughness Ra of the welding surface of the high-purity aluminum target is 0.4 μm, and the welding surface of the backing plate has a roughness Ra of 0.4 μm. The roughness is 0.4μm;

[0064] (2') The solder is placed in the groove of the high-purity aluminum target, and after assembling the high-purity aluminum target and the back plate, brazing and welding are performed at 240 ° C to obtain a welded assembly;

[0065] Wherein, the material of the back plate is C18000, such as figure 1 As shown, the back plate 2 includes a base and a boss arranged on the welding surface of the base; the welding surface of the high-purity aluminum target 1 is provided with a groove; the diameter of the groov...

Embodiment 2

[0068] This embodiment provides a brazing method for a high-purity aluminum target assembly, and the brazing method includes the following steps:

[0069] (1') Polishing the welding surface of the high-purity aluminum target (99.9995wt%) and the welding surface of the back plate until the roughness Ra of the welding surface of the high-purity aluminum target is 1.5 μm, and the welding surface of the back plate is The roughness is 0.8μm;

[0070] (2') The solder is placed in the groove of the high-purity aluminum target, and after assembling the high-purity aluminum target and the back plate, brazing and welding are performed at 200 ° C to obtain a welded assembly;

[0071] Wherein, the material of the back plate is C18000, the back plate includes a base and a boss arranged on the welding surface of the base; the welding surface of the high-purity aluminum target is provided with a groove; the diameter of the groove is larger than The diameter of the boss is 0.01mm larger; the...

Embodiment 3

[0074] This embodiment provides a brazing method for a high-purity aluminum target assembly, and the brazing method includes the following steps:

[0075] (1') Polishing the welding surface of the high-purity aluminum target (99.99 wt %) and the welding surface of the backing plate until the roughness Ra of the welding surface of the high-purity aluminum target is 0.8 μm, and the welding surface of the backing plate has a roughness Ra of 0.8 μm. The roughness is 0.5μm;

[0076] (2') The solder is placed in the groove of the high-purity aluminum target, and after assembling the high-purity aluminum target and the back plate, brazing and welding are performed at 190 ° C to obtain a welded assembly;

[0077] Wherein, the material of the back plate is C18000, the back plate includes a base and a boss arranged on the welding surface of the base; the welding surface of the high-purity aluminum target is provided with a groove; the diameter of the groove is larger than The diameter ...

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Abstract

The present invention provides a brazing method for a high-purity aluminum target assembly and a high-purity aluminum target assembly. The brazing method for the high-purity aluminum target assembly includes arranging grooves in the high-purity aluminum target and placing a groove on the back plate. The boss is set on the top, and the back plate made of C18150 or C18000 is selected, which can not only ensure the welding bonding rate of the back plate and the high-purity aluminum target, but also can effectively surface the deformation during the welding process, and the high-purity aluminum after welding. The target component has no water leakage, and the application prospect is excellent.

Description

technical field [0001] The invention relates to the technical field of sputtering targets, in particular to the technical field of target welding, and in particular to a brazing method for a high-purity aluminum target assembly and a high-purity aluminum target assembly. Background technique [0002] Metal sputtering targets are materials used as cathodes in sputter deposition techniques. The cathode material is redeposited on the anode surface in the form of molecules, atoms or ions that detach from the cathode under the impact of positively charged cations in the sputter station. Since metal sputtering targets are often relatively expensive materials such as high-purity aluminum, copper, titanium, nickel, tantalum, and precious metals, relatively common materials are often used as the backplane during their manufacture. The back plate plays the role of supporting the target, cooling, and reducing costs. Commonly used materials are aluminum alloy (ALBP), copper alloy (CUBP...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K1/00B23K1/20B23K3/00B23K3/08
CPCB23K1/0008B23K1/20B23K3/00B23K3/085B23K3/08
Inventor 姚力军边逸军潘杰王学泽章丽娜
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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