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Novel copper surface roughness etching stabilizer and preparation method thereof

A stabilizer and roughness technology, applied in chemical/electrolytic methods to remove conductive materials, printed circuit manufacturing, printed circuits, etc., can solve copper surface poor oxidation resistance, low roughness uniformity, oxidation blackening, etc. problem, to achieve the effect of improving the uniformity of roughness and inhibiting self-decomposition

Pending Publication Date: 2020-12-11
罗山县金硕电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing PCB copper surface processing is mostly formic acid + stabilizer double-dose copper surface etching agent, and the copper surface roughness is not high
After the corrosion treatment of the copper surface corrosion stabilizer, when the micro-etching amount is 20UM, the copper surface roughness can only reach RA: 0.1-0.15, RZ: 1.0-1.3, the copper surface has poor oxidation resistance, and the copper surface bites When the corrosion stabilizer is output in the rough liquid tank, the copper surface of the carrier will immediately appear oxidized and blackened; the roughness uniformity of the copper surface corrosion stabilizer is poor. Only achieves 70% uniformity
[0004] In summary, the chemical copper surface treatment of PCB process has insufficient roughness, poor oxidation resistance, and low roughness uniformity.

Method used

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  • Novel copper surface roughness etching stabilizer and preparation method thereof
  • Novel copper surface roughness etching stabilizer and preparation method thereof
  • Novel copper surface roughness etching stabilizer and preparation method thereof

Examples

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Embodiment 1

[0025] A new copper surface roughness bite stabilizer, comprising the following components by mass fraction, sulfuric acid 8%, hydrogen peroxide 6%, diethylene glycol 1%, cyclohexylamine 2%, 2-methylimidazole 1%, 2% of 5-aminotetrazole, 2% of 5-amino-1-methyltetrazole, 78% of deionized water.

[0026] The preparation method is as follows: S1) weigh each component according to the mass fraction; S2) add deionized water, cyclohexylamine, 2-methylimidazole, 5-aminotetrazole, 5-amino-1- Methyl tetrazole, then slowly add sulfuric acid, stir evenly, add diethylene glycol and hydrogen peroxide, stir evenly to obtain the finished product; the stirring speed is 50-60 times / min.

Embodiment 2

[0028] A novel copper surface roughness bite stabilizer, comprising the following components by mass fraction, sulfuric acid 5%, hydrogen peroxide 5%, propylene glycol butyl ether 0.5%, cyclohexylamine 2.5%, 2-methylimidazole 1%, 5% - Aminotetrazole 1%, 5-amino-1-methyltetrazole 1%, deionized water 84%.

[0029] The preparation method is as follows: S1) weigh each component according to the mass fraction; S2) add deionized water, cyclohexylamine, 2-methylimidazole, 5-aminotetrazole, 5-amino-1- Methyl tetrazole, then slowly add sulfuric acid, stir evenly, add propylene glycol butyl ether and hydrogen peroxide, stir evenly to obtain the finished product; the stirring speed is 50-60 times / min.

Embodiment 3

[0031] A new copper surface roughness bite stabilizer, comprising the following components by mass fraction, sulfuric acid 7%, hydrogen peroxide 2%, diethylene glycol 1%, diethanolamine 3%, 2-methylimidazole 1%, 5% - Aminotetrazole 1%, 5-amino-1-methyltetrazole 1%, deionized water 84%.

[0032] The preparation method is as follows: S1) weigh each component according to the mass fraction; S2) add deionized water, propylene glycol butyl ether, 2-methylimidazole, 5-aminotetrazole, 5-amino-1- Methyl tetrazole, then slowly add sulfuric acid, stir evenly, add diethylene glycol and hydrogen peroxide, stir evenly to obtain the finished product; the stirring speed is 50-60 times / min.

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PUM

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Abstract

The invention discloses a novel copper surface roughness etching stabilizer and a preparation method thereof. The etching stabilizer comprises 3-10% of sulfuric acid, 3-8% of hydrogen peroxide, 0.5-1%of a hydrogen peroxide stabilizer, 1-3% of a corrosion inhibitor, 3-5% of a micro-etching stabilizer and 75-90% of deionized water. By adding the stabilizer, self-decomposition of hydrogen peroxide in the etching stabilizer can be remarkably inhibited, the use stability of the etching stabilizer is improved, and the shelf life of the etching stabilizer is prolonged; and by adding N-containing heterocyclic compounds, effective adsorption can be carried out at a place with high current density during etching, so that metal ions favorably deposit at a place with low current density, and a concave part of a plate surface is leveled.

Description

technical field [0001] The invention relates to the technical field of copper surface etching agents, in particular to a novel copper surface roughness etching stabilizer and a preparation method thereof. Background technique [0002] Printed circuit boards are the provider of electrical connections for electronic components. With the development of electronic products in the direction of lighter, smaller and thinner, PCBs are also required to develop in a direction of higher density and miniaturization, and high-density and miniaturized Printed circuit boards require more miniaturization of PCB lines, and the miniaturization of lines is closely related to the thickness of surface copper. The thicker the copper thickness, the more difficult it is to achieve finer lines. [0003] The existing PCB copper surface processing is mostly formic acid + stabilizer double-dose copper surface etching agent, and the copper surface roughness is not high. After the corrosion treatment of...

Claims

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Application Information

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IPC IPC(8): C23F1/18H05K3/06
CPCC23F1/18H05K3/067
Inventor 朱德甫
Owner 罗山县金硕电子材料有限公司
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