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A kind of high thermal conductivity magnesium matrix composite material reinforced by graphite and preparation method thereof

A composite material and high thermal conductivity technology, applied in the field of high thermal conductivity magnesium-based composite materials and their preparation, can solve problems such as low thermal conductivity, and achieve the effects of low cost, easy large-scale production and application, and short process flow

Active Publication Date: 2022-01-14
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The technical purpose of the present invention is mainly to solve the problem of low thermal conductivity of the current traditional magnesium alloy, and to develop a magnesium-based composite material with high thermal conductivity through graphite reinforcement phase and powder metallurgy molding process. The method combines natural flake graphite with After magnesium powder is mixed with another metal powder, graphite-reinforced magnesium-based composite materials are prepared through a series of processes, and magnesium-copper alloy precipitates are formed on the copper surface. thermal conductivity

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  • A kind of high thermal conductivity magnesium matrix composite material reinforced by graphite and preparation method thereof
  • A kind of high thermal conductivity magnesium matrix composite material reinforced by graphite and preparation method thereof
  • A kind of high thermal conductivity magnesium matrix composite material reinforced by graphite and preparation method thereof

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Effect test

Embodiment 1

[0025] 1.5 g of graphite (50 mesh natural flake graphite) was mixed with alcohol at a mass ratio of 1:20, and then ultrasonicated for 60 min to obtain a graphite suspension. Stir and mix 24.0 g of 300-mesh magnesium powder and 4.5 g of 300-mesh copper powder in alcohol, then add graphite suspension, mix and evaporate to dryness to obtain a composite powder of 5wt.% GFs / Mg-15Cu. Put the composite powder into a metal mold and preheat it to 300°C, and then briquette it. After grinding and removing the oxide skin on the surface of the block, put the block into an extrusion mold and preheat it to 350°C. After holding the heat for 15 minutes, extrude the block into a rod with an extrusion ratio of 10 to obtain 5wt.% GFs / Mg-15Cu composite material. The room temperature thermal diffusivity of the material is 86.2mm 2 / s, the thermal conductivity is 154.0W / (m·K).

Embodiment 2

[0027] 3.0 g of graphite (50 mesh natural flake graphite) was mixed with alcohol at a mass ratio of 1:20 and then ultrasonicated for 60 min to obtain a graphite suspension. Stir and mix 22.5 g of 300 mesh magnesium powder and 4.5 g of 300 mesh copper powder in alcohol, add graphite suspension, mix and evaporate to dryness to obtain a mixed powder of 10wt.% GFs / Mg-15Cu composite material. The mixed powder is put into a metal mold and preheated to 300°C, and then pressed into a block. After grinding and removing the oxide skin on the surface of the block, put the block into an extrusion mold and preheat it to 350°C. After holding the heat for 15 minutes, extrude the block into a rod with an extrusion ratio of 10 to obtain 10wt.% GFs / Mg-15Cu composite material. The room temperature thermal diffusivity of the material is 87.5mm 2 / s, the thermal conductivity is 154.5W / (m·K).

Embodiment 3

[0029] Take 6.0 g of graphite (50 mesh natural flake graphite) and alcohol mass ratio of 1:15 and mix it with ultrasound for 60 min to obtain graphite suspension. 19.5g of 300-mesh magnesium powder and 4.5g of 300-mesh copper powder were stirred and mixed in alcohol, then graphite suspension was added, mixed and evaporated to dryness to obtain a mixed powder of 20wt.% GFs / Mg-15Cu composite material. The mixed powder is put into a metal mold and preheated to 300°C, and then pressed into a block. After grinding and removing the oxide skin on the surface of the block, put the block into an extrusion mold and preheat it to 350°C. After holding the heat for 15 minutes, extrude the block into a rod with an extrusion ratio of 10 to obtain 20wt.% GFs / Mg-15Cu composite material. The room temperature thermal diffusivity of the material is 94.8mm 2 / s, the thermal conductivity is 165.4W / (m·K). Figure 6-Figure 7 The cross-sectional view of Cu particles in 20wt.% GFs / Mg-15Cu obtained i...

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Abstract

A graphite-reinforced magnesium-based composite material with high thermal conductivity and a preparation method thereof relate to the field of thermal conductivity and preparation of magnesium-based composite materials. The components and mass percentages of the magnesium-based composite material with high thermal conductivity provided by the present invention are: copper powder The content is 4-25%, the graphite sheet content is 4-25%, and the rest is magnesium powder. The high-thermal-conductivity graphite-reinforced magnesium-based composite material of the present invention is realized through the following technical solutions: fully mixing various components to prepare a composite powder, and obtaining the composite material through briquetting and extrusion processes. The invention has a simple process, a short process, and the composite material has the advantages of high thermal conductivity and low density, and can be applied to electronic packaging, special components of 3C electronic products, and signal communication parts, etc. Alloy application potential.

Description

technical field [0001] The invention relates to the field of heat conduction and preparation of magnesium-based composite materials, and relates to the development of a high-heat-conduction magnesium-based composite material reinforced by graphite and a preparation method thereof. Background technique [0002] In recent years, with the continuous deepening of industrial development, new requirements have been put forward in the fields of aerospace, automobiles, and communication devices. Large-scale integrated circuits are widely used in various fields. Small volume, high integration, and high power have become various The development direction of electronic components. However, high integration greatly reduces the heat dissipation space of the device, so that the power density of the device increases sharply, waste heat gathers in the small space inside the device, local temperature is too high, heat flow is unevenly distributed, and heat dissipation problems such as high h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C1/05C22C1/10C22C23/00C22C32/00
CPCC22C1/05C22C1/0408C22C23/00C22C32/0084
Inventor 杜文博祁振东孟繁婧杜宪李淑波刘轲王朝辉
Owner BEIJING UNIV OF TECH