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Thermal conducting silicone polymer composition

A composition and polymer technology, applied in coatings, adhesives, additive processing, etc., can solve the problems of affecting the elastomer properties of thermal interface materials, reducing the fluidity of composite materials, and high adhesion layer thickness.

Pending Publication Date: 2021-01-05
MOMENTIVE PERFORMANCE MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although high thermally conductive filler loadings in silicone compositions increase the overall bulk thermal conductivity of the interface material, high filler loadings often lead to issues such as reduced composite flow, resulting in higher bond line thickness (BLT)
In addition, this low flow also affects the elastomeric properties of the thermally conductive interface material, as it increases the hardness of the silicone composite once cured, which deteriorates the moldability and long-term reliability of the interface material

Method used

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  • Thermal conducting silicone polymer composition
  • Thermal conducting silicone polymer composition
  • Thermal conducting silicone polymer composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0129]Example 1: Diphenylsulfone functionalized polyorganosiloxane with terminal allyloxy ether groups (A1)

[0130]In a nitrogen environment, in a three-necked round bottom flask equipped with a reflux condenser, dropping funnel and mechanical stirrer, allyloxydiphenyl sulfone (16.9g, 0.051mol) and Karstedt catalyst (5ppm 2wt% Pt ) In a toluene (100 mL) solution, add polydimethylsiloxane (334.52 g, 0.151 mol) with terminal hydride groups (Hyd equivalent 0.952) dropwise within 30 min. Increase the reaction temperature to 85°C and continue until all hydride peaks change from1H-NMR disappeared. The resulting allyloxy ether-terminated polymer was vacuum stripped at 150 degrees Celsius for 3 hours to remove volatile compounds and solvents. The obtained product is a high viscosity liquid. (GPC: Mn=12392, PDI-1.8; viscosity: 6Pa.S).

Embodiment 2

[0131]Example 2: Diphenylsulfone functionalized polyorganosiloxane with terminal hydride groups

[0132]At 75℃, to the toluene (150mL) solution of allyloxydiphenyl sulfone (25g, 0.076mol) and Karstedt catalyst (0.09g, 5ppm2wt% Pt), the terminal hydride was added dropwise within 30 minutes Group (hydride equivalent 0.952) polydimethylsiloxane (334.52g, 0.151mol). Then the reaction temperature was increased to 85°C and continued until all the allyl peaks changed from1H-NMR disappeared. The resulting hydride-terminated polymer was vacuum stripped at 150 degrees Celsius for 3 hours to remove volatile compounds and solvents. The obtained product is a low-viscosity liquid. (GPC: Mn= 3069 g / mol, PDI-1.7; viscosity: 0.33 Pa.S).

Embodiment 3

[0133]Example 3 (A2): Diphenylsulfone functionalized polyorganosiloxane with terminal vinyl groups

[0134]To the reaction mixture of hydride-terminated diphenylsulfone functionalized polyorganosiloxane (71.9 g) (obtained in Example 3), toluene (30 mL) and platinum catalyst (5 ppm 2% Pt) was added 1,3 -Divinyltetramethyldisiloxane (8.88g, 0.048mol) and reflux at 110 degrees Celsius. Continue the reaction until all hydride signals change from1H-NMR disappeared. Finally, the resulting polymer was vacuum stripped at 150 degrees Celsius for 3 hours to remove volatile compounds and solvents. The final product obtained is a low-viscosity liquid. (GPC: Mn=5014 g / mol, PDI-1.9; viscosity: 0.56 Pa.S).

[0135]Preparation of thermally conductive silicone composition

[0136]Purchase alumina filler with a size of 0.3-110 microns from Sumitomo. Purchase boron nitride fillers with sizes ranging from 5 to 400μ from Momentive Performance Materials.

[0137]By mixing vinyl-terminated dimethylsiloxane copolymer ...

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Abstract

Provided is a polymer having a siloxane polymer backbone and compositions comprising the same. The polymers comprise a cyclic unsaturated group (Z3) within the siloxane polymer backbone. The polymershave been found to exhibit good thermal conductivity and may find utility in a variety of applications.

Description

Technical field[0001]The present invention relates to a silicone polymer and a composition containing the same. In particular, the present invention relates to a functionalized siloxane polymer containing an unsaturated cyclic moiety, which exhibits good thermal stability and thermal conductivity.Background technique[0002]As modern electronic devices become faster, smaller and thinner, advanced thermal conductive materials are used at the interface of different heating components (such as transistors, IC chips, engine control units, microprocessors, etc.) become more and more important. Such materials dissipate heat into the atmosphere, enabling high-density and highly integrated electronic devices to operate smoothly. In order to effectively dissipate heat from electronic components, various thermally conductive silicone compositions have been used for many years. Most of these thermally conductive silicon compositions are composed of organopolysiloxane as a binder and thermally co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/14C09D183/14C09J183/14C08G77/52B33Y70/10
CPCC08G77/52C08L83/14C09D183/14C09J183/14B33Y70/10C08K3/22C08K3/38C08K9/06C08K3/08C08K3/013C08K2003/385C08K2003/2227C08K2201/011C08L83/04C08L2203/204C08L65/02C08K3/28C08K7/16C08K2201/001C08K2201/005C08L2203/02C08L2203/16C08L2203/202C08L71/12
Inventor 普拉纳比什·杜塔维努·克里什南·阿普库坦桑迪普·奈克安布哈雅·萨克塞纳
Owner MOMENTIVE PERFORMANCE MATERIALS INC