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Low-thermal-expansion transparent polyimide film and preparation method thereof

A technology of transparent polyimide and polyimide film, which is applied in the direction of instruments, identification devices, etc., and can solve the problems of device display accuracy reduction, layer-to-layer peeling, etc.

Active Publication Date: 2021-01-08
CHANGCHUN INST OF APPLIED CHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the size of the substrate changes too much at high temperature, internal stress will be generated between the material layer interfaces, resulting in a decrease in device display accuracy and peeling between layers during bending

Method used

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  • Low-thermal-expansion transparent polyimide film and preparation method thereof
  • Low-thermal-expansion transparent polyimide film and preparation method thereof
  • Low-thermal-expansion transparent polyimide film and preparation method thereof

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preparation example Construction

[0119] The present invention also provides a method for preparing the above-mentioned transparent polyimide film with high strength and low thermal expansion, comprising the following steps:

[0120] The dianhydride monomer and the diamine monomer are polycondensed and then imidized to obtain polyimide;

[0121] The dianhydride monomer has a structure shown in formula VII:

[0122]

[0123] in At least one selected from the following amide-containing structural groups:

[0124]

[0125] R 1 , R 2 , R 3 , R 4 independently selected from hydrogen, alkyl, cycloalkyl, fluoroalkyl, ester or halo; preferably -H, -F, CH 3 or -CF 3 ;

[0126] The diamine monomer has a structure shown in formula VIII:

[0127] h 2 N-Ar 2 -NH 2 Formula VIII

[0128] —Ar 2 - selected from one of the structural groups shown in formula II to formula IV:

[0129]

[0130] In formula II, R 5 for

[0131] R 6 selected from hydrogen, alkyl, cycloalkyl, fluoroalkyl, ester or halo;...

Embodiment 1

[0192] Add 2.27g of diamine compound (1), 3.20g of 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl, 80.0g of dimethylacetamide to the reaction vessel, at 20°C, Stir to dissolve. Add 2.34g of dianhydride compound (8) and 6.66g of 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride in sequence, polymerize for 24 hours, and test the rotational viscosity to reach 4.0×10 4 mPa / s, forming the precursor solution of transparent polyimide. Test its logarithmic viscosity.

[0193] Add 10.20 g of acetic anhydride and 5.05 g of triethylamine to this precursor solution, and carry out chemical imidization reaction for 2 h. After imidization is completed, a polyimide solution is obtained. This solution was slowly poured into ethanol. A white filamentary precipitate precipitated. The filamentous precipitate was filtered off and dried. Obtain transparent polyimide resin, test its number average molecular weight and weight average molecular weight.

[0194] Dissolve this resin in N-...

Embodiment 2

[0196] Add 4.14 g of diamine compound (2), 10.02 g of 2,2-bis(4-aminophenyl)hexafluoropropane, and 90 g of N-methylpyrrolidone into the reaction vessel, stir and dissolve at 20°C. Add 3.43g of dianhydride compound (7) and 6.72g of cyclohexanetetracarboxylic dianhydride in sequence, polymerize for 24 hours, and test the rotational viscosity to reach 4.2×10 4 mPa / s, forming the precursor solution of transparent polyimide. Test its logarithmic viscosity.

[0197] Add 20.0 g of acetic anhydride and 10.1 g of triethylamine to this precursor solution, and carry out chemical imidization reaction for 2 h. After imidization is completed, a polyimide solution is obtained. This solution was slowly poured into ethanol. A white filamentary precipitate precipitated. The filamentous precipitate was filtered off and dried. Obtain transparent polyimide resin, test its number average molecular weight and weight average molecular weight.

[0198] Dissolve this resin in N-methylpyrrolidone ...

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Abstract

The invention provides a high-strength low-thermal-expansion-coefficient colorless transparent polyimide film, which is based on a polyimide molecular structure containing an amide structure, whereinthe prepared polyimide containing the amide structure can form an intermolecular hydrogen bond to form a hydrogen bond cross-linked network, and through the strong intermolecular interaction, the transparent polyimide can show high modulus, high strength and low thermal expansion coefficient while the transparency of the polyimide is reserved, so that the transparent film can be used in the fieldof transparent films needing bending resistance, such as the application fields of flexible display cover plate materials, substrate materials and the like.

Description

technical field [0001] The invention belongs to the technical field of flexible display, and in particular relates to a low thermal expansion transparent polyimide film and a preparation method thereof. Background technique [0002] Flexible display technology is an important development direction in the field of flat panel display. Flexible, flexible, and thin flexible display devices, such as flexible organic light-emitting diode (OLED) displays, flexible solar cells, etc., have become an essential element of high-tech products in the field of consumer electronics. Flexible display devices replace glass materials with polymer film materials to achieve thinner, lighter and more flexible displays. [0003] At present, colorless and transparent polyimide materials are required for the cover and substrate materials of flexible displays. The wholly aromatic polyimide obtained by the polycondensation reaction of the commonly used aromatic tetracarboxylic dianhydride and aromat...

Claims

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Application Information

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IPC IPC(8): C08G73/10C08K3/36C08J5/18C08L79/08G09F9/30
CPCC08G73/1075C08G73/1078C08G73/1039C08G73/1042C08G73/1007C08K3/36C08J5/18G09F9/301C08J2379/08C08K2201/011
Inventor 郭海泉杨正慧康传情周云春高连勋
Owner CHANGCHUN INST OF APPLIED CHEMISTRY - CHINESE ACAD OF SCI