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Material box type silicon wafer transfer mechanism

A silicon wafer and box-type technology, applied in conveyor objects, photovoltaic power generation, electrical components, etc., can solve problems such as pollution, waste of resources, damage, etc., to improve the quality of silicon wafers, reduce waste of resources, and improve transfer efficiency.

Pending Publication Date: 2021-01-15
苏州映真智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the processing and production of crystalline silicon solar cells, silicon wafers for solar cells need to be transferred between different processing stations. When the station is transferred to another station, the suction cup can transfer a piece of silicon wafer to the conveyor belt once, and the grabbing efficiency is low. When the suction cup grabs and transfers the silicon wafer in contact with the conveyor belt, various uncontrollable factors are likely to cause belt marks on the silicon wafer. , cracking, damage, scratches, pollution and other quality problems, some defective products need to be scrapped directly, resulting in waste of resources, and some defective products need to be downgraded, affecting the power generation efficiency and service life of finished solar cells

Method used

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  • Material box type silicon wafer transfer mechanism
  • Material box type silicon wafer transfer mechanism
  • Material box type silicon wafer transfer mechanism

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Embodiment Construction

[0022] In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined. All directional indications (such as up, down, top, bottom, vertical, horizontal...) in the embodiments of this application are only used to explain the relative positional relationship between the components in a certain posture (as shown in the attached figure) , sports conditions, etc., if the specific posture changes, the directional indication also changes accordingly. The terms "first", "second" and so on are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, the terms "first", " A second, etc. feature may explicitly or implicitly include one or more of these features. Furthermore, the terms "include" and "have", as well as any variations thereof, are intended to cover a non-exclusive inclu...

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PUM

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Abstract

The invention discloses a material box type silicon wafer transfer mechanism which comprises a silicon wafer separation module, a silicon wafer transfer module and a silicon wafer conveying module, and is characterized in that the silicon wafer separation module transfers stacked silicon wafers in a material box to the silicon wafer transfer module one by one; the silicon wafers are conveyed to the silicon wafer transfer module through a first ultrasonic suspension conveying belt in a suspended mode and are conveyed to a lower-section station by a second ultrasonic suspension conveying belt. According to the material box type silicon wafer transfer mechanism, the non-contact type conveying of the material box type solar cell silicon wafers is achieved, the transferring efficiency of transferring the material box type silicon wafers is improved, the problems of cracking, damage, scratching, pollution and the like of the silicon wafers can be effectively avoided, the quality of the silicon wafers is improved, resource waste is reduced, and the material box type silicon wafer transfer mechanism is compact in structure and small in occupied space.

Description

technical field [0001] The invention relates to a silicon wafer transfer mechanism, in particular to a magazine-type silicon wafer transfer mechanism. Background technique [0002] In the processing and production of crystalline silicon solar cells, silicon wafers for solar cells need to be transferred between different processing stations. When the station is transferred to another station, the suction cup can transfer a piece of silicon wafer to the conveyor belt once, and the grabbing efficiency is low. When the suction cup grabs and transfers the silicon wafer in contact with the conveyor belt, various uncontrollable factors are likely to cause belt marks on the silicon wafer. , cracking, damage, scratches and pollution and other quality problems, some defective products need to be scrapped directly, resulting in waste of resources, and some defective products need to be downgraded, affecting the power generation efficiency and service life of finished solar cells. Con...

Claims

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Application Information

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IPC IPC(8): H01L21/677H01L31/18
CPCH01L21/67706H01L21/67736H01L21/67766H01L21/67778H01L31/1804Y02E10/547Y02P70/50
Inventor 周军戴秋喜潘加永刘光照
Owner 苏州映真智能科技有限公司
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