Ultra-high numerical aperture combined variable magnification extreme ultraviolet lithography objective lens and optimization method

An extreme ultraviolet lithography and objective lens technology, which is applied in the fields of optical design, semiconductor manufacturing equipment and chip manufacturing, can solve the problem that the method and example of the film layer of the extreme ultraviolet lithography objective lens are not fully disclosed, and the reflection characteristics of the objective lens are not reported. , It is difficult to obtain a uniform and high reflectivity film layer, etc., to achieve the effect of improving the quality and efficiency of lithography, excellent imaging quality, and reducing the number of splices

Active Publication Date: 2021-07-27
BEIJING INSTITUTE OF TECHNOLOGYGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] At present, there are no publicly reported papers and patents on NA55~0.6 combined variable magnification EUV lithography objective lens and gradient film system. The design of the highest numerical aperture variable magnification EUV lithography objective lens that has been published is Zeiss patent WO2016078818A1, which is the numerical aperture NA0 .55, Mx4 / My8 objective lens, but the structure of the objective lens system is unreasonable, multiple mirrors are grazing incidence, and the incident angle is large, it is difficult to obtain a matching uniform and high reflectivity coating, and the design method of the coating is not reported , structure and reflective properties of the objective lens
[0004] There is no complete disclosure of NA0.55~NA0.6 extreme ultraviolet lithography objective lens coating design methods and examples

Method used

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  • Ultra-high numerical aperture combined variable magnification extreme ultraviolet lithography objective lens and optimization method
  • Ultra-high numerical aperture combined variable magnification extreme ultraviolet lithography objective lens and optimization method
  • Ultra-high numerical aperture combined variable magnification extreme ultraviolet lithography objective lens and optimization method

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Embodiment Construction

[0044] The present invention will be described in detail below with reference to the accompanying drawings and examples.

[0045] According to the present invention, we realize that the size of the image field of view perpendicular to the scanning direction can be increased by the variable magnification imaging optical system, the number of splicing of the image field can be reduced, and the lithography efficiency can be improved to the maximum.

[0046] The lithography objective system of the present invention has a circular exit pupil, so the image-side numerical aperture is direction-independent. The lithography objective lens system of the present invention has an elliptical entrance pupil, and the semi-axes have the same or opposite relationship, which is related to different object-side numerical apertures or imaging sizes.

[0047] The variable magnification objective lens system of the present invention includes at least six mirror surfaces. Large numbers of mirrors a...

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Abstract

The invention discloses an ultra-high numerical aperture combination variable magnification extreme ultraviolet lithography objective lens and an optimization method. The design scheme of the variable magnification objective lens system can reduce the exposure while increasing the size of the image square field of view perpendicular to the scanning direction. The splicing number of the field of view improves the quality and efficiency of lithography; the numerical aperture of the image side of the objective lens system is 0.55 and 0.6, and the width of the image side scanning field of view is 1.5mm and 1mm; a larger numerical aperture can improve the resolution of the lithography objective lens , the larger image square scanning field of view width improves the production efficiency of silicon wafers; the incident angle of light on the reflector of the objective lens system in the present invention is smaller, which is convenient for the design of the reflective film layer; the xy free-form surface of the codev is improved, Increased the number of terms of free-form surface coefficients, increasing the degree of freedom of objective lens optimization; established a progressive optimization film layer design method for the film design of variable magnification lithography objective lens systems, and designed examples for NA0.6 and NA0.55 objective lens systems The design scheme of the film layer is given, and the average reflectance of the film layer reaches more than 65%.

Description

technical field [0001] The invention belongs to the technical fields of optical design, semiconductor manufacturing equipment and chip manufacturing, and in particular relates to an ultra-high numerical aperture combined variable magnification extreme ultraviolet lithography objective lens and an optimization method. Background technique [0002] At present, with the development of the semiconductor manufacturing industry, the resolution of lithography projection is gradually developing towards a higher level, which requires that the lithography objective lens system should gradually increase the numerical aperture to meet the new challenges of the lithography industry. Combining variable magnification extreme ultraviolet lithography objective lenses can not only reasonably achieve a numerical aperture of 0.4-0.7, but also increase the size of the image square field of view perpendicular to the scanning direction, reduce the number of splices in the exposure field of view, an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
CPCG03F7/20G03F7/70233G03F7/70491
Inventor 李艳秋刘陌闫旭
Owner BEIJING INSTITUTE OF TECHNOLOGYGY
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