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High-dielectric and high-thermal-conductivity heat-resistant composite dielectric

A composite electrolyte and heat-resistant technology, applied in heat exchange materials, chemical instruments and methods, etc., to achieve the effects of improving dielectric constant, simple and easy preparation method, and improving thermal conductivity

Inactive Publication Date: 2021-02-02
SICHUAN UNIV
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Problems solved by technology

[0006] The purpose of this experiment is to provide a heat-resistant composite dielectric with high dielectric and high thermal conductivity, so as to alleviate the problems of electrothermal stress and insulation aging caused by the use of epoxy resin packaging materials in current power electronic devices

Method used

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  • High-dielectric and high-thermal-conductivity heat-resistant composite dielectric

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Experimental program
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Effect test

Embodiment 1

[0034] (1) Mix h-BN powder with 5mol / L NaOH solution, then ultrasonically and stir for 6h;

[0035] (2) subjecting the solution obtained in step (1) to a hydrothermal reaction under the condition of 180° C. for 24 hours;

[0036] (3) repeatedly washing the solution obtained in step (2) with deionized water for several times, drying and collecting;

[0037] (4) adding boron nitride nanosheets and graphene fluoride obtained in step (3) to benzoxazine and epoxy resin, stirring for 30min to make it uniformly dispersed;

[0038] (5) Add the solution obtained in step (4) to the mixed solution of curing agent and accelerator, and stir for 1 h;

[0039] (6) The product obtained in step (5) was rotary evaporated at 80°C to remove the solvent, and the obtained glue was put into a vacuum oven, the experimental condition was 60°C, and the experimental time was 30 minutes;

[0040] (7) Pour the glue solution obtained in step (6) into the mold, and dry it in vacuum, the experimental condi...

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Abstract

The invention provides a method for preparing a high-dielectric and high-thermal-conductivity high-temperature-resistant composite dielectric material. Specifically, according to the method, hexagonalboron nitride nanosheets and fluorinated graphene are used as an epoxy resin filler, benzoxazine is used for auxiliary curing, and vacuum drying is performed to obtain the composite dielectric material. The method provided by the invention is simple in process and low in cost, and the obtained composite dielectric material has the advantages of high dielectric property and high thermal conductivity.

Description

Technical field: [0001] The invention relates to the technical field of insulating composite materials, in particular to a heat-resistant composite dielectric material with high dielectric and high thermal conductivity and its preparation method and application. Background technique: [0002] At present, the scale of power grid and power electronic devices are rapidly developing in the direction of high voltage, high current and miniaturization, which brings great challenges to the electrical performance, insulation performance and heat resistance performance of power equipment. Although epoxy resin is a typical power electronic packaging material with excellent electrical insulation and thermal conductivity, it is difficult to meet the needs of the current rapidly developing industrial field. Therefore, it is very important to improve the isotropic properties of epoxy resin and improve its insulation and thermal conductivity. The research on the improvement of the electric...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K3/04C08K7/00C08K3/38C08G59/50C09K5/14
CPCC08G59/5046C08K3/38C08K7/00C08K2003/385C09K5/14C08K3/042C08L63/00
Inventor 任俊文邱玉婷卿湫惋喻包鹏徐光大
Owner SICHUAN UNIV
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