Glue for red-light LED lamp and preparation method of glue
An LED lamp and glue technology, applied in applications, home appliances, coatings, etc., can solve the problems of difficulty in ensuring product quality in mass production, short life, poor thermal conductivity of glue, etc., to reduce the risk of being broken, The effect of increasing service life and increasing thermal conductivity
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Embodiment 1
[0020] A glue for red LED lamps comprises component A and component B, and the weight ratio of component A and component B is 1:1.5.
[0021] Each composition in component A is by weight, comprises the low-viscosity epoxy resin of 50 parts by weight, the curing agent of 0.4 parts by weight, the graphene of 3 parts by weight and the antioxidant of 2 parts by weight;
[0022] The components in component B include 30 parts by weight of silica gel, 25 parts by weight of inorganic nanoparticles and 2 parts by weight of coupling agent in parts by weight.
[0023] The above-mentioned low-viscosity epoxy resin is a mixture of bisphenol A epoxy resin and bisphenol F epoxy resin.
[0024] The above-mentioned curing agent is a mixture of organic acid anhydride compounds and fatty amines.
[0025] The above-mentioned graphene multilayer graphene oxide has a thickness of 2.5 nm, a sheet diameter of 40 μm, and a number of layers of 13.5.
[0026] The aforementioned antioxidant is 2,6-di-t...
Embodiment 2
[0034] A glue for red LED lamps comprises component A and component B, and the weight ratio of component A and component B is 1:1.
[0035] Each component in component A is by weight, comprises the low-viscosity epoxy resin of 40 parts by weight, the curing agent of 0.15 parts by weight, the graphene of 2 parts by weight and the antioxidant of 1 part by weight;
[0036] The components in component B include 20 parts by weight of silica gel, 20 parts by weight of inorganic nanoparticles and 1.5 parts by weight of coupling agent in parts by weight.
[0037] The above-mentioned low-viscosity epoxy resin is a mixture of bisphenol F epoxy resin and bisphenol S epoxy resin.
[0038] The above-mentioned curing agent is aliphatic amines.
[0039] The above-mentioned graphene multilayer graphene oxide has a thickness of 2 nm, a sheet diameter of 2 μm, and a number of 12 layers.
[0040] The above-mentioned antioxidant is methyl silicone.
[0041] The above silica gel has a viscosity...
Embodiment 3
[0048] A glue for red LED lamps comprises component A and component B, and the weight ratio of component A and component B is 1:2.
[0049] Each composition in component A is by weight, comprises the low-viscosity epoxy resin of 60 parts by weight, the curing agent of 0.6 parts by weight, the graphene of 4 parts by weight and the antioxidant of 3 parts by weight;
[0050] The components in component B include 40 parts by weight of silica gel, 30 parts by weight of inorganic nanoparticles and 2.5 parts by weight of coupling agent in parts by weight.
[0051] The above-mentioned low-viscosity epoxy resin is a mixture of aliphatic glycidyl ether epoxy resin and alicyclic epoxy resin.
[0052] The above curing agent is at least one of organic acid anhydride compounds, aliphatic amines, aromatic amines and imidazole compounds.
[0053] The above-mentioned graphene multilayer graphene oxide has a thickness of 3 nm, a sheet diameter of 80 μm, and a number of layers of 15.
[0054] ...
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