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Composite material

A composite material and slurry technology, applied in the field of composite materials, can solve the problems of deterioration of impact resistance and hardening of materials, and achieve the effect of excellent thermal conductivity.

Active Publication Date: 2021-02-05
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, since a large amount of filler components must be applied to ensure high thermal conductivity by the above method, various problems arise
For example, in the case of a material containing a large amount of filler components, the material itself tends to become hard, and in this case, impact resistance, etc. deteriorate

Method used

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  • Composite material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0106]The metal foam is a copper metal foam in which a film-like copper metal foam having a thickness of about 90 μm and a porosity of about 65% to 75% is used, in which oxides are present in the form of protrusions on the surface. Copper foam is prepared from a slurry using copper (Cu) powder having an average particle diameter (D50 particle diameter) of about 10 μm to 20 μm as a metal component, using α-terpineol as a dispersant, and using polyvinyl acetate Esters act as binders. The weight ratio (Cu:dispersant:binder) of metal component (Cu), dispersant and binder in the slurry is about 1:1.11:0.09. The slurry was applied to form a film of the thickness described above, and dried at a temperature of about 100° C. for about 40 minutes. Subsequently, the structure in the form of a film was heat-treated (sintered) at a temperature of about 900° C. for about 1 hour in a 4% hydrogen / argon atmosphere, and the metal components were combined while removing the organic components t...

Embodiment 2

[0109] A composite material was prepared in the same manner as in Example 1, except that a different kind of composition (Dow Coming, PDMS, Sylgard 527 Kit) was used as the thermosetting silicone resin composition. As a result of measuring the thermal conductivity of the prepared composite material in the above manner, it was around 6.86 W / mK.

Embodiment 3

[0111] A composite material was prepared in the same manner as in Example 2, except that the platy boron nitride powder was introduced into a thermosetting silicone resin composition (Dow Corning, PDMS, Sylgard 527Kit) at a ratio of about 10% by weight and use. As a result of measuring the thermal conductivity of the prepared composite material in the above manner, it was around 10.14 W / mK.

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Abstract

The present application provides a composite material and a method for producing the same. The present application can provide the composite material comprising a metal foam and a polymer component, and having other excellent physical properties such as impact resistance, processability, and insulation properties while having excellent thermal conductivity.

Description

technical field [0001] This application claims priority based on Korean Patent Application No. 10-2018-0075959 filed on June 29, 2018, the disclosure of which is incorporated herein by reference in its entirety. [0002] This application relates to composite materials. Background technique [0003] Heat dissipation materials can be used in a variety of applications. For example, since batteries and various electronic devices generate heat during operation, materials capable of effectively controlling such heat are required. [0004] As materials having good heat dissipation characteristics, ceramic materials and the like having good thermal conductivity are known, but since such materials are poor in workability, it is possible to use ceramic fillers or the like exhibiting high thermal conductivity by blending them in a polymer matrix. Composite materials produced in China. [0005] However, since a large amount of filler components must be applied to ensure high thermal ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F7/00B22F3/11
CPCB22F3/11B22F2003/1131B22F3/1143B22F7/002B22F7/008H01M10/6554H01M10/613B22F3/26B22F2998/10B22F2005/005F28F13/003F28F21/06F28F21/08F28F2255/06H01L23/3733H01L23/42H01L23/3736H01L23/3737Y02E60/10B22F3/1134B22F2302/25B22F3/24B22F2003/242C09K5/14
Inventor 金昭镇辛种民柳东雨
Owner LG CHEM LTD