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Voltage stabilizing chip of test circuit and preparation method thereof

A technology of voltage stabilizing chips and testing circuits, which is applied in circuits, measuring electricity, measuring electrical variables, etc., can solve the problems of increasing the verification and testing circuit module time, increasing the chip area, etc., to improve the anti-electromagnetic interference ability, and the structure is scientific and reasonable. , the effect of increasing accuracy and variety

Active Publication Date: 2021-02-09
广州宝创集成电路设计有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003]Usually, every time a circuit module is added to a chip, the chip design industry needs to test the circuit from the perspectives of functional application and verification test. , This is a painful and heavy work. In addition, every additional circuit module will not only inevitably increase the area of ​​the chip, but also increase the time for verifying and testing the circuit module, especially when adding analog circuits on the chip. , so it is necessary to design a voltage regulator chip for the test circuit to assist the work of the circuit test

Method used

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  • Voltage stabilizing chip of test circuit and preparation method thereof
  • Voltage stabilizing chip of test circuit and preparation method thereof
  • Voltage stabilizing chip of test circuit and preparation method thereof

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Embodiment 1

[0033] Embodiment 1: as Figure 1-2 As shown, the present invention provides a technical solution, a voltage stabilizing chip for testing circuits, including a substrate 1, the bottom end of the substrate 1 is connected with an epitaxial edge 2, one end of the epitaxial edge 2 is evenly embedded with a negative electrode 3, and the epitaxial edge The other end of 2 is evenly embedded with a positive electrode 4 at the position corresponding to the negative electrode 3, the outer side of the substrate 1 is connected with an anti-interference layer 7, the outer side of the anti-interference layer 7 is connected with a protective layer 6, and the top of the protective layer 6 is symmetrically provided with Groove 5, the inside of the anti-jamming layer 7 is uniformly embedded with anti-jamming particles 8, the inner bottom of the substrate 1 is embedded with a photolithographic silicon surface 9, and one end of the negative electrode 3 and the positive electrode 4 passes through t...

Embodiment 2

[0034] Embodiment 2: as image 3 As shown, the present invention provides a technical solution, a test system for a voltage stabilizing chip of a test circuit, including a current transmission module, a circuit test module and a control module, the transmission module includes a current input terminal and a current output terminal, and the circuit test module includes a relay, Test resistors and regulator chips, control modules include controllers and microprocessors;

[0035] Both the input end and the output end of the circuit test module are connected with the output end of the current transmission module, and the output end of the control module is connected with the input end of the circuit test module.

[0036] The transmission module includes a current input terminal and a current output terminal. The current input terminal refers to the incoming port of the required test circuit and the tester, and the current output port refers to the outgoing port connected to the te...

Embodiment 3

[0039] Embodiment 3: as Figure 4 As shown, the present invention provides a technical solution, a method for preparing a voltage stabilizing chip for a test circuit, comprising the following steps:

[0040]S1. Making wafers: using a wafer slicer to cut silicon ingots into wafers;

[0041] S2. Wafer coating: coating a photoresist film on the surface of the wafer;

[0042] S3. Photolithography and etching: use a photolithography machine and an etching machine to perform photolithography and etching on the silicon surface in the wafer, and implant ions;

[0043] S4. Coating outer layer: thermally melt and coat the anti-interference layer on the surface of the chip after photolithography;

[0044] S5. Chip packaging: fixing the wafer, embedding the pins, and packaging the chip.

[0045] In S2, a photoresist film is coated on the surface of the wafer, the number of times of photoresist film coating is 2 times, and the thickness of the photoresist film coating is 0.1 mm.

[004...

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Abstract

The invention discloses a voltage stabilizing chip of a test circuit, which comprises a substrate, the bottom end of the substrate is connected with an extension edge, negative electrodes are uniformly embedded into one end of the extension edge, positive electrodes are uniformly embedded into the other end of the extension edge corresponding to the negative electrodes, and the outer side of the substrate is connected with an anti-interference layer. According to the present invention, the structure is scientific and reasonable, the use is safe and convenient, by arranging the protection layer, the anti-interference layer and the anti-interference particles, the chip can be isolated from the outside, and the chip can be prevented from being damaged due to the anti-interference effect of the anti-interference layer and the anti-interference particles. Compared with the prior art, the chip is protected, the anti-electromagnetic interference capability of the chip can be improved, the uniformity degree of the photoresist film can be increased by coating the surface of the wafer with the photoresist film with the thickness of 0.1 mm twice, and the situation that due to the fact that the thickness of the photoresist film is not uniform, defective products and waste products generated in wafer photoetching are too many is avoided.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to a voltage stabilizing chip for testing circuits and a preparation method thereof. Background technique [0002] With the development of semiconductor technology, the chip design industry is increasingly inclined to integrate more and more circuit modules on the chip, which can reduce the complexity of the system design end, reduce the cost of the system board, and promote the development of the system board. The design of the card is developing towards miniaturization and thinning, making its chips more competitive in the market. The improvement of chip integration has brought great challenges to the chip design industry. In addition to the increase in the workload of the design end, the chip design industry also needs Consider how to conveniently verify and test various circuit modules in the chip; [0003] Usually, every time a circuit module is added to the chip, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/552H01L23/31H01L21/50H01L21/56G01R31/28
CPCH01L23/552H01L23/3107H01L21/50H01L21/56G01R31/2851
Inventor 段恋
Owner 广州宝创集成电路设计有限公司