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a high mg 2 Si aluminum alloy and its design and rapid solidification preparation method and application

An aluminum alloy, al-70%mg2si technology, applied in heat treatment equipment, semiconductor/solid-state device parts, manufacturing tools, etc., can solve the problems of low mechanical properties of materials, large thermal expansion coefficient, low Si phase content, etc. Effects of improved performance, reduced density, and guaranteed stability

Active Publication Date: 2021-08-13
HUNAN AGRICULTURAL UNIV +1
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  • Abstract
  • Description
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Problems solved by technology

[0006] In order to meet the needs of modern electronic components for new lightweight and high-performance electronic packaging materials, the present invention provides a high Mg 2 Si aluminum alloy, which meets the requirements of electronic packaging for material performance and process performance; in order to overcome Al-Mg 2 Mg in Si alloy 2 Low Si phase content, coarse size, sharp edges and corners lead to low mechanical properties of materials, large thermal expansion coefficient and poor machining performance. The present invention uses rapid solidification spray deposition to prepare Al-Mg 2 Si alloy, combined with subsequent densification treatment to obtain Al-Mg 2 Si series alloy; The present invention will further spray deposited Al-Mg 2 Si alloys are respectively made into electronic packaging shells and electronic packaging cover plates, thus laying a technical foundation for the promotion and application of this material

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  • a high mg <sub>2</sub> Si aluminum alloy and its design and rapid solidification preparation method and application
  • a high mg <sub>2</sub> Si aluminum alloy and its design and rapid solidification preparation method and application
  • a high mg <sub>2</sub> Si aluminum alloy and its design and rapid solidification preparation method and application

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Embodiment 1

[0057] In this embodiment, a kind of Al-0.3%Mn-30%Mg 2 For the design, preparation and application of Si alloy electronic packaging cover materials, please refer to the attached figure 1 ,Specific steps are as follows:

[0058] (1) Alloy composition design: performance index requirements of electronic packaging materials and Al and Mg 2 Performance parameters of Si (Table 1), design Mg 2 Si content and Al matrix composition.

[0059] According to the requirement of thermal expansion coefficient of electronic packaging cover plate material at 20~200℃ 18.0±1.0×10 -6 / K, the thermal conductivity is required to be higher than 150W / mK.

[0060] First, according to the coefficient of thermal expansion 18.0±1.0×10 -6 / K requirements and formula (1), assuming Mg 2 Si content is x, then Al content is 1-x, namely

[0061] 23.6·(1-x)+7.5·x=18±1 (3)

[0062] From formula (3), it can be obtained that Mg 2 The Si content of 28.6%-41.0% can meet the requirements of the thermal expan...

Embodiment 2

[0087] A kind of Al-60%Mg in this embodiment 2 For the design, preparation and application of Si alloy electronic package housing materials, please refer to the attached figure 1 ,Specific steps are as follows:

[0088] (1) Alloy composition design: performance index requirements of electronic packaging materials and Al and Mg 2 Performance parameters of Si (Table 1), design Mg 2 Si content and Al matrix composition.

[0089] According to the requirement of thermal expansion coefficient of electronic package shell material at 20~200℃, it should be 13.0±1.0×10 -6 / K, the thermal conductivity is required to be higher than 100W / mK.

[0090] First, according to the coefficient of thermal expansion 12.0±1.0×10 -6 / K requirements and formula (1), assuming Mg 2 Si content is x, then Al content is 1-x, namely

[0091] 23.6·(1-x)+7.5·x=13±1 (5)

[0092] From formula (5), it can be obtained that Mg 2 The Si content of 59.6%-72.0% can meet the requirements of the thermal expansi...

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Abstract

The present invention relates to a kind of high Mg 2 Si aluminum alloy and its design and rapid solidification preparation method and application, including the following steps: S1: alloy composition design, mainly Mg 2 Si content; S2: in situ reaction, adding pure magnesium to the Al‑Si alloy melt, and getting Al‑70%Mg after in situ reaction 2 Si master alloy; S3: Spray deposition billet; S4: Densification treatment; S5: Stabilization heat treatment; S6: Alloy composition optimization. Compared with existing materials, Al‑Mg 2 Si alloy has lower density, higher elastic modulus; compared with the existing preparation technology, the high cooling rate of the spray deposition process can effectively control the Mg 2 Si phase size and morphology to obtain high Mg 2 Si content ensures that the alloy has good comprehensive properties; the present invention will also Al-Mg 2 Si alloys are used in electronic packaging covers and housings, and can also be used in lightweight components such as pistons, brake discs, and engine cylinder liners.

Description

technical field [0001] The invention belongs to the technical field of development and preparation of metals and alloys, in particular to a high-Mg 2 The design and rapid solidification preparation method of Si aluminum alloy, and its application to electronic packaging cover and housing. Background technique [0002] With the rapid development of modern electronic information, rail transit and automobile industries, as well as the increasingly prominent problems of energy shortage and environmental pollution, light-weight high-performance aluminum alloys have attracted more and more attention from the material and industrial circles, and have been used in aerospace , vehicles, sports and other fields are widely used. With the development of modern electronic systems in the direction of miniaturization, light weight, high operating frequency, high power density, multi-function and high reliability, traditional electronic packaging materials are no longer competent in terms ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C21/08C22C1/03C22C32/00B22F10/22B22F10/66B22F10/64C22F1/047C21D9/00H01L23/06B33Y10/00
CPCB22F3/115B22F3/20B22F3/24B22F2003/208B22F2003/248B33Y10/00C21D9/0081C22C1/026C22C1/03C22C21/08C22C32/0078C22F1/047H01L23/06
Inventor 张纯蔡志勇王日初
Owner HUNAN AGRICULTURAL UNIV
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