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An ultraviolet LED lamp bead encapsulated by silazane and its preparation method

A technology of LED lamp beads and silazane, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of not providing adhesion and light transmittance parameters, B component becoming turbid, and poor bonding performance. Achieve excellent thermal stability

Active Publication Date: 2021-11-16
吉安市木林森精密科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The prior art (CN102850804A) provides a transparent two-component silicone potting adhesive for LEDs, which belongs to the addition type, and has defects such as poor bonding performance, easy poisoning of the catalyst, and the need for heating and curing.
[0006] The prior art (CN102115604A) proposes a two-component condensation-type silicone transparent electronic potting adhesive, which has good yellowing resistance, but does not provide adhesion and light transmittance parameters, and does not involve any form of reinforcement in the patent Solid filler, its mechanical properties are poor
[0007] The prior art (CN101787211A) provides a high-transparency, high-strength room-temperature-vulcanized silicone electronic potting compound. The single use of γ-aminopropyltriethoxysilane as a tackifier has the disadvantage of insufficient adhesion. In addition, γ -Aminopropyltriethoxysilane improves the adhesion of condensation products, but this coupling agent is a self-catalyzed coupling agent, which is alkaline in aqueous solution and is almost completely hydrolyzed when it meets water. Ammonia can catalyze silanol Accelerate polycondensation into insoluble polymers, and make component B cloudy during storage, affecting the light transmittance of the product

Method used

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  • An ultraviolet LED lamp bead encapsulated by silazane and its preparation method

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preparation example Construction

[0047] In some preferred embodiments, the preparation method of silazane encapsulant comprises the following steps: (1) combining perhydropolysilazane and modified polysilazane, white carbon black, ultraviolet absorber and light stabilizer Add it into the mixer, raise the temperature to 100-120°C, and keep stirring for 4-8 hours to obtain the mixed material; (2) Cool the mixed material to below 50-60°C, add toughening agent, cross-linking agent, flame retardant and vacuum stir 1 to 2 hours; (3) Add catalyst and coupling agent, and stir in vacuum for 2 to 3 hours to obtain a high-transparency jelly; (4) Release the vacuum, heat up to 70-80°C, add solid filler, and continue stirring for 2 hours ~3 hours, and then naturally cooled to room temperature to obtain the final product of silazane potting compound.

[0048] The second aspect of the present invention provides a method for preparing an ultraviolet LED lamp bead packaged with silazane as described above, comprising the foll...

Embodiment 1

[0052] Embodiment 1 provides an ultraviolet LED lamp bead encapsulated by silazane, which includes the following parts: UP support 1 ; ultraviolet LED chip 2 ; silazane potting glue 3 . The UP bracket 1 includes a supporting substrate, a dam and a pad, the supporting substrate is fixedly connected to the dam and the dam is above the substrate and forms a concave cavity, and a pad is provided at the bottom of the cavity; the ultraviolet LED chip 2 is fixed on the soldering pad by welding. On the plate; the silazane potting glue 3 potting the inside of the UP bracket 1 to encapsulate the ultraviolet LED lamp beads.

[0053] The raw material of silazane potting glue contains the following parts by weight: 90 parts of perhydropolysilazane (perhydropolysilazane with a viscosity of 4000 centipoise and a viscosity of 5500 centipoise is 4:1 by weight), 1,2 - 40 parts of epoxy-5-hexene modified polysilazane, 5 parts of acrylic acid, 10 parts of white carbon black, 3 parts of methyl ort...

Embodiment 2

[0061] The specific implementation of this example is the same as that of Example 1, except that the weight ratio of perhydropolysilazane with a viscosity of 4000 centipoise to a viscosity of 5500 centipoise is 3:1

[0062] The ultraviolet LED lamp bead prepared in this embodiment is marked as L2.

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Abstract

The invention discloses an ultraviolet LED lamp bead encapsulated by silazane and a preparation method thereof. The main components include a concave cavity bracket, an ultraviolet LED chip, and a silazane potting glue; the ultraviolet LED chip is passed through the silazane potting glue for encapsulation. The invention makes the ultraviolet LED lamp bead have excellent light transmittance and tensile strength by limiting the raw material weight ratio, fineness and epoxy modification prepared by the potting glue.

Description

technical field [0001] The invention relates to the field of ultraviolet LED lamp beads, in particular to an ultraviolet LED lamp bead packaged with silazane and a preparation method thereof. Background technique [0002] As the world's most attention-grabbing new-generation light source, LED is known as the most promising green lighting source in the 21st century because of its advantages such as high brightness, low heat, long life, non-toxicity, and recyclability. Currently, LED lighting and large-screen LED backlighting are the two most potential emerging markets in the field of LED applications, especially LED lighting, which is closely related to people's livelihood, has been mentioned to the height of government policy support because of energy saving and environmental protection. [0003] Among the LED lighting products, there is a product that assembles LEDs on a strip-shaped FPC (flexible circuit board) or PCT hard board, called an LED light strip, because of its l...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/56H01L25/075
CPCH01L25/0753H01L33/486H01L33/56H01L2933/0033H01L2933/005
Inventor 陈江聪曹锋管洪勇
Owner 吉安市木林森精密科技有限公司