An ultraviolet LED lamp bead encapsulated by silazane and its preparation method
A technology of LED lamp beads and silazane, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of not providing adhesion and light transmittance parameters, B component becoming turbid, and poor bonding performance. Achieve excellent thermal stability
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[0047] In some preferred embodiments, the preparation method of silazane encapsulant comprises the following steps: (1) combining perhydropolysilazane and modified polysilazane, white carbon black, ultraviolet absorber and light stabilizer Add it into the mixer, raise the temperature to 100-120°C, and keep stirring for 4-8 hours to obtain the mixed material; (2) Cool the mixed material to below 50-60°C, add toughening agent, cross-linking agent, flame retardant and vacuum stir 1 to 2 hours; (3) Add catalyst and coupling agent, and stir in vacuum for 2 to 3 hours to obtain a high-transparency jelly; (4) Release the vacuum, heat up to 70-80°C, add solid filler, and continue stirring for 2 hours ~3 hours, and then naturally cooled to room temperature to obtain the final product of silazane potting compound.
[0048] The second aspect of the present invention provides a method for preparing an ultraviolet LED lamp bead packaged with silazane as described above, comprising the foll...
Embodiment 1
[0052] Embodiment 1 provides an ultraviolet LED lamp bead encapsulated by silazane, which includes the following parts: UP support 1 ; ultraviolet LED chip 2 ; silazane potting glue 3 . The UP bracket 1 includes a supporting substrate, a dam and a pad, the supporting substrate is fixedly connected to the dam and the dam is above the substrate and forms a concave cavity, and a pad is provided at the bottom of the cavity; the ultraviolet LED chip 2 is fixed on the soldering pad by welding. On the plate; the silazane potting glue 3 potting the inside of the UP bracket 1 to encapsulate the ultraviolet LED lamp beads.
[0053] The raw material of silazane potting glue contains the following parts by weight: 90 parts of perhydropolysilazane (perhydropolysilazane with a viscosity of 4000 centipoise and a viscosity of 5500 centipoise is 4:1 by weight), 1,2 - 40 parts of epoxy-5-hexene modified polysilazane, 5 parts of acrylic acid, 10 parts of white carbon black, 3 parts of methyl ort...
Embodiment 2
[0061] The specific implementation of this example is the same as that of Example 1, except that the weight ratio of perhydropolysilazane with a viscosity of 4000 centipoise to a viscosity of 5500 centipoise is 3:1
[0062] The ultraviolet LED lamp bead prepared in this embodiment is marked as L2.
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