Preparation process of heterojunction solar cell
A technology for solar cells and preparation processes, which is applied in circuits, photovoltaic power generation, electrical components, etc., to achieve the effects of high solubility, promotion of capture, and excellent electrical conductivity
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Embodiment 1
[0043] A. Phosphorus gettering treatment is carried out on the N-type single crystal silicon wafer with a thickness of 180 μm. The deposition temperature is 750 ° C, and the advancing temperature is 900 ° C to form a diffusion layer with a depth of 0.5 μm and a square resistance of 70Ω, forming phosphorus diffusion on the front and back surfaces of the silicon wafer layer, post-pass HNO 3 and HF to remove the diffusion layer;
[0044] B. Texture treatment is carried out on the surface of the silicon wafer after the A process by using KOH, and the size of the suede surface is 3um.
[0045] C. Prepare the dual intrinsic amorphous silicon layer and doped amorphous silicon layer on the front and back by plasma chemical vapor deposition. The thickness of the intrinsic amorphous silicon on the front and back is 10nm, the thickness of P-type amorphous silicon is 15nm, and the thickness of N-type amorphous silicon The thickness of crystalline silicon is 20nm;
[0046] D. Deposit an ...
Embodiment 2
[0051] A. Phosphorus gettering treatment is performed on a single crystal silicon wafer with an N-type thickness of 180 μm. The deposition temperature is 800°C, and the advancing temperature is 900°C. The depth of the diffusion layer is 0.7 μm, and the square resistance is 50Ω. Phosphorus diffusion is formed on the front and back surfaces of the silicon wafer. layer, post-pass HNO 3 and HF to remove the diffusion layer;
[0052] B. Texture treatment is carried out on the surface of the silicon wafer after the A process by using KOH, and the size of the suede surface is 3um.
[0053] C. Prepare the dual intrinsic amorphous silicon layer and doped amorphous silicon layer on the front and back by plasma chemical vapor deposition. The thickness of the intrinsic amorphous silicon on the front and back is 10nm, the thickness of P-type amorphous silicon is 15nm, and the thickness of N-type amorphous silicon The thickness of crystalline silicon is 20nm;
[0054] D. Deposit an ITO fi...
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