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Polyimide films and electronic devices

A technology of polyimide film and polyamic acid, applied in the fields of polyimide film and electronic devices

Pending Publication Date: 2021-03-12
DUPONT ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the method in which a film is formed by casting a polyamic acid solution and the resulting film is cured results in a noticeable color

Method used

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  • Polyimide films and electronic devices

Examples

Experimental program
Comparison scheme
Effect test

example

[0109] testing method

[0110] CIE L *, A *, B * Color and Huangdu Index Measurement

[0111] Color measurement XE Double Bird Spectrophotometer (Hunter Associates Laboratory, Inc., RESTON, VA), using D65 lighting and 10 degree observation, 360 to 780 nm The wavelength range is performed in full transmissive mode. The yellowness index (YI) is measured using the program described by ASTM E313.

[0112] Transmittance and haze

[0113] Transmittance and haze were measured using Haze-Guard Plus (Byk-Gardner GmbH, Germany), where the haze used the method described by ASTM1003 by collecting forward scattered light in transmittance measurement. The percentage haze was determined by measuring the amount of light having an average of over 2.5 degrees of incident beam.

[0114] Tensile modulus

[0115] The stretching modulus is measured using ASTM D882 test methods.

[0116] Percentimide

[0117] The polyimide film was evolved from the solution and dried under 25 ° C (10 mTorr) f...

example 1

[0142] For Example 1 (E1), the same procedure for preparing the polyamic acid and the polyimide resin as described for CE3 is used, but there is a difference. 66.713 g of TFMB was added along with 479.66 g of DMAC, 36.571 g of 6FDA and 24.219 g of CBDA to prepare a polyamic acid solution composed of CBDA 0.6 / 6FDa0.4 / / TFMB 1.0 monomer.

[0143] Use a small amount of 6 wt% 6FDA solution in DMAC to "processing" to 1475 moored (weight average molecular weight, Mw = 363, 739 Dalton, PDI 2.18).

[0144] As described in CE3, a portion of the polyamic acid is converted to polyimide, and the polymer dissolves and the dried resin is dissolved and flowed into a film, but there is a difference. Among the 500-mL nitrogen purge resin kettle, 8.268 g of β-methylpyridine and 9.064 g of acetic anhydride were added to 103.50 g of a polyamic acid solution. 11.75 g of a polyimide resin was combined with 45.0 g of DMAC and mixed to obtain a solution and the film was derived.

[0145] Place the mou...

example 2

[0151] For Example 2 (E2), a monomer having BPDA 0.1 / CBDA 0.6 / 6FDa 0.3 / / TFMB 1.0, a resin kettle of 1000-mL nitrogen purge, adding 35.00 g of TFMB along with 422.5 g of DMAC. The reactor was heated to 40 ° C and maintained at this temperature for all subsequent reagents. 14.391 g of 6FDA, 12.706 g of CBDA and 3.177 g of 3,3, 4,4'-biphenyl tetrahydride (BPDA, Mitsubi Co., Japan) were light in an inert atmosphere (Mitsubishichemical Co., Japan)) Made in the ground until the combined powder is visually uniform. The blended powder was added to a solution containing TFMB and DMAC in three equality portions. The solution was reacted with a dihydride for 15-20 minutes after each addition. After the addition of dianhydride, 105.6 g of DMAC was added to the solution. The polymer was used to polymerize or enlarged to about 20 mooring measurement viscosity using a small amount of 10 wt% 6FDA solution in DMAC.

[0152] In order to form a portion or completely imidized polyimide solution...

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Abstract

In a first aspect, the polyimide film includes a dianhydride and a diamine. The dianhydride, the diamine, or both the dianhydride and the diamine comprise an alicyclic monomer, an aliphatic monomer, or both an alicyclic monomer and an aliphatic monomer. The polyimide film has a tensile modulus of 5.5 GPa or more, a b * of 1.4 or less, and a yellowness index of 2.25 or less for a film thickness of50 [mu] m. In a second aspect, an electronic device includes the polyimide film in a first aspect.

Description

Technical field [0001] The field of the present disclosure is a polyimide film and an electronic device. Background technique [0002] Polyimide films can potentially substituting rigid glass coverings and other substrates used in display applications such as organic light emitting diodes (OLED) displays. For example, the aromatic polyimide is typically very thermally stable, having a glass transition temperature greater than 320 ° C (T g ), And have excellent foldable and rolling resistance, which is the key characteristics required for the next generation of flexible displays. For the polyimide film used in the display application, the polyimide film needs to be neutralized in addition to high transmittance and low haze. Typical specifications require a * and b *, both CIE L *, A *, B * color space coordinates are not more than 1 color unit, that is, the absolute value of A * and B * should be less than 1 . The three coordinates of CIEL *, A *, B * indicate: (1) brightness of c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18C08G73/10C08L79/08
CPCC08J5/18C08G73/1075C08G73/1042C08G73/1039C08G73/1007C08J2379/08C08K3/36C08K2003/2227C08K2003/2244C08K2003/2241C08J2479/08C08G73/1078C08G73/1028C08K3/22C08L79/08C08K2003/2237
Inventor J·C·约翰逊K·库塔基斯M·T·卡斯尼G·M·罗西
Owner DUPONT ELECTRONICS INC