Preparation method of low-temperature fast-curing impedance flame-retardant structural adhesive

A fast-curing, structural adhesive technology, used in adhesives, epoxy resin adhesives, adhesive types, etc., can solve the problems of lack of flame retardant performance, high curing temperature, long curing time, etc., to meet the requirements of process diversity, The effect of good bonding strength and fast curing speed at low temperature

Active Publication Date: 2021-03-19
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Most structural adhesives have problems such as high curing temperature, long curing time, large shrinkage, low impedance, and lack of flame retardancy, which

Method used

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  • Preparation method of low-temperature fast-curing impedance flame-retardant structural adhesive
  • Preparation method of low-temperature fast-curing impedance flame-retardant structural adhesive
  • Preparation method of low-temperature fast-curing impedance flame-retardant structural adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] a. In terms of parts by mass: Add 300g of epoxy resin EXA-830CRP into the reaction kettle, heat to 60°C, set the speed at 10RPM, and start stirring; under this stirring condition, add 690g of hexaphenoxycyclotriphosphazene HPCTP , heated to 120°C, set the speed at 40RPM under vacuum, and stirred for 1 hour; added 10g of isophorone diamine IPDA, and continued to stir for 3 hours under nitrogen protection to prepare a self-synthesized flame-retardant epoxy resin gel;

[0033] b. by mass parts: self-synthesized flame-retardant epoxy resin gel 100g, tricyclopentyl dimethoxy type epoxy resin EP-4088S 250g, new low-viscosity toughening agent LME11335 80g, inositol six ( Mercapto propionate) Thiocure 360 ​​200g, imidazole adduct PN-23J 40g, superfine aluminum hydroxide 104 330g. Put them into the stirring tank in turn, set the rotation speed at 30RPM under vacuum conditions, and stir for 4 hours to prepare the structural adhesive of the present invention.

Embodiment 2

[0035] a. In terms of parts by mass: Add 330g of epoxy resin EXA-830CRP into the reaction kettle, heat to 55°C, set the speed at 10RPM, and start stirring; under this stirring condition, add 660g of hexaphenoxycyclotriphosphazene HPCTP , heated to 115°C, set the speed at 40RPM under vacuum, and stirred for 0.5 hours; added 9g of isophorone diamine IPDA, and continued to stir for 2 hours under nitrogen protection to prepare a self-synthesized flame-retardant epoxy resin gel;

[0036] b. by mass parts: self-synthesized flame-retardant epoxy resin gel 150g, tricyclopentyl dimethoxy type epoxy resin EP-4088L 300g, new low-viscosity toughening agent LME11335 60g, inositol six ( Mercapto propionate) Thiocure 360 ​​250g, imidazole adduct PN-H 50g, superfine aluminum hydroxide 104 190g. Put them into the stirring tank in turn, set the rotation speed at 30RPM under vacuum conditions, and stir for 4 hours to prepare the structural adhesive of the present invention.

Embodiment 3

[0038] a. In terms of parts by mass: Add 320g of epoxy resin EXA-830CRP into the reaction kettle, heat to 55°C, set the speed at 10RPM, and start stirring; under this stirring condition, add 680g of hexaphenoxycyclotriphosphazene HPCTP , heated to 115°C, set the speed at 40RPM under vacuum, and stirred for 1 hour; added 10g of isophorone diamine IPDA, and continued to stir for 3 hours under nitrogen protection to prepare a self-synthesized flame-retardant epoxy resin gel;

[0039] b. By mass parts: 200g of self-synthesized flame-retardant epoxy resin gel, 350g of tricyclopentyl dimethoxy epoxy resin EP-4088S, 30g of new low-viscosity toughening agent LME11335, inositol six ( Mercapto propionate) Thiocure 360 ​​300g, imidazole adduct PN-40J 60g, superfine aluminum hydroxide 104 60g. Put them into the stirring tank one by one, set the rotation speed at 30RPM under the vacuum condition, and stir for 3 hours to prepare the structural glue of the present invention.

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Abstract

A related low-temperature fast-curing impedance flame-retardant structural adhesive is composed of the following raw materials: 10 to 20 parts of self-synthesized flame-retardant epoxy resin gel, 25 to 35 parts of tricyclopentyl dimethoxy epoxy resin, 3 to 8 parts of a novel low-viscosity toughening agent, 20 to 30 parts of dipentaerythritol hexakis(3-mercaptopropionate), 4 to 6 parts of imidazoleadduct and 6 to 33 parts of ultrafine aluminum hydroxide. The structural adhesive prepared by the invention has the advantages of high low-temperature curing speed, easiness in single-component operation, good impedance performance, good flame retardance, low shrinkage, good bonding strength and the like, and is suitable for structural bonding of various micro motor inductance coils and associated difficult-to-bond materials.

Description

technical field [0001] The invention relates to a low-temperature fast-curing resistance flame-retardant structural adhesive, which belongs to the field of adhesives. Background technique [0002] Global electronic products are developing in the direction of lightweight and intelligent, and the micro-motor technology of key components such as camera modules, audio-visual modules, shaft drive control components, and automation drives of various advanced electronic products is also developing rapidly. At the same time, micro-motor technology is also developing towards new types of motors such as high-precision motors, high-speed synchronous motors, sheet-winding brushless motors, high-performance servo motors, and ultrasonic motors. Structural glue bonds the inductance coil and related materials in the motor, which has good process operability and high bonding strength, which effectively improves the functionality, practicability and reliability of the motor product. [0003]...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04C08G59/14C08G59/66C08G59/68
CPCC09J163/00C08G59/1488C08G59/66C08G59/686C08L2201/02C08L2205/025C08K2003/2227C08L63/00C08K3/22
Inventor 闫善涛陈田安王建斌
Owner YANTAI DARBOND TECH
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