Preparation method of low-temperature fast-curing impedance flame-retardant structural adhesive
A fast-curing, structural adhesive technology, used in adhesives, epoxy resin adhesives, adhesive types, etc., can solve the problems of lack of flame retardant performance, high curing temperature, long curing time, etc., to meet the requirements of process diversity, The effect of good bonding strength and fast curing speed at low temperature
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Embodiment 1
[0032] a. In terms of parts by mass: Add 300g of epoxy resin EXA-830CRP into the reaction kettle, heat to 60°C, set the speed at 10RPM, and start stirring; under this stirring condition, add 690g of hexaphenoxycyclotriphosphazene HPCTP , heated to 120°C, set the speed at 40RPM under vacuum, and stirred for 1 hour; added 10g of isophorone diamine IPDA, and continued to stir for 3 hours under nitrogen protection to prepare a self-synthesized flame-retardant epoxy resin gel;
[0033] b. by mass parts: self-synthesized flame-retardant epoxy resin gel 100g, tricyclopentyl dimethoxy type epoxy resin EP-4088S 250g, new low-viscosity toughening agent LME11335 80g, inositol six ( Mercapto propionate) Thiocure 360 200g, imidazole adduct PN-23J 40g, superfine aluminum hydroxide 104 330g. Put them into the stirring tank in turn, set the rotation speed at 30RPM under vacuum conditions, and stir for 4 hours to prepare the structural adhesive of the present invention.
Embodiment 2
[0035] a. In terms of parts by mass: Add 330g of epoxy resin EXA-830CRP into the reaction kettle, heat to 55°C, set the speed at 10RPM, and start stirring; under this stirring condition, add 660g of hexaphenoxycyclotriphosphazene HPCTP , heated to 115°C, set the speed at 40RPM under vacuum, and stirred for 0.5 hours; added 9g of isophorone diamine IPDA, and continued to stir for 2 hours under nitrogen protection to prepare a self-synthesized flame-retardant epoxy resin gel;
[0036] b. by mass parts: self-synthesized flame-retardant epoxy resin gel 150g, tricyclopentyl dimethoxy type epoxy resin EP-4088L 300g, new low-viscosity toughening agent LME11335 60g, inositol six ( Mercapto propionate) Thiocure 360 250g, imidazole adduct PN-H 50g, superfine aluminum hydroxide 104 190g. Put them into the stirring tank in turn, set the rotation speed at 30RPM under vacuum conditions, and stir for 4 hours to prepare the structural adhesive of the present invention.
Embodiment 3
[0038] a. In terms of parts by mass: Add 320g of epoxy resin EXA-830CRP into the reaction kettle, heat to 55°C, set the speed at 10RPM, and start stirring; under this stirring condition, add 680g of hexaphenoxycyclotriphosphazene HPCTP , heated to 115°C, set the speed at 40RPM under vacuum, and stirred for 1 hour; added 10g of isophorone diamine IPDA, and continued to stir for 3 hours under nitrogen protection to prepare a self-synthesized flame-retardant epoxy resin gel;
[0039] b. By mass parts: 200g of self-synthesized flame-retardant epoxy resin gel, 350g of tricyclopentyl dimethoxy epoxy resin EP-4088S, 30g of new low-viscosity toughening agent LME11335, inositol six ( Mercapto propionate) Thiocure 360 300g, imidazole adduct PN-40J 60g, superfine aluminum hydroxide 104 60g. Put them into the stirring tank one by one, set the rotation speed at 30RPM under the vacuum condition, and stir for 3 hours to prepare the structural glue of the present invention.
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