Low-melting-point high-latent-heat phase change and energy storage material as well as preparation method thereof

Abstract

The invention relates to a low-melting-point high-latent-heat phase change and energy storage material as well as a preparation method thereof. The material is a low-melting-point high-latent-heat alloy with eutectic melting characteristics, and comprises the following components in percentage by weight: 10-25% of In, 10-25% of Sn, 0-4% of Ga, 0-4% of Zn and the balance of Bi. During preparation,the components are firstly weighed in proportion, indium with purity higher than 99.995wt%, tin, gallium, zinc and bismuth are put into a vacuum smelting furnace, and steps of smelting, stirring, pouring and cooling are performed under conditions of isolating air to control water and oxygen content in the vacuum smelting furnace. The material has a smelting temperature ranging from 90 DEG C to 100DEG C, and has latent heat of 420J / cm3 or more per unit volume. The alloy components are high volume phase change and latent heat, and the alloy is free of poisonous and harmful elements, so that thelow-melting-point high-latent-heat phase change and energy storage material can be widely applied to electronic equipment thermal management.

Description

technical field [0001] The invention relates to a low melting point high latent heat phase change energy storage material and a preparation method thereof, in particular to a low melting point phase change heat storage alloy with eutectic melting characteristics and a preparation method thereof, belonging to the field of phase change energy storage. Background technique [0002] With the development of electronic packaging technology towards high frequency, high speed, multi-function, high performance, small size and high reliability, device heat dissipation is an important technical bottleneck restricting the performance of electronic products. Facing the complex heat dissipation environment of electronic devices, high-power components cannot achieve rapid and effective temperature control through active heat dissipation methods such as air cooling and water cooling. In the case of inability to effectively dissipate heat, phase change materials with high thermal conductivit...

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Problems solved by technology

[0006] The latent heat of phase change materials disclosed so far with a phase transition temperature of around 100°C is relatively low. Studies have found that high addition of In element will greatly reduce the latent heat of phase transition of the material.

However, although the addition of a large amount of Bi and Sn will increase the latent heat of phase transformation, it will cause the alloy to have a melting characteristic of multiple melting points during the melting process, which greatly reduces the recycling performance of the material.

Patent Publication No. CN103146975A discloses a lead-free low-temperature alloy with a melting point of 116±2°C and its preparation method. Patent Publication No. CN103146976A discloses a lead-free low-temperature alloy with a melting point of 100±2°C and its preparation method. Although the above low-melting point alloys do not contain environmentally harmful elements and have a narrow melting range, they have low latent heat of phase transformation and less heat storage during actual use.

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