Ceramic chip in multilayer ceramic capacitor and preparation method thereof
A technology of multilayer ceramics and capacitors, applied in the manufacture of capacitors, laminated capacitors, capacitors, etc., can solve the problems of thinning of the ceramic dielectric layer, easy deformation of ceramic chips, affecting the performance of capacitors, etc., to reduce deformation and corrosion. Effect
Active Publication Date: 2021-03-19
CHAOZHOU THREE CIRCLE GRP +1
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Problems solved by technology
However, such a manufacturing method has the following problems: a) The organic solvent in the internal electrode slurry will erode the ceramic dielectric, making the ceramic dielectric layer thinner, which affects the performance of the capacitor, and the surface is prone to curvature during lamination, causing the surface of the ceramic chip to Generate radian; b) Due to the shrinkage difference between the dielectric layer and the internal electrode layer during the sintering process, it is easy to cause the formed ceramic chip to be easily deformed, and cracks or delamination occur between the dielectric layer and the internal electrode layer or between the dielectric layer and the dielectric layer
Method used
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Embodiment Construction
[0024] In order to better illustrate the purpose, technical solutions and advantages of the present invention, the present invention will be further described below in conjunction with specific examples.
[0025] test 1
[0026] The test group and the control group were set up to explore the corrosion of the organic solvent in the PET release film to the ceramic medium.
[0027] Wherein, each test group and control group all provide a kind of preparation method of the semi-formed ceramic dielectric layer with internal electrode layer printed on the surface, these preparation methods all include the following preparation steps:
[0028] (1) raw materials such as ceramic powder, binder and solvent are mixed and ball-milled to obtain ceramic slurry by fixed proportioning;
[0029] (2) Casting the ceramic slurry to form a layer of film, drying to obtain a semi-formed ceramic dielectric layer, wherein the temperature of the casting process is 55-95°C;
[0030] (3) The test group ...
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Abstract
The invention provides a preparation method of a ceramic chip in a multilayer ceramic capacitor and belongs to the field of multilayer ceramic capacitors. By adopting a semi-forming process, the deformation of the ceramic chip is reduced, and cracks and delamination between the dielectric layer and the inner electrode layer and between the dielectric layers are avoided; by transferring the electrode through the PET release film printed with the inner electrode pattern on the surface, etching of the organic solvent in the inner electrode slurry to the ceramic medium is effectively reduced.
Description
technical field [0001] The invention belongs to the field of multilayer ceramic capacitors, and in particular relates to a ceramic chip in a multilayer ceramic capacitor and a preparation method thereof. Background technique [0002] In recent years, due to the miniaturization of various electronic devices, the miniaturization and high performance of electronic components mounted in the electronic devices have also been developed. Chip multilayer ceramic capacitors, one of the electronic components, are also required to be miniaturized and improved in performance. At present, the manufacturing method of chip multilayer ceramic capacitors includes the following steps: (1) mixing and ball-milling ceramic powder, binder, solvent, etc. in a certain proportion to form ceramic slurry; Method coating and drying the ceramic slurry on a plastic support film to make a dielectric green sheet; (3) directly screen-printing an internal electrode layer on the dielectric green sheet obtain...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01G4/12H01G4/005H01G4/30H01G13/00
CPCH01G4/12H01G4/005H01G4/30H01G13/00
Inventor 马艳红刘杰鹏邱基华陈烁烁张磊徐苏龙孙健
Owner CHAOZHOU THREE CIRCLE GRP