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High speed tin plating additive and tin plating solution

A technology of additive and tin plating solution, applied in the directions of printed circuits, electrical components, printed circuit manufacturing, etc., can solve the problems of insufficient tin plating, inconvenience, and deterioration of the quality of the printed circuit board coating, and achieve a basically consistent appearance and uniform coating. Effect

Active Publication Date: 2022-05-13
珠海松柏科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Generally speaking, if the current is too high, it is easy to burn the coating, and if the current is too small, it is likely to cause insufficient tin plating. Both of them will lead to a decrease in the quality of the printed circuit board coating. Different printed circuit boards are used to control the magnitude of the current, but this is inconvenient

Method used

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  • High speed tin plating additive and tin plating solution
  • High speed tin plating additive and tin plating solution
  • High speed tin plating additive and tin plating solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] Embodiment 1 discloses a kind of tin plating liquid, comprises following raw material:

[0053] Concentration of 70% methanesulfonic acid 180g

[0054] Tin methanesulfonate 110g

[0055] High speed tin plating additive 40ml

[0056] Also includes deionized water, add deionized water until the tin plating solution system is 1L;

[0057] Among them, the high-speed tin plating additive contains the following raw materials:

[0058] Brightener 10g

[0059] Inhibitor 50g

[0060] Wetting and dispersing agent 10g

[0061] Leveler 5g

[0062] Antioxidant 5g.

[0063] Among them, the brightener is sodium vinyl sulfonate, the inhibitor is polyethylene glycol, the wetting and dispersing agent is polyoxyethylene polyoxypropylene PEO-PPO block polyether, and the leveling agent is 5g EO copolyether glycol BPA 10 and 5g of ß-naphthol ethoxylate 24, and the antioxidant is hydroquinone.

[0064] The preparation method of the tin plating solution is: mix the raw materials of th...

Embodiment 2

[0066] Embodiment 2 discloses a kind of tin plating liquid, comprises following raw material:

[0067] Concentration of 70% methanesulfonic acid 200g

[0068] Tin methanesulfonate 130g

[0069] High speed tin plating additive 50ml

[0070] Its preparation method is identical with embodiment 1. Among them, the raw materials and raw material consumption of high-speed tin plating additives are shown in the table below.

Embodiment 3-7

[0072] Embodiment 3-7 discloses a kind of tin plating liquid, comprises following raw material:

[0073] Concentration of 70% methanesulfonic acid 220g

[0074] Tin methanesulfonate 150g

[0075] High speed tin plating additive 60ml

[0076] Its preparation method is identical with embodiment 1. Among them, the raw materials and raw material consumption of high-speed tin plating additives are shown in the table below.

[0077] The raw material and raw material consumption (g) of the tin-plating solution of embodiment 1-7

[0078]

[0079] Among them, the types of brighteners, inhibitors, wetting and dispersing agents, leveling agents and antioxidants in Examples 2-7 are shown in the table below.

[0080] The kind of the raw material of the tin plating liquid of embodiment 1-7

[0081]

[0082]

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Abstract

The invention relates to the field of electroplating, which discloses a high-speed tin plating additive and a tin plating solution. The high-speed tin plating additive comprises the following raw materials in parts by weight: 0.5-15 parts of brightener, 10-100 parts of inhibitor, 5-30 parts of wetting and dispersing agent, 0.5-20 parts of leveling agent, and 1-20 parts of antioxidant. High-speed tin-plating additive of the present invention Under the synergistic effect of brightener, inhibitor, wetting dispersant, leveling agent and antioxidant, the high-speed tin-plating additive of the present invention can obtain a uniform plating layer when the current changes within a certain range. , The bright pure tin coating with basically the same appearance can be used to prepare tin plating solution.

Description

technical field [0001] The invention relates to the field of electroplating, more specifically, it relates to a high-speed tin plating additive and a tin plating solution. Background technique [0002] At present, the surface plating of printed circuit boards is a very mature technology. With the rapid innovation of electronic communication technology and the vigorous development of fully automatic mass production technology, the circuit design of printed circuit boards tends to be in the direction of dense and thin lines, blind holes, buried holes, high thickness-to-diameter ratio plating, and small hole plating Therefore, high requirements are put forward for the coating quality of printed circuit boards in continuous mass production, including the requirements for the coating thickness, uniformity, hardness, and brightness of printed circuit boards to be slightly different. [0003] Because tin metal has the advantages of corrosion resistance, non-toxicity, and easy braz...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/32H05K3/18
CPCC25D3/32H05K3/188
Inventor 莫庆生李光越饶猛
Owner 珠海松柏科技有限公司