Universal die for packaging, assembling and transferring CFP flat ceramic tube shell
A ceramic tube shell, general mold technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as different molds, and achieve the effect of overcoming the limitation of use space
Active Publication Date: 2021-03-26
XIAN MICROELECTRONICS TECH INST
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Problems solved by technology
[0005]
The purpose of the present invention is to overcome the shortcomings of different molds required for different processes of the existing packaging flow, and to provide a general mold for packaging, assembly and transfer of CFP flat ceramic shells
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[0027] In order to enable those skilled in the art to better understand the solutions of the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only It is an embodiment of a part of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.
[0028] It should be noted that the terms "first" and "second" in the description and claims of the present invention and the above drawings are used to distinguish similar objects, but not necessarily used to describe a specific sequence or sequence. It is to be understood that the data so used are interchangeable under appropriate ...
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The invention discloses a universal die for packaging, assembling and transferring a CFP flat ceramic tube shell, and belongs to the field of semiconductor integrated circuit packaging. According to the universal die for packaging, assembling and transferring the CFP flat ceramic tube shell, the tube shell is fixed to the die through the magnetic force effect of magnets on the CFP flat ceramic tube shell, high adhesive force is provided for the tube shell, the requirements of automatic bonding, automatic bonding and other technological processes for shell matrix formation and stability are met, the samarium-cobalt magnet can tolerate the highest temperature of 300 DEG C in the packaging process, after the tube shell is placed into a die, the universality of circulation in all packaging procedures can be achieved, and meanwhile a circuit can be turned over rapidly and conveniently in the transferring and pre-baking process. The limitation of a vacuum base on the use space of the die isovercome, and the die is reversely buckled and placed and cannot fall off from the die when a product is transferred.
Description
technical field [0001] The invention belongs to the field of packaging of semiconductor integrated circuits, in particular to a CFP flat ceramic shell package, assembly and transfer general mold. Background technique [0002] The packaging of military semiconductor integrated circuits requires airtight packaging. The main shells used include CDIP, CFP, CQFP, CBGA and other ceramic shells. With the development of high-density, miniaturized and high-performance products, CFP flat ceramic tubes Due to the smaller size of the shell and the simple assembly and welding process of the whole machine, it is one of the main application types of military ceramic shells. [0003] During the device packaging process, the shell mainly undergoes processes such as die bonding, baking and curing, wire bonding, internal visual inspection, and capping. In order to meet the requirements of automatic chip bonding process, automatic bonding process and automatic packaging process, each CFP flat ...
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Login to View More IPC IPC(8): H01L21/683
CPCH01L21/683
Inventor 李钰薛聪皇甫蓬勃王双龙蔺海波吕青朱渴望
Owner XIAN MICROELECTRONICS TECH INST