Ultra-thick crack-free aluminum oxide ceramic preparation method based on digital light treatment molding technolog

A technology of alumina ceramics and digital light processing, applied in the field of 3D printing, can solve problems such as inappropriate holding temperature or time, poor cracking, poor mechanical properties of ceramics, etc., achieve low cost, solve cracking, and promote The effect of sintering

Active Publication Date: 2021-03-30
ZHENGZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

WANG K pointed out that excessive heating rate, inappropriate holding temperature or time will cause large defects in the prepared ceramics, and such defects are difficult to heal in the subsequent high-temperature sintering process, thus leading to poor mechanical properties of the ceramics
However, the problem of cracking of ceramic samples with large wall thickness prepared by DLP technology has not been well solved.

Method used

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  • Ultra-thick crack-free aluminum oxide ceramic preparation method based on digital light treatment molding technolog
  • Ultra-thick crack-free aluminum oxide ceramic preparation method based on digital light treatment molding technolog
  • Ultra-thick crack-free aluminum oxide ceramic preparation method based on digital light treatment molding technolog

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Embodiment 1 (do not add calcium carbonate powder)

[0043] Weigh 78g alumina powder, 19.66g photosensitive resin (among them, EA 30wt%, PUA 10wt%; HDDA 30wt%, ACMO 14wt%, TMPTA 13wt%; photoinitiator 819 3 wt%), 2.34g dispersant, ball mill Stir evenly to prepare an alumina ceramic slurry with a solid content of 78wt%.

[0044] The three-dimensional graphics drawn by Solid works are designed in a size of 20mm×10mm×10mm, such as figure 1 As shown in -a, import into RayWareC software for slicing, the slice thickness is 20 μm, and export the 3D graphics after slicing as SSJ format files. After adjusting the printer, set the printing parameters, set the curing time of the base layer to 15s, the number of printing layers of the base layer to 5 layers, and the curing time of a single layer to 1.8s. After all preparations are complete, start to print layer by layer. After printing, carefully remove the ceramic green body from the printing platform and wipe off the uncured pas...

Embodiment 2

[0048] Weigh 77.22g of alumina powder, 0.78g of calcium carbonate powder, 19.66g of photosensitive resin, and 2.34g of dispersant, and mix them uniformly by ball milling to prepare an alumina ceramic slurry with a solid content of 78wt%.

[0049] Using the 3D graphics drawn by Solid works, the size of the nut is designed to be 30mm×30mm×12mm, as attached figure 2 As shown in -a, import it into RayWareC software for slicing, select the slice thickness as 20 μm, and export the 3D graphics after slicing as SSJ format files. After adjusting the printer, set the printing parameters, set the curing time of the base layer to 15s, the number of printing layers of the base layer to 5 layers, and the curing time of a single layer to 1.8s. After all preparations are complete, start to print layer by layer. After printing, carefully remove the ceramic green body from the printing platform and wipe off the uncured paste on the surface with alcohol.

[0050] Degrease and sinter the cerami...

Embodiment 3

[0052] Weigh 76.44g of alumina powder, 1.56g of calcium carbonate powder, 19.66g of photosensitive resin, and 2.34g of dispersant, and mix them uniformly by ball milling to prepare an alumina ceramic slurry with a solid content of 78wt%. Other steps are with embodiment 2.

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Abstract

The invention belongs to the technical field of 3D printing, and discloses an ultra-thick crack-free aluminum oxide ceramic preparation method based on a digital light treatment molding technology, which comprises the following steps: a) putting photosensitive resin, aluminum oxide powder, calcium carbonate powder and a dispersing agent into a ball mill, and stirring to obtain aluminum oxide ceramic slurry with solid phase content of 70-82%; b) drawing a three-dimensional graph by using Solids works, storing the three-dimensional graph as an STL format file, importing the three-dimensional graph into digital light processing forming printer matching software RayWareC for slicing, and exporting the sliced three-dimensional graph as an SSJ format file; c) pouring the alumina ceramic slurry into a trough, adjusting a printing platform, importing the SSJ format file model, setting printing parameters, and printing layer by layer to obtain a ceramic biscuit, wherein the printing parametersare set as follows: the curing time of the base layer is 15-20 seconds, the number of layers of the base layer is 5, and the curing time of the single layer is 1.5 seconds and 2.5 seconds; and d) sequentially putting the ceramic biscuit into a degreasing furnace and a sintering furnace for treatment to obtain the ultra-thick crack-free aluminum oxide ceramic.

Description

technical field [0001] The invention belongs to the technical field of 3D printing, and relates to a method for preparing super-thick crackless alumina ceramics based on digital light processing molding technology. Background technique [0002] Alumina ceramics are widely used due to their excellent properties, but it is difficult to prepare precise components by traditional manufacturing methods. With the rapid development of additive manufacturing technology, stereolithography (SL) stands out among various 3D technologies due to its excellent manufacturing precision. Marcus and Sachs first combined 3D printing technology with ceramic preparation in the 1990s. SL is divided into two types: stereolithography (SLA) and digital light processing (DLP) due to the different working principles of laser scanners. DLP is a kind of SLA based on mask technology, which has the advantages of fast molding speed and high precision. [0003] Digital Light Processing (DLP) is the control...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/10C04B35/622B33Y10/00B33Y50/00B33Y70/10
CPCC04B35/10C04B35/622B33Y70/10B33Y50/00B33Y10/00C04B2235/3208C04B2235/6026C04B2235/656C04B2235/6562C04B2235/6567
Inventor 杨道媛王瑞
Owner ZHENGZHOU UNIV
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