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PVC protective film and preparation method thereof

A protective film and liquid preparation technology, which is applied in the direction of film/sheet release coating, film/sheet adhesive, adhesive type, etc., can solve the influence of adhesive thickness, large shrinkage during thermosetting, PVC The shrinkage of the protective film and other issues can be avoided to avoid high-temperature baking, prevent excessive shrinkage, and ensure the performance of the product

Pending Publication Date: 2021-03-30
镝普材料(深圳)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if this route is used, due to the high temperature requirements for silicone curing conditions, the PVC protective film will be severely shrunk during the processing process, resulting in uneven film thickness, which will affect the thickness of the subsequent coating, and the thickness and thickness cannot be achieved. Viscous stability
Moreover, the PVC protective film raw materials contain plasticizers, such as DOP (dioctyl phthalate), DOTP (dioctyl terephthalate), etc. The presence of plasticizers will make the viscosity of the acrylate adhesive layer appear certain. degree of decline
In addition, the silicone release agent is coated on the back of the PVC protective film. When the PVC blue film is rewound, the acrylate adhesive layer will be in contact with the silicone release layer. Excessive transfer of silicone oil will also make the surface of the acrylate adhesive layer Contains silicon, which may cause silicone oil to transfer to the customer's wafer surface, resulting in wafer quality risks
Based on the above, there is a lot of room for improvement in the processing of the existing PVC blue protective film, and it is very easy to have problems such as excessive shrinkage during the thermosetting process, excessive transfer of silicone oil, and excessive drop in acrylate viscosity

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] The method for producing PVC protective film of the present invention may further comprise the steps:

[0031] a. Select a PVC protective film with a smooth surface roughness Ra value of 0.01 μm, a matte surface roughness Ra value of 0.4 μm, a tensile strength of 60 MPa, an elongation rate of 200%, and a thickness of 120 μm. After coating the release liquid on the smooth surface, bake it at 70°C for 30 seconds to cure the release liquid into a non-silicon release layer with a thickness of 0.3 μm;

[0032] Wherein the isopropanol solution is fully mixed by 12.5 parts by weight of isopropanol and 37.5 parts by weight of pure water, and then all the obtained isopropanol solution is put into 90 parts by weight of non-silicon release agent and mixed and dispersed into the above-mentioned release liquid;

[0033] b. After coating the matte surface of the PVC protective film in step a with the isolation solution, bake it at 70°C for 30 seconds and solidify it into an isolatio...

Embodiment 2

[0038] The method for producing PVC protective film of the present invention may further comprise the steps:

[0039] a. Select a PVC protective film with a smooth surface roughness Ra value of 0.02 μm, a matte surface roughness Ra value of 0.5 μm, a tensile strength of 50 MPa, an elongation rate of 150% and a thickness of 50 μm. After coating the release liquid on the smooth surface, bake it at 60°C for 120 seconds to cure the release liquid into a non-silicon release layer with a thickness of 0.4 μm;

[0040] Wherein the isopropanol solution is made by fully mixing 10 parts by weight of isopropanol and 30 parts by weight of pure water, and then all the obtained isopropanol solution is put into 110 parts by weight of non-silicon release agent and mixed and dispersed into the above-mentioned release liquid;

[0041] b. After coating the matt surface of the PVC protective film in step a with the isolation solution, bake it at 80°C for 60 seconds and solidify it into an isolati...

Embodiment 3

[0046] The method for producing PVC protective film of the present invention may further comprise the steps:

[0047] a. Select a PVC protective film with a smooth surface roughness Ra value of 0.01 μm, a matte surface roughness Ra value of 0.6 μm, a tensile strength of 40 MPa, an elongation rate of 250%, and a thickness of 80 μm. After coating the release liquid on the smooth surface, bake it at 80°C for 75 seconds to cure the release liquid into a non-silicon release layer with a thickness of 1 μm;

[0048] Wherein the isopropanol solution is made by fully mixing 5 parts by weight of isopropanol and 15 parts by weight of pure water, and then all the obtained isopropanol solution is put into 100 parts by weight of non-silicon release agent and mixed and dispersed into the above-mentioned release liquid;

[0049] b. After coating the matt surface of the PVC protective film in step a with the isolation solution, bake it at 60°C for 45 seconds and solidify it into an isolation ...

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Abstract

The invention relates to the technical field of protective films, in particular to a PVC protective film and a preparation method thereof; one surface of the PVC protective film is a smooth surface, and the other surface of the PVC protective film is a matte surface; a non-silicon release layer is arranged on the smooth surface of the PVC protective film; the matt surface of the PVC protective film is coated with an isolation coating; an acrylate adhesive layer is arranged on the surface, far away from the PVC protective film, of the isolation coating. According to the protective film and thepreparation method thereof, the cleanliness of the surface of the wafer is improved, the use performance of the wafer is ensured, and the PVC film is more uniform and smooth in thickness and stable inviscosity.

Description

technical field [0001] The invention relates to the technical field of protective films, in particular to a PVC protective film and a preparation method thereof. Background technique [0002] With the rapid development of the LED industry, LED wafer semiconductor technology is also changing with each passing day. According to the existing LED wafer semiconductor development process, laser technology needs to be applied in the process of cutting materials, and in the laser processing process, it is first necessary to ensure that the LED wafer semiconductor is not affected by the laser to avoid damage to the wafer. [0003] Under the background of the above-mentioned dicing technology, the dicing protection film for LED wafer substrate was born. Due to foreign technology secrecy and material embargo, the technology of cutting protective film for LED wafer substrates in China is still in the early stage of development and exploration. Basically, the processing route of PET pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/24C09J7/20C09J7/50C09J7/30C09J133/04C09D5/20
CPCC09J7/245C09J7/201C09J7/50C09J7/30C09J133/04C09D5/20C09J2427/006C09J2427/003C09J2451/003C09J2433/00
Inventor 陈维林刘泓铭林志耿任华伟
Owner 镝普材料(深圳)有限公司
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