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Packaging structure and packaging method of semiconductor laser capable of reducing oscillation threshold

A packaging structure and semiconductor technology, applied in the direction of semiconductor lasers, lasers, laser parts, etc., can solve the problems of large size of lasers, inability to play well and reflect the performance and characteristics of semiconductor lasers, and achieve low process difficulty and reduce oscillation. Threshold, the effect of reducing loss

Inactive Publication Date: 2021-03-30
广东鸿芯科技有限公司
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  • Description
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Problems solved by technology

The volume of the laser made by the existing method is huge, and in many occasions it is impossible to give full play to and reflect the performance and characteristics of the semiconductor laser

Method used

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  • Packaging structure and packaging method of semiconductor laser capable of reducing oscillation threshold
  • Packaging structure and packaging method of semiconductor laser capable of reducing oscillation threshold
  • Packaging structure and packaging method of semiconductor laser capable of reducing oscillation threshold

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Embodiment Construction

[0040] In order to make the purpose, technical solutions and advantages of the present disclosure clearer, the present disclosure will be further described in detail below in conjunction with specific embodiments.

[0041] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present specification shall have ordinary meanings understood by those skilled in the art to which the present disclosure belongs. "First", "second" and similar words used in the embodiments of this specification do not indicate any sequence, quantity or importance, but are only used to distinguish different components. "Comprising" or "comprising" and similar words mean that the elements or items appearing before the word include the elements or items listed after the word and their equivalents, without excluding other elements or items. Words such as "connected" or "connected" are not limited to physical or mechanical connections, but m...

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Abstract

The invention provides a packaging structure and a packaging method of a semiconductor laser capable of reducing an oscillation threshold. The packaging structure comprises a semiconductor laser, a semiconductor cooler, and a first metal layer disposed between the semiconductor laser and the semiconductor cooler. The semiconductor refrigerator comprises a silicon substrate, a metal electrode arranged on the silicon substrate, a semiconductor thermoelectric material deposited on the metal electrode, and a P-N structure etched on the semiconductor thermoelectric material. The semiconductor lasercomprises a substrate, a second metal layer arranged on the substrate, a silicon-oxygen compound filled between adjacent metals, and an ALD film layer, an insulating dielectric layer, a PMMA layer and an active layer which are sequentially arranged on the second metal layer and a structural layer formed by filling the silicon-oxygen compound; an annular hole cavity penetrating through the ALD film layer, the insulating medium layer and the PMMA layer is formed in the semiconductor laser, and a reflecting film layer is arranged in the annular hole cavity. According to the present invention, the performance and the light mixing prevention effect of the laser can be improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor optoelectronics, in particular to a packaging structure of a semiconductor laser capable of lowering an oscillation threshold and a packaging method thereof. Background technique [0002] Semiconductor lasers have the characteristics of high efficiency, small size, light weight, long life, simple manufacture, and low cost; they have obtained patents in laser printing, laser ranging, laser radar, optical fiber communication, infrared lighting, atmospheric monitoring, and chemical spectroscopy. Wide range of applications. In the early days, semiconductor lasers usually used photonic crystal microcavities or dielectric cavities formed by coating multiple layers of high-reflective dielectric films on both ends of the active layer as optical resonators. In 2007, the theoretical research results of A.V.Maslov and C.Z.Ning showed that metal cavities have stronger localization ability to electromag...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/024H01S5/02355
CPCH01S5/0215H01S5/02415
Inventor 毛森王中和陆凯凯焦英豪
Owner 广东鸿芯科技有限公司
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