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A kind of preparation method of wafer locking ring

A locking ring and wafer technology, which is used in manufacturing tools, heat treatment equipment, metal processing equipment, etc., can solve the problem that the flatness is not easy to control, and achieve the effect of ensuring the flatness, preventing large deformation, and ensuring the flatness.

Active Publication Date: 2022-05-24
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, even if the rapid detection of flatness can be realized during the preparation process of the wafer locking ring, it still fails to fundamentally solve the problem that the flatness is not easy to control

Method used

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  • A kind of preparation method of wafer locking ring
  • A kind of preparation method of wafer locking ring
  • A kind of preparation method of wafer locking ring

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0068] like image 3 As shown, the preparation method of the wafer locking ring of the present invention comprises the following steps:

[0069] (1) carrying out forging and drawing treatment of cylindrical titanium ingot, then carrying out the first heat treatment to obtain titanium forging and drawing parts;

[0070] (2) hot-rolling the titanium forgings described in step (1), and then performing the second heat treatment to obtain titanium hot-rolling;

[0071] (3) hollow out the central part of the titanium hot-rolled piece described in step (2) through rough turning, and then carry out the third heat treatment to obtain the titanium ring piece;

[0072] (4) Finishing the titanium ring in step (3) according to the target size to obtain a wafer locking ring.

Embodiment 1

[0074] The present embodiment provides a preparation method of a wafer locking ring, and the preparation method includes the following steps:

[0075] (1) Prepare a cylindrical titanium ingot with a purity of 99.9%, a diameter of 180 mm and a length of 120 mm, and carry out forging treatment at 950°C. Carry out upsetting according to the upsetting and forging ratio of 2.22, repeat 2 times and then water-cool, then carry out the first heat treatment at 650 ° C for 120 min, and obtain titanium forgings through air cooling;

[0076] (1') The titanium forging in step (1) is subjected to re-forging treatment at 800°C, and each re-forging treatment is first drawn and elongated according to the drawing and forging ratio of 2, and then according to the upsetting and forging ratio. Upsetting was carried out for 2.22, repeated 2 times and then water-cooled, and then the fourth heat treatment was carried out at 650 ° C for 120 min to obtain titanium forgings again;

[0077] (2) The tita...

Embodiment 2

[0081] The present embodiment provides a preparation method of a wafer locking ring, and the preparation method includes the following steps:

[0082] (1) Prepare a cylindrical titanium ingot with a purity of 99.9%, a diameter of 150 mm and a length of 150 mm, and carry out forging treatment at 900 °C. Carry out upsetting according to the upsetting and forging ratio of 2.5, repeat 3 times and then water-cool, then carry out the first heat treatment at 600 ° C for 150 min, and obtain titanium forgings through air cooling;

[0083] (1') The titanium forging in step (1) is subjected to re-forging treatment at 750°C, and each re-forging treatment is firstly drawn according to the drawing and forging ratio of 2, and then according to the upsetting and forging ratio. Upsetting was carried out for 2.5, repeated 3 times after water cooling, and then the fourth heat treatment was carried out at 600 ° C for 150 min to obtain a titanium forging again;

[0084] (2) The titanium re-forgin...

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Abstract

The invention relates to a method for preparing a wafer locking ring. In the preparation method, a cylindrical titanium ingot is first subjected to forging treatment, first heat treatment, hot rolling treatment and second heat treatment to obtain a titanium hot-rolled piece, and then undergoes rough Turning hollows out the central part of the titanium hot-rolled piece, then performs a third heat treatment to obtain a titanium ring, and finally performs finish turning on the titanium ring according to the target size to obtain a wafer locking ring. The preparation method of the present invention adds a third heat treatment between rough turning and finishing turning, which effectively prevents the problem of large deformation in the process of transforming cylindrical hot-rolled titanium parts into titanium ring parts, and then prepares flatness ≤ The 0.1mm wafer locking ring greatly improves the yield.

Description

technical field [0001] The invention relates to the technical field of wafer deposition and coating, in particular to a preparation method of a wafer locking ring. Background technique [0002] Physical vapor deposition (Physical Vapour Deposition, PVD) refers to the use of low-voltage, high-current arc discharge technology under vacuum conditions, the use of gas discharge to vaporize the material source and ionize the vaporized material and gas, and then pass through. The acceleration of the electric field causes the evaporated substances and their reaction products to be deposited on the workpiece to form a film with a special function. Physical vapor deposition technology is the core technology of semiconductor chip manufacturing, solar energy industry, LCD manufacturing and other industries. The main methods include vacuum evaporation, arc plasma plating, ion coating, molecular beam epitaxy and sputtering coating. Among them, sputtering is the use of ions generated by a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23P15/00B21J5/00C21D9/00C21D9/40C22F1/18C23C14/50
CPCB23P15/00B21J5/002C22F1/183C21D9/0075C21D9/40C23C14/50
Inventor 姚力军边逸军潘杰王学泽章丽娜
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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