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Double auxiliary milling device and method for crisp and hard material machining

A technology for milling and processing hard and brittle materials, applied in metal processing, metal processing equipment, milling machine equipment, etc., can solve problems such as tool wear and low material removal rate

Inactive Publication Date: 2021-04-13
HUAQIAO UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the fact that the difficult-to-machine characteristics of hard and brittle materials have not changed in essence, the current ultrasonic vibration milling method still faces the problems of severe tool wear and low material removal rate in the processing occasions with large material removal.

Method used

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  • Double auxiliary milling device and method for crisp and hard material machining
  • Double auxiliary milling device and method for crisp and hard material machining
  • Double auxiliary milling device and method for crisp and hard material machining

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Embodiment Construction

[0024] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention; obviously, the described embodiments are only some of the embodiments of the present invention, not all of them, based on The embodiments of the present invention and all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0025] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the term "upper" is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying References to devices or elements must have a particular orientation, be constructed,...

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Abstract

The invention provides a double auxiliary milling device and method for crisp and hard material machining and relates to the technical field of crisp and hard material milling. The machining method comprises heating and softening a to-be-machined region of a workpiece by using a laser heat source first to reduce the hardness of the material and improve the cutting machinability of the material; and then carrying out ultrasonic auxiliary milling on the crisp and hard material by using a three-dimensional ultrasonic vibrating system formed by compounding elliptical vibration of a worktable and axial vibration of a cutter. Through laser heating and softening and ultrasonic vibration assisting, the method can improve the machinability of the material and improve the moving track between the cutter and the workpiece, so that a cutting force and cutter wear are reduced, the material removal rate and the surface intactness are improved and finally, an efficient precise machining problem of the crisp and hard material is solved. The invention further provides a double auxiliary milling method for crisp and hard material machining.

Description

technical field [0001] The invention relates to the technical field of processing hard and brittle materials, in particular to a laser ultrasonic dual-assisted milling method and device which can be used for processing hard and brittle materials. Background technique [0002] Hard and brittle materials such as ceramics, cemented carbide, and glass have extremely broad application prospects in the fields of aerospace, space technology, medicine, and precision manufacturing due to their low density, high strength, high temperature resistance, and wear resistance. Key components made of these materials have a high service life and application characteristics compared with traditional materials due to their excellent mechanical properties. But at the same time, hard and brittle materials must be processed by precision machining to achieve high dimensional accuracy and surface quality requirements. Due to their high hardness and brittleness and low fracture toughness, high requir...

Claims

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Application Information

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IPC IPC(8): B23C3/00B23P25/00
CPCB23C3/00B23P25/006
Inventor 吴贤曾凯沈剑云李远陈永昌杜明扬
Owner HUAQIAO UNIVERSITY
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