Preparation method of transfer type heat conduction coating for LED lamp back plate

Abstract

The invention discloses a preparation method of a transfer type heat conduction coating for an LED lamp back plate, belongs to the technical field of LED lamps. Heat at the joint of the heat conduction coating and the back plate is partially gathered in a manner of embedding a heat transfer ball in the heat conduction coating, then the internal deformation action of a heat transfer ball is triggered, and a heat conduction fluid is forced to flow in a designated mode in an expansion mode, so that a heat accumulation ball is forced to slow down heat accumulation, the heat conduction fluid is guided into an outer heat dissipation ball bag through a connecting guide pipe to expand outside, the heat dissipation efficiency to the outside is improved, then rapid heat transfer is achieved, and after heat transfer is finished, resetting is conducted again to recover heat accumulation of the next round, heat is rapidly transferred through repeated flowing of the heat conduction fluid, the heat conduction coating can be assisted in rapidly transferring heat to the outside, and the heat dissipation efficiency of the back plate is greatly improved.

Description

technical field [0001] The invention relates to the technical field of LED lamps, in particular to a method for preparing a transfer-type thermally conductive coating for a backplane of an LED lamp. Background technique [0002] LED display is a kind of flat-panel display, which is composed of small LED module panels. It is used to display various information such as text, images, videos, and video signals. It needs a backplane to truly play a display role. In the prior art, aluminum-magnesium alloy is generally used as the LED backplane. [0003] According to the characteristics of aluminum-magnesium alloy, its advantages as LED backplane are: 1. Corrosion resistance; 2. High strength; 3. Excellent electromagnetic shielding performance; 4. Easier coloring than other aluminum-based materials; 5. Good thermal conductivity Performance; 6. Has a certain impact resistance. But it has limitations brought by the material itself: 1. The thermal conductivity is lower than that of ...

AI Technical Summary

Problems solved by technology

But it has limitations brought by the material itself: 1. The thermal conductivity is lower than that of pure aluminum, magnesium-based alloys and other materials. When applied to cold light LEDs, there is a problem of heat dissipation when the LEDs are in a high-temperature environment (because the aluminum-magnesium alloy contains Not resistant to heat, easy to fail or even burned); 2. High brittleness, poor fatigue performance, and easy to break under the action of large impact force or cyclical stress; 3. The most important heat dissipation of LED materials is through air conduction (Instead of radiation and light energy conversion in the conventional sense, because most of the radiant heat still exists in the LED element, and the same is true for light energy conversion), and the poor formability of aluminum-magnesium alloys makes it suitable for The structure of micro-fins that convect with the air is more costly

[0004] In the prior art, a heat-conducting coating is used to assist the backplane to efficiently dissipate heat, but the heat dissipation effect is very limited, and it is far from reaching the heat generation efficiency of the backplane, especially for LED lamps that are sealed and packaged, the heat dissipation is even greater. The heat dissipation is limited and cannot meet the heat dissipation requirements of the aluminum-magnesium alloy backplane. The heat is easy to accumulate in the connection area between the thermal conductive coating and the backplane and it is difficult to dissipate it in time. As a result, the temperature in this area is significantly higher than other areas, which affects the work of the LED. The state has some interference

Images