Method for preparing anode of silicon-based OLED micro display by using mask plate technology

Abstract

The invention discloses a method for preparing an anode of a silicon-based OLED (Organic Light Emitting Diode) micro display by using a mask plate technology. The method comprises the following steps: punching a 12-inch quartz glass wafer by using an NDL (Non-Dispersive Laser) technology with the standards of the through hole dimension of 3*9 microns and the thickness of 40-50 microns, adhering the through hole glass wafer to the 12-inch silicon wafer to serve as a mask, and performing magnetron sputtering of metal to obtain anode pixel points with accurate patterns. According to the technology, a transparent glass mask plate with through holes is used for replacing a traditional photoetching mask plate to prepare anode pixel points, alignment of the mask plate and a silicon wafer is facilitated, etching controllability of glass is good, and introduction of a liquid environment is avoided in the anode preparation process; the metal work function and the hole injection capability are prevented from being influenced by anode metal surface corrosion, and the anode metal selectivity is improved.

Description

technical field [0001] The invention relates to the technical field of OLED microdisplays, in particular to a method for preparing silicon-based OLED microdisplay anodes by mask plate technology. Background technique [0002] Silicon-based OLED microdisplays are considered to be the most suitable new display technology for the near-eye display industry due to their small size, light weight, low power consumption, and high resolution. With the increasing popularity of 5G commercialization, the improvement of the civilian VR / AR field and the advancement of military equipment informatization, silicon-based microdisplays have attracted extensive attention and invested a lot of research by major companies at home and abroad. [0003] One of the key technologies for designing and manufacturing silicon-based OLEDs is the patterning process of the anode. At present, the more common patterning methods are photolithography mask technology (Photo-mask) and via hole mask technology (Ope...

AI Technical Summary

Problems solved by technology

The main disadvantage of photolithographic mask technology is that the process of patterned pixel point manufacturing involves a liquid environment. The introduction of the solution is mainly to strip off the photoresist in the non-pixel area and evaporate the nano-scale metal layer on the photoresist, so that Form accurate graphic pixel points

Regardless of whether it is a strongly alkaline developer or a weakly alkaline stripper, long-term immersion will cause a certain degree of corrosion on the surface of some anode metals, affecting the work function and hole injection ability of the metal, making the selection of anode materials difficult. Reduced, resulting contamination can affect the performance and lifetime of silicon-based microdisplays

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