Preparation method of radio frequency tube shell and radio frequency tube shell

Abstract

The invention is suitable for the technical field of microwave components, and provides a radio frequency tube shell preparation method and a radio frequency tube shell, and the method comprises the steps: sputtering a plurality of layers of metal on a substrate to obtain a first seed layer, and respectively preparing gold conductor layers on a first region and a second region of the first seed layer through electrogilding; removing the first seed layer outside the region of the gold conductor layer, and preparing a thin-film resistor between the first region and the second region to obtain a first sample; baking the first sample at a first preset temperature and carrying out air annealing to obtain a second sample; sputtering multiple layers of metal on the surface of the second sample to obtain a second seed layer, and electroplating copper on the second seed layer to prepare a copper conductor layer; electroplating copper again on a fourth region in the third region, and heightening the copper conductor layer; and removing the second seed layer outside the region of the copper conductor layer. High-precision gold conductor layer preparation is completed so that high-density wiring can be realized, electromigration can be prevented by preparing the superposition structure of the copper conductor layer and the gold conductor layer, and long-term stability of the device can be guaranteed.

Description

technical field [0001] The invention belongs to the technical field of microwave components, and in particular relates to a method for preparing a radio frequency shell and the radio frequency shell. Background technique [0002] With the continuous optimization of RF chips in terms of power, efficiency, and size, analog circuit functional modules such as power amplification, filtering, and switching can be realized by a single bare chip or by stacking several chips. In order to finally integrate microwave components with complete functions in a single package, further improve the integration level, and realize the deviceization of microwave components, it is necessary to integrate digital circuit chips such as AD / DA, power control and digital processing into the RF package, so the RF package Under the premise of satisfying high reliability, air tightness and low loss characteristics, it is necessary to integrate not only narrow line width and high density interconnection li...

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Problems solved by technology

[0004] In view of this, the embodiment of the present invention provides a method for preparing a radio frequency package and a radio frequency package, aiming to solve the problem of low integration in the prior art, and the increase of the integration will bring multi-chip interconnection wiring and radio frequency unit Dense arrangement requires heat dissipation and isolation

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