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Resin composition

A resin composition and compound technology, applied in the direction of non-polymer organic compound adhesives, adhesive types, adhesive additives, etc., can solve the problem of large deviation of properties, etc., to reduce the deviation of properties and properly cure Time, productivity improvement effect

Active Publication Date: 2021-04-23
NAMICS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is difficult to finely adjust the curing time of the resin composition containing the 2-methylene-1,3-dicarbonyl compound only by adjusting the type and amount of the basic compound.
In addition, in such a resin composition, variations in characteristics become large

Method used

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  • Resin composition
  • Resin composition
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～16 and comparative example 2、3

[0183] Component (c) or (c') was added dropwise to 1.00 g of component (a) in a polypropylene microtube so that the molar ratio to component (a) became the value shown in Table 3, and mixed. Component (b) was added to the obtained mixture so that the molar ratio with respect to component (a) might become the value shown in Table 3, and it was shaken and mixed with the vortex mixer again, and the resin composition was obtained.

[0184] The time (gel time) until the above-mentioned resin composition substantially loses fluidity from the time of completion of this mixing was measured at room temperature (25 degreeC). Table 3 shows the gel time (unit: min) of each resin composition together with the molar ratio of each component in the resin composition. In addition, in Table 3, the mass ratio (unit: mass ppm) of components (c) and (c') to the whole resin composition is also described together.

[0185] "Practically loses fluidity" means that when the above-mentioned resin compo...

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PUM

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Abstract

The purpose of the present invention is to provide a resin composition which can be produced stably with reduced variations in properties, can be improved in productivity, and is suitable as a one-pack adhesive agent that can be used in the manufacture of an electronic component. The resin composition according to the present invention contains an anionic polymerization inhibitor comprising (a) at least one 2-methylene-1,3-dicarbonyl compound, (b) an initiator comprising at least one basic substance and (c) at least one boric acid ester compound.

Description

technical field [0001] The present invention relates to a one-component adhesive resin composition suitable for applications requiring thermal curing at low temperatures, preferably at room temperature. Background technique [0002] Conventionally, as a one-component adhesive for electronic components, a thiol-based adhesive containing an epoxy resin, a polythiol compound, and a curing accelerator as essential components, and a radical initiator as an essential component are known. There are also known one-component adhesives that can be cured at about 80°C. However, in order to improve manufacturing efficiency, a one-component adhesive that can be cured at a lower temperature is required. [0003] In recent years, like Patent Documents 1 and 2, it has been disclosed that a methylene malonate compound (2-methylene-1,3-dicarbonyl compound) can be produced in a short time even at a low temperature such as room temperature. Internally cured resin composition. Patent Document...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F22/14C08L35/02C09J4/00C09J11/06
CPCC09J4/00C08F122/14C08F222/14C08F22/14C08F2/40C09J11/06C09J135/02
Inventor 佐藤文子新井史纪
Owner NAMICS CORPORATION
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