Micromechanical resonator with anchor point auxiliary structure and preparation method thereof
A micromechanical resonator and auxiliary structure technology, applied in the field of microelectronics, can solve the problems affecting the miniaturization of the resonator size, etc., and achieve the effect of low energy consumption
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Embodiment 1
[0059] The present invention provides a preparation method of a piezoelectric micromechanical resonator as shown in Figure 5, and the specific steps are as follows:
[0060] (1.1) Provide an SOI wafer with a cavity;
[0061] (1.2) Deposit the lower electrode, the piezoelectric film and the upper electrode sequentially on the SOI wafer, and pattern the upper electrode;
[0062] (1.3) Deposit a layer of oxide on the wafer;
[0063] (1.4) Etching the upper and lower electrode through holes to expose the upper and lower electrodes;
[0064] (1.5) Depositing aluminum and patterning to form metal pads;
[0065] (1.6) Etching releases the resonator structure.
Embodiment 2
[0067] The invention provides another preparation method of a piezoelectric micromechanical resonator, the specific steps are as follows:
[0068] (1.1) Deposit the lower electrode, the piezoelectric film and the upper electrode sequentially on the SOI wafer, pattern the upper electrode, and then deposit a layer of oxide;
[0069] (1.2) Etch the upper and lower electrode through holes to expose the upper and lower electrodes;
[0070] (1.3) Depositing aluminum and patterning to form metal pads;
[0071] (1.4) Etching a cavity from the back side of the wafer;
[0072] (1.5) Etch the resonator structure on the front side.
Embodiment 3
[0074] The present invention provides a method for preparing a capacitive or piezoresistive micromechanical resonator as shown in Figure 6, and the specific steps are as follows:
[0075] (2.1) Provide an SOI wafer with a cavity;
[0076] (2.2) Depositing aluminum and patterning to form metal pads;
[0077] (2.3) Etching to obtain the resonator structure.
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