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Micromechanical resonator with anchor point auxiliary structure and preparation method thereof

A micromechanical resonator and auxiliary structure technology, applied in the field of microelectronics, can solve the problems affecting the miniaturization of the resonator size, etc., and achieve the effect of low energy consumption

Pending Publication Date: 2021-05-04
武汉敏声新技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the anchor point structure can be designed to be 1 / 4 of the resonant wavelength of the micromechanical resonator, and the anchor point loss can be reduced by enhancing the reflection of the acoustic wave at the end of the anchor point structure, but the anchor point size of this design will reach tens of to a few hundred microns, affecting the miniaturization of the resonator size

Method used

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  • Micromechanical resonator with anchor point auxiliary structure and preparation method thereof
  • Micromechanical resonator with anchor point auxiliary structure and preparation method thereof
  • Micromechanical resonator with anchor point auxiliary structure and preparation method thereof

Examples

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Embodiment 1

[0059] The present invention provides a preparation method of a piezoelectric micromechanical resonator as shown in Figure 5, and the specific steps are as follows:

[0060] (1.1) Provide an SOI wafer with a cavity;

[0061] (1.2) Deposit the lower electrode, the piezoelectric film and the upper electrode sequentially on the SOI wafer, and pattern the upper electrode;

[0062] (1.3) Deposit a layer of oxide on the wafer;

[0063] (1.4) Etching the upper and lower electrode through holes to expose the upper and lower electrodes;

[0064] (1.5) Depositing aluminum and patterning to form metal pads;

[0065] (1.6) Etching releases the resonator structure.

Embodiment 2

[0067] The invention provides another preparation method of a piezoelectric micromechanical resonator, the specific steps are as follows:

[0068] (1.1) Deposit the lower electrode, the piezoelectric film and the upper electrode sequentially on the SOI wafer, pattern the upper electrode, and then deposit a layer of oxide;

[0069] (1.2) Etch the upper and lower electrode through holes to expose the upper and lower electrodes;

[0070] (1.3) Depositing aluminum and patterning to form metal pads;

[0071] (1.4) Etching a cavity from the back side of the wafer;

[0072] (1.5) Etch the resonator structure on the front side.

Embodiment 3

[0074] The present invention provides a method for preparing a capacitive or piezoresistive micromechanical resonator as shown in Figure 6, and the specific steps are as follows:

[0075] (2.1) Provide an SOI wafer with a cavity;

[0076] (2.2) Depositing aluminum and patterning to form metal pads;

[0077] (2.3) Etching to obtain the resonator structure.

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Abstract

The invention discloses a micromechanical resonator with an anchor point auxiliary structure and a preparation method thereof, and the method comprises the steps: carrying out the optimization design of the geometric dimension of the anchor point structure of the micromechanical resonator, and adding the anchor point auxiliary structure at the tail end of the anchor point structure, so as to adjust the vibration node position of a resonant oscillator. Therefore, the anchor point loss of the micromechanical resonator is reduced by restraining the vibration of the anchor point, and the Q value of the micromechanical resonator is improved. The length of the anchor point auxiliary structure preferably has a specific geometric dimension, that is to say, the length of the anchor point auxiliary structure is an optimized value for a micromechanical resonator with a specific frequency, a specific thickness, a specific anchor point structure, a specific material and a specific dimension. And when the length of the anchor point auxiliary structure is a preferred value, the mechanical amplitude at the boundary of the resonant oscillator and the anchor point structure is minimum, and the energy consumption of the resonator propagating to the substrate is minimum.

Description

technical field [0001] The invention relates to the technical field of microelectronics, in particular to a micromechanical resonator with an anchor auxiliary structure and a preparation method thereof. Background technique [0002] Micro-electro-mechanical systems (MEMS) is a miniaturized mechanical device or system manufactured based on advanced semiconductor processing technology, with small size, light weight, low power consumption, low price, stable performance and integration Advanced advantages. With the development trend of miniaturization of various electronic devices and systems, MEMS technology and devices have been widely used in many fields such as sensors, electronic devices, wireless communication systems and wearable electronic products. MEMS technology intersects multidisciplinary technologies such as microelectronics, mechanics, materials science, mechanics, and chemistry, and covers physical theories such as force, sound, electricity, and magnetism at the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H9/02
CPCH03H9/02433
Inventor 吴国强陈文贾文涵
Owner 武汉敏声新技术有限公司
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