Micro-nano compound silver-copper alloy welding paste used for low-temperature sintering and interconnection and production method

A silver-copper alloy and low-temperature sintering technology, which is applied in the field of device packaging, can solve problems such as pure nano-solder paste cracks, and achieve the effects of simple preparation methods, meeting sealing requirements, and delaying electrical/thermal migration

Active Publication Date: 2021-05-07
HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The purpose of the present invention is to provide a micro-nano composite silver-copper alloy solder paste and preparation method for low-temperature sintering interconnection, aiming at replacing traditional Sn-based solder, and solving the electromigration problem of silver and the anti-oxidation problem of copper, And the crack problem of pure nano-solder paste in the sintering process
At the same time, the method of combining micro and nano particles solves the problem of large volume shrinkage of pure nano solder paste during sintering, which is beneficial to increase production and is suitable for mass production

Method used

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  • Micro-nano compound silver-copper alloy welding paste used for low-temperature sintering and interconnection and production method

Examples

Experimental program
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Effect test

Embodiment 1

[0037] A micro-nano composite silver-copper alloy solder paste for low-temperature sintering interconnection, comprising nano-silver-copper alloy particles, micron silver particles and an organic carrier. In terms of mass percentage, the nano-silver-copper alloy particles account for 50%, the micro-silver particles account for 20%, and the organic carrier accounts for 30%.

[0038] Step S1: the Cu(NO 3 ) 2 and AgNO 3 As a precursor, the silver-copper molar ratio in the preparation of nano-silver-copper alloy is 4:1, which is dissolved in deionized water according to a certain ratio, which is recorded as solution A;

[0039] Step S2: Dissolve polyvinylpyrrolidone with a molecular weight of 15000 in deionized water at a molar ratio of 5:1 to the precursor, which is referred to as solution B.

[0040] Step S3: Dissolve sodium borohydride in deionized water to a concentration of 3 mol / L, which is referred to as solution C.

[0041] Step S4: Pour solution A and solution B into ...

Embodiment 2

[0048] A micro-nano composite silver-copper alloy solder paste for low-temperature sintering interconnection, comprising nano-silver-copper alloy particles, micron silver particles and an organic carrier. In terms of mass percentage, the nano silver copper alloy particles account for 65%, the micron silver particles account for 10%, and the organic carrier accounts for 25%.

[0049] Step S1: the Cu(NO 3 ) 2 and AgNO 3 As a precursor, the silver-copper molar ratio in the preparation of nano-silver-copper alloy is 6:1, which is dissolved in deionized water according to a certain ratio, which is recorded as solution A;

[0050] Step S2: Dissolve polyvinylpyrrolidone with a molecular weight of 150,000 in deionized water at a molar ratio of 5:1 to the precursor, which is referred to as solution B.

[0051] Step S3: Dissolve sodium borohydride in deionized water to a concentration of 3 mol / L, which is referred to as solution C.

[0052] Step S4: Pour solution A and solution B in...

Embodiment 3

[0058] A micro-nano composite silver-copper alloy solder paste for low-temperature sintering interconnection, comprising nano-silver-copper alloy particles, micron silver particles and an organic carrier. In terms of mass percentage, the nano-silver-copper alloy particles account for 70%, the micro-silver particles account for 18%, and the organic carrier accounts for 32%.

[0059] Step S1: the Cu(NO 3 ) 2 and AgNO 3 As a precursor, the silver-copper molar ratio in the preparation of nano-silver-copper alloy is 6:1, which is dissolved in deionized water according to a certain ratio, which is recorded as solution A;

[0060] Step S2: Sodium citrate was dissolved in deionized water, and the molar ratio of it to the precursor was 10:1, which was recorded as solution B.

[0061] Step S3: Dissolve sodium borohydride in deionized water to a concentration of 3 mol / L, which is referred to as solution C.

[0062] Step S4: Pour solution A and solution B into the container and mix ev...

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Abstract

The invention provides micro-nano compound silver-copper alloy welding paste used for low-temperature sintering and interconnection and a production method. The production method comprises the following steps: evenly mixing an organic solvent, a thickener, a dispersant, a coupling agent and a defoamer according to a certain ratio to produce an organic carrier of the micro-nano compound silver-copper alloy welding paste; and then evenly mixing silver-copper nano-alloy particles and silver microparticles which are produced through a chemical reduction method, and a certain amount of the organic carrier to obtain the micro-nano compound silver-copper alloy welding paste used for low-temperature sintering and interconnection. According to the micro-nano compound silver-copper alloy welding paste used for low-temperature sintering and interconnection and the production method, by adopting a solid solution alloy principle to dope a silver phase with copper atoms, the single-phase silver-copper alloy particles are obtained; the problem of oxidation of copper is solved, meanwhile, due to doping of the copper atoms, the atom diffusion rate is reduced, the problem of massive volume shrinkage of pure nanometer welding paste in sintering processes is solved, and meanwhile, cost reduction and yield raising are facilitated, so that the micro-nano compound silver-copper alloy welding paste used for low-temperature sintering and interconnection and the production method are suitable for mass production; and the micro-nano compound silver-copper alloy welding paste can be substituted for traditional Sn-based solder and pure nano-Ag paste in low-temperature connection of third-generation semiconductors, and has higher reliability.

Description

technical field [0001] The invention relates to the field of device packaging, more specifically, a micro-nano composite silver-copper alloy solder paste for low-temperature sintering interconnection and a preparation method are designed. Background technique [0002] With the rapid development of electronic science and technology, electronic components are developing towards high power and miniaturization. Especially in the field of packaging, with the emergence of third-generation semiconductor materials such as SiC and GaN, devices need to serve at high temperatures and high currents, which puts forward higher requirements for chip interconnect materials. Therefore, the development of new packaging materials for low-temperature connection and high-temperature service is of great significance to the development and application of third-generation semiconductors. [0003] The traditional Sn-based solder is widely used because it can be connected at a lower temperature. Ho...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/02B23K35/30B23K35/362
CPCB23K35/025B23K35/3006B23K35/302B23K35/362
Inventor 李明雨杨婉春郑威祝温泊王春青
Owner HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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