Micro-nano compound silver-copper alloy welding paste used for low-temperature sintering and interconnection and production method
A silver-copper alloy and low-temperature sintering technology, which is applied in the field of device packaging, can solve problems such as pure nano-solder paste cracks, and achieve the effects of simple preparation methods, meeting sealing requirements, and delaying electrical/thermal migration
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Embodiment 1
[0037] A micro-nano composite silver-copper alloy solder paste for low-temperature sintering interconnection, comprising nano-silver-copper alloy particles, micron silver particles and an organic carrier. In terms of mass percentage, the nano-silver-copper alloy particles account for 50%, the micro-silver particles account for 20%, and the organic carrier accounts for 30%.
[0038] Step S1: the Cu(NO 3 ) 2 and AgNO 3 As a precursor, the silver-copper molar ratio in the preparation of nano-silver-copper alloy is 4:1, which is dissolved in deionized water according to a certain ratio, which is recorded as solution A;
[0039] Step S2: Dissolve polyvinylpyrrolidone with a molecular weight of 15000 in deionized water at a molar ratio of 5:1 to the precursor, which is referred to as solution B.
[0040] Step S3: Dissolve sodium borohydride in deionized water to a concentration of 3 mol / L, which is referred to as solution C.
[0041] Step S4: Pour solution A and solution B into ...
Embodiment 2
[0048] A micro-nano composite silver-copper alloy solder paste for low-temperature sintering interconnection, comprising nano-silver-copper alloy particles, micron silver particles and an organic carrier. In terms of mass percentage, the nano silver copper alloy particles account for 65%, the micron silver particles account for 10%, and the organic carrier accounts for 25%.
[0049] Step S1: the Cu(NO 3 ) 2 and AgNO 3 As a precursor, the silver-copper molar ratio in the preparation of nano-silver-copper alloy is 6:1, which is dissolved in deionized water according to a certain ratio, which is recorded as solution A;
[0050] Step S2: Dissolve polyvinylpyrrolidone with a molecular weight of 150,000 in deionized water at a molar ratio of 5:1 to the precursor, which is referred to as solution B.
[0051] Step S3: Dissolve sodium borohydride in deionized water to a concentration of 3 mol / L, which is referred to as solution C.
[0052] Step S4: Pour solution A and solution B in...
Embodiment 3
[0058] A micro-nano composite silver-copper alloy solder paste for low-temperature sintering interconnection, comprising nano-silver-copper alloy particles, micron silver particles and an organic carrier. In terms of mass percentage, the nano-silver-copper alloy particles account for 70%, the micro-silver particles account for 18%, and the organic carrier accounts for 32%.
[0059] Step S1: the Cu(NO 3 ) 2 and AgNO 3 As a precursor, the silver-copper molar ratio in the preparation of nano-silver-copper alloy is 6:1, which is dissolved in deionized water according to a certain ratio, which is recorded as solution A;
[0060] Step S2: Sodium citrate was dissolved in deionized water, and the molar ratio of it to the precursor was 10:1, which was recorded as solution B.
[0061] Step S3: Dissolve sodium borohydride in deionized water to a concentration of 3 mol / L, which is referred to as solution C.
[0062] Step S4: Pour solution A and solution B into the container and mix ev...
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