A kind of micro-nano composite silver-copper alloy solder paste for low-temperature sintering interconnection and preparation method thereof

A silver-copper alloy and low-temperature sintering technology, which is applied in the field of device packaging, can solve problems such as cracks in pure nano-solder paste, and achieve the effects of simple preparation methods, reduced costs, and delayed electrical/thermal migration

Active Publication Date: 2022-06-03
HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The purpose of the present invention is to provide a micro-nano composite silver-copper alloy solder paste and preparation method for low-temperature sintering interconnection, aiming at replacing traditional Sn-based solder, and solving the electromigration problem of silver and the anti-oxidation problem of copper, And the crack problem of pure nano-solder paste in the sintering process
At the same time, the method of combining micro and nano particles solves the problem of large volume shrinkage of pure nano solder paste during sintering, which is beneficial to increase production and is suitable for mass production

Method used

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  • A kind of micro-nano composite silver-copper alloy solder paste for low-temperature sintering interconnection and preparation method thereof
  • A kind of micro-nano composite silver-copper alloy solder paste for low-temperature sintering interconnection and preparation method thereof
  • A kind of micro-nano composite silver-copper alloy solder paste for low-temperature sintering interconnection and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] A micro-nano composite silver-copper alloy solder paste for low-temperature sintering interconnection comprises nano-silver-copper alloy particles, micro-silver particles and an organic carrier. In terms of mass percentage, the nano-silver-copper alloy particles account for 50%, the micro-silver particles account for 20%, and the organic carrier accounts for 30%.

[0038] Step S1: the Cu(NO 3 ) 2 and AgNO 3 As a precursor, the silver-copper molar ratio in the preparation of nano-silver-copper alloy is 4:1, which is dissolved in deionized water according to a certain ratio, and is recorded as solution A;

[0039] Step S2: Dissolve polyvinylpyrrolidone with a molecular weight of 15,000 in deionized water, and the molar ratio of the polyvinylpyrrolidone to the precursor is 5:1, which is referred to as solution B.

[0040] Step S3: Dissolving sodium borohydride in deionized water, the concentration is 3 mol / L, and denoted as solution C.

[0041] Step S4: Pour the A solu...

Embodiment 2

[0048] A micro-nano composite silver-copper alloy solder paste for low-temperature sintering interconnection comprises nano-silver-copper alloy particles, micro-silver particles and an organic carrier. In terms of mass percentage, the nano-silver-copper alloy particles account for 65%, the micro-silver particles account for 10%, and the organic carrier accounts for 25%.

[0049] Step S1: the Cu(NO 3 ) 2 and AgNO 3 As a precursor, the silver-copper molar ratio in the preparation of nano-silver-copper alloy is 6:1, which is dissolved in deionized water according to a certain ratio, and is recorded as solution A;

[0050] Step S2: Dissolve polyvinylpyrrolidone with a molecular weight of 150,000 in deionized water, and the molar ratio of the polyvinylpyrrolidone to the precursor is 5:1, which is referred to as solution B.

[0051] Step S3: Dissolving sodium borohydride in deionized water, the concentration is 3 mol / L, and denoted as solution C.

[0052] Step S4: Pour the A sol...

Embodiment 3

[0058] A micro-nano composite silver-copper alloy solder paste for low-temperature sintering interconnection comprises nano-silver-copper alloy particles, micro-silver particles and an organic carrier. In terms of mass percentage, the nano-silver-copper alloy particles account for 70%, the micro-silver particles account for 18%, and the organic carrier accounts for 32%.

[0059] Step S1: the Cu(NO 3 ) 2 and AgNO 3 As a precursor, the silver-copper molar ratio in the preparation of nano-silver-copper alloy is 6:1, which is dissolved in deionized water according to a certain ratio, and is recorded as solution A;

[0060] Step S2: Dissolve sodium citrate in deionized water, and the molar ratio of the sodium citrate to the precursor is 10:1, denoted as solution B.

[0061] Step S3: Dissolving sodium borohydride in deionized water, the concentration is 3 mol / L, and denoted as solution C.

[0062] Step S4: Pour the A solution and the B solution into the container and mix them ev...

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Abstract

The invention provides a micro-nano composite silver-copper alloy solder paste for low-temperature sintering interconnection and a preparation method thereof. The preparation method comprises: mixing a certain proportion of organic solvent, thickener, dispersant, coupling The agent is uniformly mixed as the organic carrier of the micro-nano composite silver-copper alloy solder paste; then the nano-silver-copper alloy and micron silver particles prepared by the chemical reduction method are uniformly mixed with a certain amount of organic carrier to obtain the product. The present invention adopts the principle of solid solution alloy, and copper atoms are doped in the silver phase to obtain silver-copper alloy particles with a single phase; the problem of copper oxidation is solved, and at the same time, the doping of copper atoms reduces the diffusion rate of atoms, and solves the problem of It solves the problem of large volume shrinkage of pure nano-solder paste in the sintering process, and at the same time helps to reduce costs and increase production, and is suitable for mass production. This invention can replace the traditional Sn-based solder and pure nano-Ag paste for the low-temperature connection of the third-generation semiconductor, and has higher reliability.

Description

technical field [0001] The invention relates to the field of device packaging, and more particularly, designs a micro-nano composite silver-copper alloy solder paste for low-temperature sintering interconnection and a preparation method. Background technique [0002] With the rapid development of electronic science and technology, electronic components are developing towards high power and miniaturization. Especially in the field of packaging, with the emergence of third-generation semiconductor materials such as SiC and GaN, devices need to serve under high temperature and high current, which puts forward higher requirements for chip interconnect materials. Therefore, the development of new packaging materials for low-temperature connection and high-temperature service is of great significance to the development and application of third-generation semiconductors. [0003] Traditional Sn-based solders are widely used because they can be joined at lower temperatures. Howeve...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/02B23K35/30B23K35/362
CPCB23K35/025B23K35/3006B23K35/302B23K35/362
Inventor 李明雨杨婉春郑威祝温泊王春青
Owner HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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