A kind of micro-nano composite silver-copper alloy solder paste for low-temperature sintering interconnection and preparation method thereof
A silver-copper alloy and low-temperature sintering technology, which is applied in the field of device packaging, can solve problems such as cracks in pure nano-solder paste, and achieve the effects of simple preparation methods, reduced costs, and delayed electrical/thermal migration
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0037] A micro-nano composite silver-copper alloy solder paste for low-temperature sintering interconnection comprises nano-silver-copper alloy particles, micro-silver particles and an organic carrier. In terms of mass percentage, the nano-silver-copper alloy particles account for 50%, the micro-silver particles account for 20%, and the organic carrier accounts for 30%.
[0038] Step S1: the Cu(NO 3 ) 2 and AgNO 3 As a precursor, the silver-copper molar ratio in the preparation of nano-silver-copper alloy is 4:1, which is dissolved in deionized water according to a certain ratio, and is recorded as solution A;
[0039] Step S2: Dissolve polyvinylpyrrolidone with a molecular weight of 15,000 in deionized water, and the molar ratio of the polyvinylpyrrolidone to the precursor is 5:1, which is referred to as solution B.
[0040] Step S3: Dissolving sodium borohydride in deionized water, the concentration is 3 mol / L, and denoted as solution C.
[0041] Step S4: Pour the A solu...
Embodiment 2
[0048] A micro-nano composite silver-copper alloy solder paste for low-temperature sintering interconnection comprises nano-silver-copper alloy particles, micro-silver particles and an organic carrier. In terms of mass percentage, the nano-silver-copper alloy particles account for 65%, the micro-silver particles account for 10%, and the organic carrier accounts for 25%.
[0049] Step S1: the Cu(NO 3 ) 2 and AgNO 3 As a precursor, the silver-copper molar ratio in the preparation of nano-silver-copper alloy is 6:1, which is dissolved in deionized water according to a certain ratio, and is recorded as solution A;
[0050] Step S2: Dissolve polyvinylpyrrolidone with a molecular weight of 150,000 in deionized water, and the molar ratio of the polyvinylpyrrolidone to the precursor is 5:1, which is referred to as solution B.
[0051] Step S3: Dissolving sodium borohydride in deionized water, the concentration is 3 mol / L, and denoted as solution C.
[0052] Step S4: Pour the A sol...
Embodiment 3
[0058] A micro-nano composite silver-copper alloy solder paste for low-temperature sintering interconnection comprises nano-silver-copper alloy particles, micro-silver particles and an organic carrier. In terms of mass percentage, the nano-silver-copper alloy particles account for 70%, the micro-silver particles account for 18%, and the organic carrier accounts for 32%.
[0059] Step S1: the Cu(NO 3 ) 2 and AgNO 3 As a precursor, the silver-copper molar ratio in the preparation of nano-silver-copper alloy is 6:1, which is dissolved in deionized water according to a certain ratio, and is recorded as solution A;
[0060] Step S2: Dissolve sodium citrate in deionized water, and the molar ratio of the sodium citrate to the precursor is 10:1, denoted as solution B.
[0061] Step S3: Dissolving sodium borohydride in deionized water, the concentration is 3 mol / L, and denoted as solution C.
[0062] Step S4: Pour the A solution and the B solution into the container and mix them ev...
PUM
Property | Measurement | Unit |
---|---|---|
particle diameter | aaaaa | aaaaa |
particle diameter | aaaaa | aaaaa |
particle diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com