A kind of micro-nano composite silver-copper alloy solder paste for low-temperature sintering interconnection and preparation method thereof

A silver-copper alloy and low-temperature sintering technology, which is applied in the field of device packaging, can solve problems such as cracks in pure nano-solder paste, and achieve the effects of simple preparation methods, reduced costs, and delayed electrical/thermal migration
CN112756841BActive Publication Date: 2022-06-03HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
Publication Date
2022-06-03

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Abstract

The invention provides a micro-nano composite silver-copper alloy solder paste for low-temperature sintering interconnection and a preparation method thereof. The preparation method comprises: mixing a certain proportion of organic solvent, thickener, dispersant, coupling The agent is uniformly mixed as the organic carrier of the micro-nano composite silver-copper alloy solder paste; then the nano-silver-copper alloy and micron silver particles prepared by the chemical reduction method are uniformly mixed with a certain amount of organic carrier to obtain the product. The present invention adopts the principle of solid solution alloy, and copper atoms are doped in the silver phase to obtain silver-copper alloy particles with a single phase; the problem of copper oxidation is solved, and at the same time, the doping of copper atoms reduces the diffusion rate of atoms, and solves the problem of It solves the problem of large volume shrinkage of pure nano-solder paste in the sintering process, and at the same time helps to reduce costs and increase production, and is suitable for mass production. This invention can replace the traditional Sn-based solder and pure nano-Ag paste for the low-temperature connection of the third-generation semiconductor, and has higher reliability.
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Description

technical field

[0001] The invention relates to the field of device packaging, and more particularly, designs a micro-nano composite silver-copper alloy solder paste for low-temperature sintering interconnection and a preparation method. Background technique

[0002] With the rapid development of electronic science and technology, electronic components are developing towards high power and miniaturization. Especially in the field of packaging, with the emergence of third-generation semiconductor materials such as SiC and GaN, devices need to serve under high temperature and high current, which puts forward higher requirements for chip interconnect materials. Therefore, the development of new packaging materials for low-temperature connection and high-temperature service is of great significance to the development and application of third-generation semiconductors.

[0003] Traditional Sn-based solders are widely used because they can be joined at lower temperatures. Howeve...

Claims

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