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Low-frequency low-dielectric-loss electronic ceramic material and preparation method thereof

A technology of electronic ceramics and ceramic materials, applied in the field of ceramic materials, can solve the problems of not being able to meet low dielectric loss and low frequency performance at the same time, the production steps of dielectric ceramic materials are cumbersome, affecting the conductivity of ceramic materials, etc. Loss performance, excellent low frequency characteristics, the effect of improving the service life

Inactive Publication Date: 2021-05-11
长沙华脉新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Electronic ceramic materials in the prior art cannot achieve low frequency, that is, the shortcoming of satisfying high dielectric constant and low dielectric loss performance at the same time, and plasticizers, crosslinking agents, initiators and other substances are added in the production process, which is easy to affect The electrical conductivity of ceramic materials, such as the dielectric ceramic material disclosed in Chinese patent application document 201810254627.8, is cumbersome and requires steps such as dissolving, mixing, stirring, filtering, and recycling, and cannot meet the requirements of low dielectric loss and low frequency performance at the same time. Happening

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  • Low-frequency low-dielectric-loss electronic ceramic material and preparation method thereof
  • Low-frequency low-dielectric-loss electronic ceramic material and preparation method thereof

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Embodiment 1

[0037]The low frequency and low dielectric loss electronic ceramic material provided in this embodiment is a multilayer ceramic material with an outer layer and an inner layer. The inner layer is a ceramic material with a perovskite space structure, and the molecular formula of the inner layer ceramic material is Pb 0.75 Bi 0.25 Fe 0.6 W 0.4 o 3 , wherein the ceramic material has a perovskite spatial structure, and the outer layer is divided into SiN-Cr formed by plasma spraying 3 C 2 - Ti composite film layer.

[0038] The inner layer Pb provided by this embodiment 0.75 Bi 0.25 Fe 0.6 W 0.4 o 3 The ceramic material of the perovskite spatial structure, by weight component, includes the following components:

[0039] 35 parts of PbO;

[0040] Bi 2 o 3 15 copies;

[0041] Fe 2 o 3 20 copies;

[0042] WO 3 30 copies;

[0043] 60 parts of polyvinyl acetate.

[0044] Inner Pb 0.75 Bi 0.25 Fe 0.6 W 0.4 o 3 A method for preparing a ceramic material with a ...

Embodiment 2

[0054] The low frequency and low dielectric loss electronic ceramic material provided in this embodiment is a multilayer ceramic material with an outer layer and an inner layer. The inner layer is a ceramic material with a perovskite space structure, and the molecular formula of the inner layer ceramic material is Pb 0.6 Ti 0.4 Zr 0.75 Nb 0.25 o 3 , the outer layer is divided into SiN-Cr formed by plasma spraying 3 C 2 - Ti composite film layer.

[0055] The inner layer Pb provided by this embodiment 0.6 Ti 0.4 Zr 0.75 Nb 0.25 o 3 The ceramic material of the perovskite spatial structure, by weight component, includes the following components:

[0056] 30 parts of PbO;

[0057] TiO 2 17.5 copies;

[0058] ZrO 2 25 copies;

[0059] Nb 2 o 5 35 copies;

[0060] 70 parts of polyvinyl alcohol.

[0061] Inner Pb 0.6 Ti 0.4 Zr 0.75 Nb 0.25 o 3 A method for preparing a ceramic material with a perovskite spatial structure, comprising the following steps:

[...

Embodiment 3

[0071] The low frequency and low dielectric loss electronic ceramic material provided in this embodiment is a multilayer ceramic material with an outer layer and an inner layer. The inner layer is a ceramic material with a perovskite space structure, and the molecular formula of the inner layer ceramic material is Pb 0.7 Ba 0.3 Mg 0.55 V 0.65 o 3 , the outer layer is divided into SiN-Cr formed by plasma spraying 3 C 2 - Ti composite film layer.

[0072] The inner layer Pb provided by this embodiment 0.7 Ba 0.3 Mg 0.55 V 0.65 o3 The ceramic material of the perovskite spatial structure, by weight component, includes the following components:

[0073] 42 parts of PbO;

[0074] BaO 18.5 parts;

[0075] MgO 27.5 parts;

[0076] V 2 o 5 38 copies;

[0077] 77 parts of polyethylene glycol.

[0078] The above inner layer Pb 0.7 Ba 0.3 Mg 0.55 V 0.65 o 3 A method for preparing a ceramic material with a perovskite spatial structure, comprising the following steps: ...

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Abstract

The invention discloses a low-frequency low-dielectric-loss electronic ceramic material and a preparation method thereof. The ceramic material is obtained by packaging through a low-temperature co-firing technology, is a multi-layer ceramic material and is provided with an outer layer and an inner layer, the inner layer is a ceramic material with a perovskite space structure, and the molecular formula of the inner layer is Pb1-xAxByC1-yO3; and the outer layer is a SiN-Cr3C2-Ti composite film layer which is formed by plasma spraying. The electronic ceramic material provided by the invention has a single-crystal-phase perovskite structure and has positive ions in ordered arrangement at 1: 1B sites, so that the synthesized ceramic material has the characteristic of space charge polarization of a lead-based system, the material follows a non-Debye relaxation process, and polaron carriers exist in a conductive process; the ceramic material has excellent low-frequency characteristic, low dielectric loss performance and high temperature stability, a one-time solid synthesis method is adopted, the operation steps are reduced, the operation process is simplified, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the field of ceramic materials, in particular to an electronic ceramic material with low frequency and low dielectric loss. Background technique [0002] Dielectric material is a high-tech functional material with fierce international competition. It is widely used in many fields such as capacitors, memories, and microelectronic components. With the rapid development of electronic information technology, the integration, miniaturization and high speed of electronic components have become an important research topic in the field of modern information. It can be said that the research and development of high-performance dielectric materials determines the future development potential of electronic components. [0003] In the field of wireless communication, since the wireless channel resources of lower frequencies are basically divided, and interference easily occurs between wireless devices working in the low frequency band. D...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/01C04B41/88
CPCC04B35/01C04B41/009C04B41/5133C04B41/88C04B2235/3258C04B2235/3272C04B2235/3296C04B2235/3298C04B2235/96C04B41/5057C04B41/5066C04B41/4505
Inventor 邓珊袁武
Owner 长沙华脉新材料有限公司