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Preparation method of silicon dioxide powder filler, powder filler obtained through preparation method and application of powder filler

A technology for silica and powder fillers, which is applied in the preparation of silica powder fillers and in the field of powder fillers, and can solve the problem that the dielectric constant cannot meet the requirements of small-sized communication equipment.

Pending Publication Date: 2021-05-18
ZHEJIANG THIRD AGE MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problems that the dielectric constant of the known fillers in the above-mentioned prior art cannot meet the requirements of small-sized communication equipment, the present invention provides a preparation method of silica powder filler, the powder filler obtained therefrom and its application

Method used

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  • Preparation method of silicon dioxide powder filler, powder filler obtained through preparation method and application of powder filler
  • Preparation method of silicon dioxide powder filler, powder filler obtained through preparation method and application of powder filler
  • Preparation method of silicon dioxide powder filler, powder filler obtained through preparation method and application of powder filler

Examples

Experimental program
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Effect test

example 1

[0030] Take a certain weight part of deionized water at room temperature, disperse commercially available barium titanate with an average particle size of 0.3 microns in water, put it into a reaction kettle with a stirrer, start stirring, and add 80 parts by weight of methyl trimethoxy silane was stirred for 1 hour. After methyltrimethoxysilane was dissolved, 25 parts by weight of 5% ammonia water was added and stirred for 10 seconds, then the stirring was stopped. After resting for 1 hour, filter and dry to obtain a spherical powder. Put the powder into a muffle furnace and slowly raise the temperature, discharge the organic matter in an oxygen-containing atmosphere, raise the temperature to 1000 degrees, and calcinate for 6 hours to obtain a spherical barium titanate-containing silicon dioxide powder. The analytical results of the samples are listed in Table 1 below:

[0031] Table 1

[0032]

[0033] Electron microscope and EDX analyze the result of embodiment 1-3 as ...

example 2

[0035] Take a certain weight part of deionized water at room temperature, disperse commercially available titanium oxide with an average particle size of 0.38 microns in water, put it into a reaction kettle with a stirrer, start stirring, and add 75 parts by weight of methyl trimethoxy The silane and 5 parts by weight of tetraethoxysilane were stirred for 1 hour. After methyltrimethoxysilane and tetraethoxysilane were dissolved, 25 parts by weight of 5% ammonia water was added and stirred for 10 seconds, then the stirring was stopped. After resting for 1 hour, it was filtered and dried to obtain a powder. Put the powder into a muffle furnace and slowly raise the temperature, discharge the organic matter in an oxygen-containing atmosphere, raise the temperature to 850°C, and calcinate for 12 hours to obtain a silicon dioxide powder containing titanium oxide. The analysis results of the samples are listed in Table 2 below:

[0036] Table 2

[0037]

[0038] Electron microsco...

example 3

[0040] Take a certain weight part of deionized water at room temperature, disperse commercially available calcium titanate with an average particle size of 2 microns in the water, put it into a reaction kettle with a stirrer, start stirring, and add 78 parts by weight of methyl trichloride The silane and 2 parts by weight of dimethyldichlorosilane were stirred for 1 hour. The volume fraction of calcium titanate is 30%. The contents were filtered, washed with water and dried. The white solid was pulverized with a pulverizer to obtain an angular powder with an average particle size of 50. Put the aggregated powder into a muffle furnace and slowly raise the temperature, discharge the organic matter in an oxygen-containing atmosphere, raise the temperature to 1000°C, and calcinate for 12 hours to obtain the calcium titanate-containing angular silica powder of Example 5. The average particle size of the samples was 42 microns. The result of electron microscope and EDX analysis, ...

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Abstract

The invention relates to a preparation method of a silicon dioxide powder filler, which comprises the following steps: dispersing high-dielectric-constant powder in an aqueous solution, adding R1SiX3 into the aqueous solution for hydrolytic condensation to provide polysiloxane powder which is polysiloxane containing a T unit and containing the high-dielectric-constant powder, wherein the particle size of the high-dielectric-constant powder is smaller than that of polysiloxane; and calcining the polysiloxane powder in an oxygen-containing atmosphere at the calcining temperature of 850-1200 DEG C to obtain the silicon dioxide powder filler containing the high-dielectric-constant powder inside. The invention also provides the silicon dioxide powder filler prepared by the preparation method and application of the silicon dioxide powder filler. According to the preparation method of the silicon dioxide powder filler, the silicon dioxide powder filler containing the high-dielectric-constant powder can be obtained, and the silicon dioxide powder filler has a high dielectric constant due to the high-dielectric-constant powder contained in the silicon dioxide powder filler and meets the requirements of small-size communication equipment.

Description

technical field [0001] The invention relates to circuit board and antenna packaging, and more particularly relates to a preparation method of silicon dioxide powder filler, the obtained powder filler and application thereof. Background technique [0002] In the field of 5G communication, it is necessary to use radio frequency devices to assemble equipment, high density interconnect (HDI), high frequency and high speed boards and motherboards and other circuit boards. These circuit boards are generally composed of epoxy resin, aromatic polyether, fluororesin and other organic polymers and fillers. The fillers are mainly angular or spherical silica, and their main function is to reduce the thermal expansion coefficient of organic polymers. The existing fillers use spherical or angular silica for compact packing and grading. [0003] As technology advances, communication devices are getting smaller and smaller. Antennas that are indispensable in communication equipment are al...

Claims

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Application Information

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IPC IPC(8): C08K3/36C08K3/24C08K3/22C08K9/10C08K9/06
CPCC08K3/36C08K3/24C08K3/22C08K9/10C08K9/06C08K2003/2241C08K2003/2237C08G77/06C08L83/04B01J6/001C08G77/398C08K2201/005
Inventor 李文黄江波王珂张大伟
Owner ZHEJIANG THIRD AGE MATERIAL TECH CO LTD