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Two-phase flow active-passive type multi-level data center cabinet heat dissipation device and method

A technology for data centers and cooling devices, applied in cooling/ventilation/heating renovation, electrical components, electrical equipment structural components, etc. The effect of heat dissipation

Active Publication Date: 2021-05-25
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] Technical problem: Aiming at the problems of difficult integration of heat dissipation of data center cabinets, low energy efficiency and low degree of automation, the present invention proposes a two-phase flow active and passive heat dissipation device and method for data center cabinets, and adjusts the heat dissipation mode according to different working states of data center cabinets. So as to achieve low energy consumption and automatic control of heat dissipation

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  • Two-phase flow active-passive type multi-level data center cabinet heat dissipation device and method
  • Two-phase flow active-passive type multi-level data center cabinet heat dissipation device and method
  • Two-phase flow active-passive type multi-level data center cabinet heat dissipation device and method

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Embodiment Construction

[0039]In the two-phase motion passive multi-level data center cabinet heat dissipation device of the present invention, the data center cabinet array 1 includes a plurality of data center enclosures 2, and each data center cabinet 2 includes a plurality of blade server motherboard 17, each blade. Server motherboard 17's rack-level loop thermostat 11 cascade and connected to the thermostapiratulatory cooling work body inlet pipe 12 and thermostapiratulatory cooling works Dipping pipe 13; Each cabinet is thermographed by intravenous drying works in the inlet pipe 12 and the thermostap pipe The cooling works export pipe 13 is connected to and other components by a liquid conduit; the cabinet condensed device 3 of the cabinet of the cabinet on each rack-level loop is located on the condensed water inlet pipe 14 and the condensed water outlet pipe 15 The reservoir 6 and the reservoir 7 of the cooling work body in the cooling work body have a gas space, and the gas manifold 9-2 is connect...

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Abstract

The invention provides a two-phase flow active-passive type multi-level data center cabinet heat dissipation device and method. A system level structure comprises a cabinet heat dissipation device, a condensate water system, a waste heat recovery device, a liquid storage device, a liquid pump, a gas chamber, a fluid working medium and corresponding pipelines. The structure forms a closed loop, the loop is filled with nitrogen to keep a low-pressure state, and a liquid pump drives pipeline fluid to flow. The gas chamber keeps the gas pressure in the two-phase flow loop relatively stable; the liquid storage device is communicated with the gas chamber, so that enough gas space for enabling phase change to easily occur is provided; the cabinet heat dissipation device can switch an active mode and a passive mode so as to achieve PUE minimization under the good heat dissipation capability. The condensate water system is independent of the loop and provides a cold source for the condensation end of the rack-level thermosiphon. The waste heat recovery device recovers waste heat and keeps the temperature of the working medium at the inlet of the thermosiphon stable. The device has the advantages of high integration level, automatic control, multi-stage structure heat dissipation and excellent energy efficiency ratio.

Description

Technical field[0001]The present invention relates to a heat dissipation apparatus and method, and more particularly to a two-phase motion passive multi-hierarchical data center cabinet heat dissipation apparatus and method, which belongs to the technical field of radiopaterials.Background technique[0002]With the rapid development of cloud computing business, the scale of data center has gradually increased, and the heat generation of the blade server in the data center cabinet is getting larger, and the number of electronic devices, especially the CPU integrated collective tube, in order to ensure the normal operation of electronic equipment, These heat require efficient delivery, therefore, the heat dissipation system of the data center cabinet has the need for updating to match higher cooling requirements; in addition, the high cooling requirements of the data center cabinet server will also increase the Pue (Powerusage Effectiveness, Electrical Power Utilization) Efficiency) val...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20736H05K7/20818H05K7/20836H05K7/20781H05K7/20245H05K7/20318H05K7/20327
Inventor 刘旭杜俊明姜海涛张程宾殷东平
Owner SOUTHEAST UNIV
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