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Data line interface welding process and preparation method thereof

A technology of data line interface and welding process, applied in welding equipment, welding medium, metal processing equipment, etc., to achieve the effect of uniform solder joints, low corrosion, and conducive to storage

Active Publication Date: 2021-06-01
广西和正电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the shortcomings and deficiencies in the prior art, the object of the present invention is to provide a welding process for data line interface, which is easy to operate and easy to control. High production efficiency, save manpower and material resources, and the welding effect is good, the size of each solder joint is uniform, the solder joints will not contact each other and short circuit, and the phenomenon of "false welding" is not easy to appear, the welding yield is high, the product stability is good, and it is conducive to industrialization mass production

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A data line interface welding process, comprising the steps of:

[0027] (1) Coat the surface of the connector of the data line with the first solder paste layer, make the connector of the data line in a straightened state, and slide it on the guide;

[0028] (2) Fill the guide slot of the data interface connector with solder paste to form a second solder paste layer, slide the data interface connector coated with the second solder paste layer on the guide, and the data interface connector and The connector of the data line does not touch; push the data interface connector so that the guide slot of the data interface connector contacts the connector of the data line;

[0029] (3) Push the data interface connector to slide in the guide groove of the data interface connector, so that the first solder paste layer and the second solder paste layer contact each other until the connector of the data line and the guide groove of the data interface connector Complete contact, ...

Embodiment 2

[0042] In this embodiment, in the step (1), both the first solder paste layer and the second solder paste layer are made of solder paste, the solder paste includes alloy powder and flux, and the alloy powder and flux The weight ratio of flux is 8:1.

[0043] Further, in the step (1), the flux includes the following raw materials in parts by weight: 15 parts of composite activator, 3 parts of fatty acid monoglyceride, 1.5 parts of 5-hydroxydodecanoic acid glyceride, polyoxyethylene fat 1.5 parts of alcohol ether, 2 parts of 1-aminopropyl-3-methylimidazole nitrate, 75 parts of solvent.

[0044] Further, the solvent is composed of ethanol and tripropylene glycol butyl ether in a weight ratio of 1:1.

[0045] Further, the preparation method of each part of the composite active agent comprises the following steps: in parts by weight, after mixing 3 parts of oxalic acid, 2 parts of hexadecanedioic acid, and 1.5 parts of dibromobutenediol, pulverize until the particle size is below...

Embodiment 3

[0053] In this embodiment, in the step (1), both the first solder paste layer and the second solder paste layer are made of solder paste, the solder paste includes alloy powder and flux, and the alloy powder and flux The weight ratio of flux is 9:1.

[0054] Further, in the step (1), the flux includes the following raw materials in parts by weight: 20 parts of composite activator, 5 parts of fatty acid monoglyceride, 2.5 parts of 5-hydroxydodecanoic acid glyceride, polyoxyethylene fat 2.5 parts of alcohol ether, 4 parts of 1-aminopropyl-3-methylimidazole nitrate, 85 parts of solvent.

[0055] Further, the solvent is composed of ethanol and isopropanol in a weight ratio of 2:1.

[0056] Further, the preparation method of each part of the composite active agent comprises the following steps: in parts by weight, after mixing 5 parts of oxalic acid, 4 parts of hexadecanedioic acid, and 2.5 parts of dibromobutenediol, pulverize until the particle size is below 5 μm, and then adde...

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Abstract

The invention relates to the technical field of welding, in particular to a data line interface welding process. The process comprises the following steps of (1) coating a first solder paste layer on the surface of a connector of a data line, and arranging the connector on a guide piece in a sliding manner; (2) arranging a data interface connector coated with a second solder paste layer on the guide piece in a sliding manner; pushing the data interface connector, so that a guide sheet groove of the data interface connector is in contact with the connector of the data line; (3) enabling the first solder paste layer and the second solder paste layer to be in contact with each other until the connector of the data line is in complete contact with the guide sheet groove of the data interface connector; and (4) welding a conductive wire of the data line and the guide sheet groove of the data interface connector together by adopting infrared heating. The welding process is easy and convenient to operate, easy to control, high in production efficiency, capable of saving manpower and material resources, good in welding effect, uniform in welding spots, free of short circuit caused by mutual contact between the welding spots, not prone to false welding, high in welding yield and good in product stability.

Description

technical field [0001] The invention relates to the field of welding technology, in particular to a data line interface welding process and a preparation method thereof. Background technique [0002] With the development of the economy and the progress of science and technology, electronic products have increasingly occupied a very important position in industrial production and people's daily life. People often use data lines for power and data transmission. However, in the current technology, manual welding is often used to connect the data interface connector and the data line, the welding efficiency is low, the solder joints are of different sizes, uneven, poor welding performance, unstable product quality, and low yield rate, which affects product quality. and service life. Contents of the invention [0003] In order to overcome the shortcomings and deficiencies existing in the prior art, the object of the present invention is to provide a data line interface weldin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/00B23K1/005B23K35/26B23K35/363
CPCB23K1/0008B23K1/0056B23K35/262B23K35/3613B23K2101/36
Inventor 朱若容
Owner 广西和正电子有限公司
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