Thermosensitive semiconductor ceramic material and preparation method thereof

A heat-sensitive semiconductor and ceramic material technology, applied in the field of heat-sensitive semiconductor ceramic materials and their preparation

Inactive Publication Date: 2021-06-01
深圳市涌苹科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the above-mentioned technical problems, the object of the present invention is to provide a heat-sensitive semiconductor ceramic material and a preparation method thereof: by pre-preparing copper oxide, ferric oxide, cobalt oxide, nickel oxide, mullite, and quartz sand respectively Mix after burning, and then add it to the ball mill for wet ball milling to obtain the mixed slurry, add the mixed slurry to the conveyor belt of the slurry drying equipment, start the conveyor to transfer the mixed slurry to the spreading box through the conveyor belt During transportation, when the mixed slurry enters the inner cavity of the spreading box, close the conveyor, start the drive motor, and the drive motor runs through the rotating roller to drive the conveyor belt, thereby driving the first slider to move on the first slide rail through the fixed splint , so that the connecting frame moves on the installation box, and the lifting cylinder is started. The movable rod of the lifting cylinder shrinks through the guide column to make the flat scraper plate fall on the mixed slurry, and the flat scraper plate continues to move left and right, and the mixed slurry Lay it on the conveyor belt, start the conveyor, convey the conveyor belt with the mixed slurry to the drying box, stop the conveyor, repeatedly spread the mixed slurry in the spreading box, and adjust the motor operation in the drying box Drive the threaded rod, because the threaded rod is threaded with the threaded seat, it will drive the mounting plate to move downwards, thereby driving the heating box to move downwards, start the heating tube, and the heating tube will release heat to dry the mixed slurry on the conveyor belt , start the conveyor, when the conveyor belt moves forward to the end, the dry mixed slurry on it is broken and falls into the storage box, and the remaining dry mixed slurry on it is scraped off by the baffle plate and dropped into the storage box, After all the mixed slurry is dried and collected into the storage box, the dried mixed slurry is taken out and placed in a pulverizer, and the heat-sensitive semiconductor ceramic material is obtained after sieving, which solves the problem of the existing heat-sensitive semiconductor ceramic material. The slurry obtained after grinding the raw material of the material takes a long time to dry, and the drying efficiency is low, which leads to the problem of low production efficiency of heat-sensitive semiconductor ceramic materials

Method used

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  • Thermosensitive semiconductor ceramic material and preparation method thereof
  • Thermosensitive semiconductor ceramic material and preparation method thereof
  • Thermosensitive semiconductor ceramic material and preparation method thereof

Examples

Experimental program
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Embodiment 1

[0043] see Figure 1-6 As shown, the present embodiment is a heat-sensitive semiconductor ceramic material, comprising the following components in parts by weight:

[0044] 30 parts of copper oxide, 15 parts of ferric oxide, 8 parts of cobalt oxide, 8 parts of nickel oxide, 7 parts of mullite, and 3 parts of quartz sand.

[0045] A method for preparing a heat-sensitive semiconductor ceramic material, comprising the following steps:

[0046] Step 1: Pre-fire copper oxide, ferric oxide, cobalt oxide, nickel oxide, mullite, and quartz sand in a high-temperature sintering furnace, control the pre-fire temperature at 600°C, and control the pre-fire time for 2 hours, and then sinter The final product is mixed to obtain a mixed raw material;

[0047] Step 2: adding the mixed raw materials into a ball mill for wet ball milling, controlling the ratio of the mixed raw materials to water to 1:0.8, and controlling the ball milling time to 40 hours to obtain a mixed slurry;

[0048] Ste...

Embodiment 2

[0054] see Figure 1-6 As shown, the present embodiment is a heat-sensitive semiconductor ceramic material, comprising the following components in parts by weight:

[0055] 50 parts of copper oxide, 25 parts of ferric oxide, 12 parts of cobalt oxide, 12 parts of nickel oxide, 9 parts of mullite, and 7 parts of quartz sand.

[0056] A method for preparing a heat-sensitive semiconductor ceramic material, comprising the following steps:

[0057] Step 1: Pre-fire copper oxide, ferric oxide, cobalt oxide, nickel oxide, mullite, and quartz sand in a high-temperature sintering furnace, control the pre-fire temperature to 1200°C, control the pre-fire time for 4 hours, and then sinter The final product is mixed to obtain a mixed raw material;

[0058] Step 2: adding the mixed raw materials into a ball mill for wet ball milling, controlling the ratio of the mixed raw materials to water to 1:1.2, and controlling the ball milling time to 60 hours to obtain a mixed slurry;

[0059] Step...

Embodiment 3

[0065] see Figure 1-6 As shown, the slurry drying equipment in this embodiment includes an installation base 101, a conveyor 102, a spreading box 103, a drying box 104, a storage box 105, a baffle plate 106, a blower 107, a scraping hopper 108, and an installation box 109, the top of the installation pedestal 101 is embedded with a conveyor 102, the top of the installation pedestal 101 is equipped with a material spreading box 103 and a drying box 104, and the material spreading box 103 and the drying box 104 are erected on the conveyor 102, the material spreading box 103 and the drying box 104 are connected;

[0066] Above one end of the conveyor 102 is provided with a material blocking plate 106, and the material blocking plate 106 is installed on the installation base 101, and a scraping hopper 108 is arranged below the other end of the conveyor 102, and the top of the scraping hopper 108 is On the conveyor belt of the abutting conveyor 102, the scraping hopper 108 is obl...

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Abstract

The invention discloses a thermosensitive semiconductor ceramic material and a preparation method thereof. Slurry drying equipment is used, and a driving motor in a spreading box runs to realize left-right movement of a spreading scraping plate, so that mixed slurry is spread on a conveying belt to form a uniform layer, and a rapid drying effect can be achieved in a subsequent drying process, up-down movement of a heating box is achieved by adjusting operation of the motor, the drying temperature of a layer of laid mixed slurry is adjusted, the drying time and the drying effect are controllable, water vapor formed in the drying process is pumped out through an air blower, secondary moisture regaining of the dried mixed slurry is avoided, the dried mixed slurry is scraped off and collected through a scraping hopper, the position where a conveying belt scrapes off the mixed slurry is returned again to circulate the laying and drying process, the slurry drying equipment is high in automation degree, and the working efficiency of drying the mixed slurry is high, therefore the production efficiency of the thermosensitive semiconductor ceramic material is improved.

Description

technical field [0001] The invention relates to the field of semiconductor materials, in particular to a heat-sensitive semiconductor ceramic material and a preparation method thereof. Background technique [0002] Ceramic materials are a kind of inorganic non-metallic materials made of natural or synthetic compounds after molding and high-temperature calcination. At present, in the field of electronic component manufacturing, ceramic semiconductor materials have been widely used as materials with excellent semiconductor properties. Semiconducting ceramics have semiconducting properties, and the conductivity is about 10 -6 -10 5 S / m ceramics. The conductivity of semiconductor ceramics changes significantly due to changes in external conditions (temperature, light, electric field, atmosphere and temperature, etc.), so changes in physical quantities in the external environment can be converted into electrical signals and made into sensitive components for various purposes. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/45
CPCC04B35/45C04B2235/3272C04B2235/3275C04B2235/3279C04B2235/3418C04B2235/3463
Inventor 吴帆
Owner 深圳市涌苹科技有限公司
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