Low-silver lead-free solder alloy for brazing and preparation method of low-silver lead-free solder alloy
A lead-free solder and alloy technology is applied in the preparation of the solder alloy and the field of low-silver lead-free solder alloy for brazing, which can solve the problem of uneven structure and composition, increase in preparation cost, decrease in hardness and strength of solder, etc. question
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[0020] Another kind of technical solution adopted in the present invention is: a kind of preparation method of low-silver lead-free solder alloy for brazing, concrete steps are as follows:
[0021] Step 1. Take respectively Sn particles, Bi particles, Sn3.5Ag master alloys, SnCu0.7 master alloys, and SnNi0.5 master alloys with a purity of 99.99%. The above components meet the following conditions by mass percentage: the mass percentage of Sn The mass fraction of Ag is 96%-97%, the mass fraction of Ag is 0.7%-0.8%, the mass fraction of Cu is 0.5%-0.55%, the mass fraction of Bi is 1.60%-2.5%, and the mass fraction of Ni is 0.05%-0.1 %, the sum of the above components is 100%;
[0022] In step 1, the surfaces of Sn particles, Bi particles, Sn3.5Ag master alloy, SnCu0.7 master alloy and SnNi0.5 master alloy are preliminarily cleaned.
[0023] Step 2, preparing NaCl and KCl liquid eutectic salt;
[0024] The specific preparation method of step 2 is: mix NaCl and KCl according to ...
Embodiment 1
[0029] Step 1, respectively weigh Sn particles, Bi particles, Sn3.5Ag master alloy, SnCu0.7 master alloy, SnNi0.5 master alloy with a purity of 99.99%; the above components meet the following conditions by mass percentage: 96.65% Sn, 0.80% Ag, 0.50% Cu, 2.00% Bi, 0.05% Ni.
[0030] Step 2. Mix NaCl and KCl according to the molar ratio of 1:1, weigh 200g and mix evenly, put the evenly mixed NaCl and KCl mixture into a crucible and heat it to 650°C, keep it warm for 0.5h, and melt to form a liquid eutectic salt .
[0031] Step 3. Add the Sn particles, Sn3.5Ag master alloy, SnCu0.7 master alloy, Bi particles and SnNi0.5 master alloy weighed in step 1 to the liquid eutectic salt melted in step 2, and stir until the metal All were melted to obtain a melt.
[0032] Step 4. Insulate the melt obtained in step 3. During the heat preservation process, ultrasonic vibration treatment is performed on the melt. The frequency of ultrasonic vibration is 80KHz and the amplitude is 5 μm. Ult...
Embodiment 2
[0035] Step 1, respectively weigh Sn particles, Bi particles, Sn3.5Ag master alloy, SnCu0.7 master alloy, SnNi0.5 master alloy with a purity of 99.99%; the above components meet the following conditions by mass percentage: 96.15% Sn, 0.85% Ag, 0.51% Cu, 2.47% Bi, 0.02% Ni.
[0036] Step 2. Mix NaCl and KCl according to the molar ratio of 0.9:1, weigh 200g and mix evenly, put the evenly mixed NaCl and KCl mixture into a crucible and heat it to 660°C, keep it warm for 0.6h, and melt to form a liquid eutectic salt .
[0037] Step 3. Add the Sn particles, Sn3.5Ag master alloy, SnCu0.7 master alloy, Bi particles and SnNi0.5 master alloy weighed in step 1 to the liquid eutectic salt melted in step 2, and stir until the metal All were melted to obtain a melt.
[0038] Step 4. Insulate the melt obtained in step 3. During the heat preservation process, the melt is subjected to ultrasonic vibration treatment for 30 minutes. The frequency of ultrasonic vibration is 80KHz and the amplit...
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