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Thermal visbreaking protective adhesive tape and preparation process thereof

A protective tape and preparation technology, applied in the direction of adhesives, adhesive types, conductive adhesives, etc., can solve problems such as poor user experience, no antistatic, static voltage, etc., to overcome easy warping, easy peeling, The effect of small peeling static voltage

Inactive Publication Date: 2021-06-04
江苏晶华新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current thermal debonding protective film in the market is prone to produce white fog and residual glue under high temperature conditions, and has no antistatic effect, and is prone to electrostatic voltage and other adverse phenomena
This will bring a series of bad user experience

Method used

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  • Thermal visbreaking protective adhesive tape and preparation process thereof

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Embodiment Construction

[0023] The present invention will be described in detail below in conjunction with specific embodiments.

[0024] This embodiment provides a thermal detackification protective tape, which sequentially includes a release layer, an adhesive layer, and a substrate layer, and the adhesive layer includes the following components in parts by mass,

[0025] Polyacrylate 90-95 parts,

[0026] 2-4 parts of nano-scale foaming agent,

[0027] 1-3 parts of isocyanate,

[0028] 1-3 parts of antistatic agent.

[0029] The thickness of the release layer is 20-50 μm, the release force is 10-20 g, and the residual adhesive force is not less than 85%. The substrate is a PET film with a thickness of 50-75 μm, the light transmittance exceeds 90%, and the haze less than 2%.

[0030] Described nanoscale blowing agent is the one in nanoscale calcium carbonate, nanoscale magnesium carbonate, nanoscale sodium bicarbonate, and described antistatic agent is in the alkali metal salt of alkyl quaterna...

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PUM

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Abstract

The invention discloses a thermal visbreaking protective adhesive tape and a preparation process thereof, the adhesive tape sequentially comprises a release layer, an adhesive layer and a base material layer; wherein the adhesive layer comprises the following components in parts by mass: 90-95 parts of polyacrylate, 2-4 parts of a nanoscale foaming agent, 1-3 parts of isocyanate and 1-3 parts of an antistatic agent. The thermal visbreaking protective adhesive tape provided by the invention is convenient to produce and use, and the protective film has good adhesion to component materials, has a better fixing effect compared with the original visbreaking protective film on the market, and also overcomes the characteristic that the PET protective film is easy to warp. Besides, compared with similar products, the adhesive has the characteristics of low debonding temperature and short time, and can be well applied to processing of some non-temperature-resistant parts of electronic products, a protective film is easy to strip after debonding, the generated stripping static voltage is small, and electronic components cannot be broken down.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a heat-releasing protective adhesive tape and a preparation process thereof. Background technique [0002] The application of thermal debonding protective film is very extensive, especially in the cutting of wafers, the positioning and support protection of the electronics industry, and the cutting protection of glass circuit boards; LCD and TP touch panel glass thinning, grinding and polishing, can replace UV mucous membrane reduction use. The current thermal debonding protective film in the market is prone to white fog and residual glue under high temperature conditions, and has no antistatic effect, and is prone to electrostatic voltage and other adverse phenomena. This will bring a series of bad user experience. [0003] For these deficiencies, need to redesign a kind of brand-new thermal adhesive tape. Contents of the invention [0004] The object of the present inven...

Claims

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Application Information

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IPC IPC(8): C09J7/30C09J9/02C09J133/04C09J7/25
CPCC09J7/30C09J9/02C09J133/04C09J7/255C08K2201/017C09J2467/006C09J2203/326C08K5/19C08K5/42
Inventor 杨佳伟李洁周晓南
Owner 江苏晶华新材料科技有限公司